专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO1998025302A1 SEMICONDUCTOR DEVICE SEALED WITH RESIN, AND ITS MANUFACTURE 审中-公开
标题翻译：用树脂密封的半导体器件及其制造
公开(公告)号：WO1998025302A1
公开(公告)日：1998-06-11
申请号：PCT/JP1997004450
申请日：1997-12-04
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD. , SAKAGUCHI, Noboru , MIYAJIMA, Yoshinori , HIZUME, Toru
发明人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
IPC分类号： H01L23/28
CPC分类号： H01L23/3107 , H01L23/3114 , H01L23/49816 , H01L2224/50 , H01L2924/3025
摘要： A semiconductor device which can improve production efficiency and also can seal exposed parts such as a lead without fail and can prevent chipping. This device possesses a semiconductor chip (10), an insulating member (20) which is bonded to the side of the face (10a), where an electrode terminal (12) is formed, of the semiconductor chip (10), a wiring pattern (30) whose one end side is formed into a land part (32) connected with the side of an external connection terminal and provided on the insulating member (20) and whose other end side is formed into a lead part (34) connected with the electrode terminal (12), and a resin-sealed part (50) which seals the face (10a) where the electrode terminal is formed, the lead (34), and the side face of the semiconductor chip (10), being filled and hardened in the gap between the face (10) where the electrode terminal is formed and a cover member (52) which is formed larger in external form than the semiconductor chip (10) so that it may cover the face (10a) where the electrode terminal is formed and the top of the lead (34) and also cover the vicinity of the outer edge of the semiconductor chip (10).
摘要翻译：一种可以提高生产效率并且还能够一次性地密封诸如导线的暴露部件的半导体器件，并且可以防止碎裂。该装置具有半导体芯片（10），与半导体芯片（10）的形成有电极端子（12）的面（10a）侧的绝缘构件（20），布线图案（30），其一端形成为与外部连接端子侧连接并设置在所述绝缘构件（20）上并且另一端侧形成为与所述绝缘构件（20）连接的引线部（34）的接地部（32）电极端子（12）和密封形成电极端子的面（10a）的树脂密封部（50），引线（34）和半导体芯片（10）的侧面被填充并且在形成有电极端子的面（10）和形成为比半导体芯片（10）大的外部形状的盖构件（52）之间的间隙中硬化，使得其可以覆盖面（10a），其中形成电极端子和引线（34）的顶部并且还覆盖半导体的外边缘附近芯片（10）。

2. 发明申请

WO1996035249A1 DISCHARGE TUBE WITH COATED DISCHARGE SURFACE 审中-公开
标题翻译：放电管与涂层放电表面
公开(公告)号：WO1996035249A1
公开(公告)日：1996-11-07
申请号：PCT/JP1996001200
申请日：1996-05-01
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD. , MACHIDA, Kazuhiko
发明人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
IPC分类号： H01T01/20
CPC分类号： H01T1/22
摘要： A discharge tube (10) comprising two electrodes (14a and 14b) opposed to each other via intervening insulators (12), wherein the discharge surfaces of the electrodes (14a and 14b) are each coated with a coating agent (16) containing 0.01-60 wt.% of at least one alkali metal salt selected among potassium bromide, potassium fluoride and sodium fluoride in order to attain a stable starting voltage even under a surge voltage with a short rise time.
摘要翻译：一种放电管（10），包括通过插入绝缘体（12）彼此相对的两个电极（14a和14b），其中电极（14a和14b）的放电表面各自涂覆有包含0.01- 60重量％的至少一种选自溴化钾，氟化钾和氟化钠的碱金属盐，以便即使在短时间的浪涌电压下也能获得稳定的起始电压。

3. 发明申请

WO1994011902A1 LEAD FRAME AND SEMICONDUCTOR DEVICE USING SAME 审中-公开
标题翻译：引导框架和使用相同的半导体器件
公开(公告)号：WO1994011902A1
公开(公告)日：1994-05-26
申请号：PCT/JP1993001677
申请日：1993-11-16
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD. , KURAISHI, Fumio , YUMOTO, Kazuhito , HAYASHI, Mamoru
发明人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
IPC分类号： H01L23/495
CPC分类号： H01L23/49558 , H01L21/4846 , H01L23/24 , H01L23/4334 , H01L23/49572 , H01L24/48 , H01L24/49 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In a lead frame adapted to be used for a semiconductor device, a plurality of inner leads (18) are made of a thin conductive material for easily forming a fine pattern of the inner leads. A plurality of outer leads (20) are integrally formed with the respective inner leads. The outer leads are coated with metal layers to increase the thickness thereof, so that a desired strength of the outer leads is obtained. A semiconductor chip (24) is electrically connected to the inner leads. The semiconductor chip and a part of the lead frame including the inner leads are hermetically sealed with a resin (26) and, thus, a semiconductor device is obtained.
摘要翻译：在适于用于半导体器件的引线框架中，多个内引线（18）由薄导电材料制成，用于容易地形成内引线的精细图案。多个外引线（20）与相应的内引线一体地形成。外部引线用金属层涂覆以增加其厚度，从而获得外部引线所需的强度。半导体芯片（24）电连接到内引线。半导体芯片和包括内部引线的引线框架的一部分用树脂（26）气密密封，从而获得半导体器件。

4. 发明申请

WO1997028296A1 AQUEOUS SOLUTION FOR FORMING METAL COMPLEXES, TIN-SILVER ALLOY PLATING BATH, AND PROCESS FOR PRODUCING PLATED OBJECT USING THE PLATING BATH 审中-公开
标题翻译：用于形成金属复合物的水溶液，镀锡合金镀层，以及使用镀层制造生产镀层物体的工艺
公开(公告)号：WO1997028296A1
公开(公告)日：1997-08-07
申请号：PCT/JP1997000209
申请日：1997-01-30
申请人： NAGANOKEN , SHINKO ELECTRIC INDUSTRIES CO., LTD. , ARAI, Susumu , WATANABE, Tohru , HIGASHI, Mitsutoshi
发明人： NAGANOKEN , SHINKO ELECTRIC INDUSTRIES CO., LTD.
IPC分类号： C25D03/56
CPC分类号： H01L24/10 , C25D3/60 , C25D3/64 , H01L23/49866 , H01L24/13 , H01L2224/03912 , H01L2224/0401 , H01L2224/13 , H01L2224/13099 , H01L2924/01006 , H01L2924/01011 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15747 , H05K3/244 , H05K3/3473 , H01L2924/00
摘要： A tin-silver alloy plating bath characterized by comprising as the fundamental ingredients a tin compound, a silver compound, and complexing agents therefor consisting of a pyrophosphoric acid compound and an iodine compound. The bath is capable of depositing a tin-silver alloy coating having any desired composition at a high current efficiency without using any cyanide harmful to the human body. The plating bath is so stable as to withstand air agitation. The tin-silver alloy coating deposited from the plating bath is satisfactory in appearance, tight adhesion, and solder wettability, and is superior as a lead-free solder plating alloy.
摘要翻译：一种锡 - 银合金电镀浴，其特征在于，以锡化合物，银化合物为基本成分，以及由焦磷酸化合物和碘化合物构成的络合剂。该浴能够以高电流效率沉积具有任何所需组成的锡 - 银合金涂层，而不使用对人体有害的任何氰化物。镀浴非常稳定，可以承受空气搅拌。从镀浴沉积的锡 - 银合金涂层外观令人满意，粘合性好，焊料润湿性好，作为无铅焊料镀层合金优越。

5. 发明申请

WO1997022146A1 SEMICONDUCTOR PACKAGE WITH MULTILAYERED CIRCUIT AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：具有多层电路和半导体器件的半导体封装
公开(公告)号：WO1997022146A1
公开(公告)日：1997-06-19
申请号：PCT/JP1996003590
申请日：1996-12-06
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD. , SASAKI, Masayuki , HANABUSA, Takayoshi
发明人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
IPC分类号： H01L23/12
CPC分类号： H01L23/13 , H01L21/4857 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/16195
摘要： In a semiconductor package provided with a multilayered circuit formed by the so-called build-up system. A semiconductor chip is firmly fixed. The yield and the reliability such as of the durability of a semiconductor device is improved. The semiconductor package is provided with an insulating core substrate (10). On one side of the substrate (10), a semiconductor chip mounting area (20) where semiconductor chips (14) are mounted is provided and a wiring pattern (12) composed of metallic foil is formed. One end of the pattern (12) is extended into the area (20) and layers having thin film wiring patterns (22) connected to the pattern (12) are formed through thin film insulating layers (18) over the area surrounding the chip mounting area (20). The chip mounting area (20) is in a recess defined by the pattern (22) and the insulating layers (18).
摘要翻译：在具有由所谓的建立系统形成的多层电路的半导体封装中。半导体芯片牢固地固定。提高了半导体器件的耐久性等产率和可靠性。半导体封装设置有绝缘芯基板（10）。在基板（10）的一侧，设置安装半导体芯片（14）的半导体芯片安装区域（20），形成由金属箔构成的布线图案（12）。图案（12）的一端延伸到区域（20）中，并且连接到图案（12）的具有薄膜布线图案（22）的层通过在芯片安装件周围的区域上的薄膜绝缘层（18）形成区域（20）。芯片安装区域（20）位于由图案（22）和绝缘层（18）限定的凹部中。

6. 发明申请

WO1999004354A1 A LICENSE MANAGEMENT SYSTEM 审中-公开
标题翻译：许可管理系统
公开(公告)号：WO1999004354A1
公开(公告)日：1999-01-28
申请号：PCT/JP1997002460
申请日：1997-07-15
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD. , SILICON AUTOMATION SYSTEMS PVT. LTD. , SEKIGAWA, Kazunari , SATO, Tomomi , PATEL, Supriya, K. , SANKOLLI, Sanjay, D.
发明人： SHINKO ELECTRIC INDUSTRIES CO., LTD. , SILICON AUTOMATION SYSTEMS PVT. LTD.
IPC分类号： G06F17/60
CPC分类号： G06Q30/04
摘要： A license management system for software which drives a single computer or a plurality of computers includes: an application program for requesting a decision of the number of license which it needs to drive itself and for receiving issuance of the license; a number of license decision unit for determining the necessary number of licenses in accordance with the request from the application program; and a license management unit for issuing the number of licenses which was determined by the number of license decision unit. Further, the number of license decision unit has means for determining the number of licenses based on the following multi-nominal function, LK = f (x1, x2, ....., xn), where, LK is the number of licences, and x1 to xn are parameters which are needed to determine the number of licenses. According to the present invention, it is possible to provide a license management system enabling issuance of a license in which the sales strategy of a software maker was considered.
摘要翻译：用于驱动单个计算机或多个计算机的软件的许可证管理系统包括：应用程序，用于请求对其需要驱动的许可证的数量的决定并且用于接收许可证的发放; 许多许可证决定单元，用于根据应用程序的请求确定必要的许可数量; 以及许可证管理单元，用于发布由许可证决定单元的数量确定的许可证的数量。此外，许可证决定单元的数量具有用于基于以下多标称函数LK = f（x1，x2，...，xn）来确定许可证数量的装置，其中，LK是许可证的数量，而x1到xn是确定许可证数量所需的参数。根据本发明，可以提供能够发行软件生产者的销售策略的许可证的许可证管理系统。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式