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    • 4. 发明申请
    • ENCAPSULATION AND PRODUCTION OF AN ENCAPSULATED PRINTED CIRCUIT BOARD ASSEMBLY
    • 喷涂和制作带胶印的PCB
    • WO2012031863A3
    • 2012-06-14
    • PCT/EP2011064124
    • 2011-08-17
    • SIEMENS AGEDER FLORIAN
    • EDER FLORIAN
    • H05K3/28
    • H05K3/284H05K2203/1322Y10T428/239
    • The invention relates to an improved encapsulation for a printed circuit board that is populated with electronic components, especially for a printed circuit board having electronic components that have to meet certain safety standards because they are used, e.g. in the area of explosion control. The printed circuit board assembly is coated with a bottom layer, preferably a bottom layer produced from a plasma and pretreated such that the protective coat adheres on the entire surface of the printed circuit board assembly evenly and in a sufficient thickness and does not shrink during the subsequent curing process regardless of the material of the surface and/or regardless of the fact whether the coat is applied to a geometrically problematic area on the printed circuit board assembly such as a corner or an edge.
    • 本发明涉及一种用于填充有电子部件PCB的改进的封装,特别是对那些必须符合安全标准,因为它们在防爆领域中使用的例如电子元件的电路板。 为了这个目的,组装的PCB具有胶层,优选地由涂有等离子体和预处理的子层,从而使组装印刷电路板的整个表面上的保护漆层,而不管表面和/或它是否是一个几何问题点的材料的 印刷电路板例如角落或边缘均匀地粘附并且具有足够的厚度并且在随后的固化过程中也不收缩。