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1. 发明授权

EP0922964B1 Socket for inspection of semiconductor device 失效
标题翻译：用于半导体器件的测试支架
公开(公告)号：EP0922964B1
公开(公告)日：2004-03-03
申请号：EP97121732.8
申请日：1997-12-10
申请人： SHIN-ETSU POLYMER CO., LTD.
发明人： Yamazaki, Kouichi, c/o Shinano Polymer Co., Ltd. , Komatsu, Hiroto, c/o Shin-Etsu Polymer Co., Ltd.
IPC分类号： G01R31/28
CPC分类号： G01R1/0433 , H01L2924/0002 , H01L2924/00

3. 发明公开

EP0922964A1 Socket for inspection of semiconductor device 失效
标题翻译： Testhalterfüreine Halbleitervorrichtung
公开(公告)号：EP0922964A1
公开(公告)日：1999-06-16
申请号：EP97121732.8
申请日：1997-12-10
申请人： SHIN-ETSU POLYMER CO., LTD.
发明人： Yamazaki, Kouichi, c/o Shinano Polymer Co., Ltd. , Komatsu, Hiroto, c/o Shin-Etsu Polymer Co., Ltd.
IPC分类号： G01R31/28
CPC分类号： G01R1/0433 , H01L2924/0002 , H01L2924/00
摘要： Proposed is a socket for inspection of semiconductor devices having laterally extended leads by mounting the device in the mounting seat of the socket body, by means of which the productivity of the inspection process can be greatly improved because troublesome steps such as soldering can be omitted. The socket comprises:

(a) a socket body (30) mountable on the circuit board (20) positioning having a mounting seat (31) for the body of the semiconductor device in a freely demountable fashion;
(b) a lead frame (40) intervening between the socket body and the circuit board having resilient contacting shoes (42) extended out of the surface facing the circuit board in the mounting seat of the socket body, the contacting shoes being brought into contact, when the semiconductor device is mounted on the mounting seat, with the leads of the semiconductor device; and
(c) an anisotropically electroconductive elastic connector sheet (50) interposed between the lead frame and the circuit board to be in contact with the electrode terminals of the circuit board on one surface and with the contacting points of the contacting shoes of the lead frame on the other surface.
摘要翻译：提出了一种用于通过将装置安装在插座主体的安装座中来检查具有横向延伸的引线的半导体器件的插座，由此可以省略诸如焊接的麻烦的步骤，从而可以大大提高检查过程的生产率。插座包括：（a）可安装在电路板（20）上的插座主体（30），其以可自由拆卸的方式定位成具有用于半导体器件主体的安装座（31）; （b）介于插座主体和电路板之间的引线框架（40），其具有从插座主体的安装座中的面向电路板的表面延伸出的弹性接触鞋（42），使接触鞋接触当半导体器件与半导体器件的引线安装在安装座上时; 以及（c）插入在引线框架和电路板之间的各向异性导电弹性连接片（50），以在一个表面上与电路板的电极端子接触，并且引线框架的接触焊盘的接触点在另一个表面。

4. 发明公开

EP0751557A3 Wiring circuit board for mounting of semiconductor chip and method for the preparation thereof 失效
标题翻译：电路板的半导体芯片组件及其制备方法
公开(公告)号：EP0751557A3
公开(公告)日：1999-02-10
申请号：EP96109637.7
申请日：1996-06-15
申请人： SHIN-ETSU POLYMER CO., LTD.
发明人： Ogino, Tsutomu, c/o Shinano Polymer Co., Ltd. , Komatsu, Hiroto, c/o Shin-Etsu Polymer Co., Ltd.
IPC分类号： H01L21/60 , H01L23/31 , H01L23/13
CPC分类号： H01L24/85 , H01L21/50 , H01L23/13 , H01L23/3121 , H01L23/3135 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05644 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48453 , H01L2224/48465 , H01L2224/48472 , H01L2224/48507 , H01L2224/48644 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , Y10T29/49146 , Y10T29/53174 , Y10T29/53178 , H01L2224/78 , H01L2924/00 , H01L2924/00012
摘要： Proposed is a novel wiring circuit board for mounting of a semiconductor chip suitable for free mounting and demounting thereof. The wiring circuit board comprises: an insulating base plate provided with electrodes on one surface and having an opening for insertion of the semiconductor chip; bonding wires each connected to one of the electrodes at one end, with the other end appearing in the opening at a position just to come into contact with the electrode of a semiconductor chip inserted into the opening; and a resinous encapsulating layer covering the opening and embedding the bonding wires. A method for the preparation of this wiring circuit board is also disclosed in which accurate positioning of the ends of the bonding wires appearing in the opening of the base plate is accomplished by using a dummy chip provided with etching-resistant false electrodes and inserted into the opening followed by subsequent removal by etching after completion of the bonding work of the bonding wires.

5. 发明公开

EP0751557A2 Wiring circuit board for mounting of semiconductor chip and method for the preparation thereof 失效
标题翻译： Schaltungsleiterplatte zur Halbleiterchipmontage und Vorbereitungsverfahrendafür
公开(公告)号：EP0751557A2
公开(公告)日：1997-01-02
申请号：EP96109637.7
申请日：1996-06-15
申请人： SHIN-ETSU POLYMER CO., LTD.
发明人： Ogino, Tsutomu, c/o Shinano Polymer Co., Ltd. , Komatsu, Hiroto, c/o Shin-Etsu Polymer Co., Ltd.
IPC分类号： H01L21/60 , H01L23/31 , H01L23/13
CPC分类号： H01L24/85 , H01L21/50 , H01L23/13 , H01L23/3121 , H01L23/3135 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05644 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48453 , H01L2224/48465 , H01L2224/48472 , H01L2224/48507 , H01L2224/48644 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , Y10T29/49146 , Y10T29/53174 , Y10T29/53178 , H01L2224/78 , H01L2924/00 , H01L2924/00012
摘要： Proposed is a novel wiring circuit board for mounting of a semiconductor chip suitable for free mounting and demounting thereof. The wiring circuit board comprises: an insulating base plate provided with electrodes on one surface and having an opening for insertion of the semiconductor chip; bonding wires each connected to one of the electrodes at one end, with the other end appearing in the opening at a position just to come into contact with the electrode of a semiconductor chip inserted into the opening; and a resinous encapsulating layer covering the opening and embedding the bonding wires. A method for the preparation of this wiring circuit board is also disclosed in which accurate positioning of the ends of the bonding wires appearing in the opening of the base plate is accomplished by using a dummy chip provided with etching-resistant false electrodes and inserted into the opening followed by subsequent removal by etching after completion of the bonding work of the bonding wires.
摘要翻译：提出了一种用于安装适合于其自由安装和拆卸的半导体芯片的新型布线电路板。布线电路板包括：绝缘基板，其在一个表面上设置有电极，并具有用于插入半导体芯片的开口; 每个连接到一个电极一端的接合线，另一端在刚好与插入到开口中的半导体芯片的电极接触的位置处的开口中; 以及覆盖开口并嵌入接合线的树脂封装层。还公开了一种用于制备该布线电路板的方法，其中通过使用设置有耐蚀刻假电极并插入到该基板的虚设芯片来实现出现在基板的开口中的接合线的端部的精确定位在接合线的接合工作完成之后通过蚀刻随后除去。

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