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    • 2. 发明申请
    • VARIABLE RESISTANCE MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME
    • 可变电阻存储器件及其制造方法
    • US20160181321A1
    • 2016-06-23
    • US14963947
    • 2015-12-09
    • SEUNG-JAE JUNGYOUN-SEON KANG
    • SEUNG-JAE JUNGYOUN-SEON KANG
    • H01L27/24H01L45/00
    • H01L45/147H01L27/2409H01L27/2481H01L45/06H01L45/08H01L45/1233H01L45/1266H01L45/141H01L45/145H01L45/146H01L45/16
    • A variable resistance memory device includes a plurality of first conductive lines, each of the first conductive lines extends in a first direction, a plurality of second conductive lines are above the first conductive lines, and each of the second conductive lines extend in a second direction transverse to the first direction. A plurality of first memory cells are at intersections where the first and second conductive lines overlap each other, each of the first memory cells including a first variable resistance structure having a first variable resistance pattern, a first sacrificial pattern and a second variable resistance pattern sequentially stacked in the first direction on a first plane. A plurality of third conductive lines are above the second conductive lines, each of the third conductive lines extend in the first direction, and a plurality of second memory cells are at intersections where the second and the third conductive lines overlap each other. Each of the second memory cells includes a second variable resistance structure having a third variable resistance pattern, a second sacrificial pattern and a fourth variable resistance pattern sequentially stacked in the first direction on second plane.
    • 可变电阻存储器件包括多个第一导线,每个第一导线沿第一方向延伸,多个第二导线位于第一导线之上,并且每个第二导线沿第二方向延伸 横向于第一个方向。 多个第一存储单元位于第一和第二导线彼此重叠的交点处,每个第一存储单元包括具有第一可变电阻图案,第一牺牲图案和第二可变电阻图案的第一可变电阻结构, 在第一平面上沿第一方向堆叠。 多个第三导线在第二导线之上,第三导线中的每一根在第一方向上延伸,并且多个第二存储单元位于第二和第三导线彼此重叠的交点处。 每个第二存储单元包括第二可变电阻结构,其具有第三可变电阻图案,第二牺牲图案和第四可变电阻图案,其顺序地在第二平面上沿第一方向堆叠。