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1. 发明申请

WO2008002088A1 LEADFRAME HAVING A HEAT SINK SUPPORTING PART, FABRICATING METHOD OF THE LIGHT EMITTING DIODE PACKAGE USING THE SAME AND LIGHT EMITTING DIODE PACKAGE FABRICATED BY THE METHOD 审中-公开
标题翻译：具有散热支撑部件的引线框架，使用其的发光二极管封装的制造方法和由该方法制成的发光二极管封装
公开(公告)号：WO2008002088A1
公开(公告)日：2008-01-03
申请号：PCT/KR2007/003148
申请日：2007-06-28
申请人： SEOUL SEMICONDUCTOR CO., LTD. , KIM, Do Hyung , KANG, Suk Jin , CHOI, Hyuck Jung , SEO, Jung Hoo
发明人： KIM, Do Hyung , KANG, Suk Jin , CHOI, Hyuck Jung , SEO, Jung Hoo
IPC分类号： H01L23/495
CPC分类号： H01L33/62 , H01L23/4334 , H01L23/49861 , H01L33/486 , H01L33/642 , H01L2224/45139 , H01L2224/48247 , H01L2924/00011 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/01049 , H01L2924/01005
摘要： Disclosed are a leadframe having heat sink supporting parts, a light emitting diode package in which the leadframe is employed, and a fabricating method of a light emitting diode package using the leadframe. The leadframe includes an outer frame surrounding a predetermined region. The heat sink supporting parts extend inward to face each other from the outer frame. Each of the supporting parts has an end portion coupled to a heat sink. Further, lead terminals extend inward to face each other from the outer frame. The lead terminals are spaced apart from the supporting parts. Accordingly, a package main body can be formed by an insert molding technique after the heat sink is coupled to the end portions of the supporting parts, and the heat sink and the lead terminals can be easily aligned.
摘要翻译：公开了具有散热器支撑部件的引线框架，使用引线框架的发光二极管封装以及使用引线框架的发光二极管封装件的制造方法。引线框架包括围绕预定区域的外框架。散热器支撑部件向内延伸以从外框架彼此面对。每个支撑部分具有联接到散热器的端部。此外，引线端子向内延伸以从外框架彼此面对。引线端子与支撑部分间隔开。因此，在散热器连接到支撑部件的端部之后，可以通过插入成型技术形成封装主体，并且散热器和引线端子可以容易地对准。

2. 发明申请

WO2008150042A1 LED PACKAGE 审中-公开
标题翻译： LED封装
公开(公告)号：WO2008150042A1
公开(公告)日：2008-12-11
申请号：PCT/KR2007/003250
申请日：2007-07-04
申请人： SEOUL SEMICONDUCTOR CO., LTD. , KIM, Do Hyung , KANG, Suk Jin
发明人： KIM, Do Hyung , KANG, Suk Jin
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to an LED package. An object of the present invention is to provide an LED package, wherein a lead frame is configured to have a chip attaching portion with LED chips attached thereto which is considerably wider than each of a plurality of terminal portions, so that the LED package with improved heat radiation, light reflection and electrical performances can be provided. To this end, the LED package of the present invention comprises a lead frame formed by cutting and bending a metal plate and including a chip attaching portion with at least one LED chip attached thereto and a plurality of terminal portions each having a width narrower than the chip attaching portion, and a housing for supporting the lead frame. The plurality of terminal portions include at least one first terminal portion extending from a portion of a width of the chip attaching portion, and a plurality of second terminal portions spaced apart from the chip attaching portion.
摘要翻译：本发明涉及LED封装。本发明的目的是提供一种LED封装，其中引线框架被配置为具有附接有LED芯片的芯片附接部分，其宽度大于多个端子部分中的每一个，使得具有改进的LED封装可以提供热辐射，光反射和电性能。为此，本发明的LED封装包括：通过切割和弯曲金属板而形成的引线框架，并且包括具有附接至少一个LED芯片的芯片附接部分和多个端子部分，每个端子部分的宽度比芯片安装部分和用于支撑引线框架的壳体。多个端子部分包括从芯片安装部分的宽度的一部分延伸的至少一个第一端子部分和与芯片附接部分间隔开的多个第二端子部分。

3. 发明公开

EP2038924A1 LEADFRAME HAVING A HEAT SINK SUPPORTING PART, FABRICATING METHOD OF THE LIGHT EMITTING DIODE PACKAGE USING THE SAME AND LIGHT EMITTING DIODE PACKAGE FABRICATED BY THE METHOD 审中-公开
标题翻译：带散热片的支撑元件管理框架下，发光二极管封装的方法，并且在由发光二极管封装这一过程
公开(公告)号：EP2038924A1
公开(公告)日：2009-03-25
申请号：EP07768519.6
申请日：2007-06-28
申请人： Seoul Semiconductor Co., Ltd.
发明人： KIM, Do Hyung , KANG, Suk Jin , CHOI, Hyuck Jung , SEO, Jung Hoo
IPC分类号： H01L23/495
CPC分类号： H01L33/62 , H01L23/4334 , H01L23/49861 , H01L33/486 , H01L33/642 , H01L2224/45139 , H01L2224/48247 , H01L2924/00011 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/01049 , H01L2924/01005
摘要： Disclosed are a leadframe having heat sink supporting parts, a light emitting diode package in which the leadframe is employed, and a fabricating method of a light emitting diode package using the leadframe. The leadframe includes an outer frame surrounding a predetermined region. The heat sink supporting parts extend inward to face each other from the outer frame. Each of the supporting parts has an end portion coupled to a heat sink. Further, lead terminals extend inward to face each other from the outer frame. The lead terminals are spaced apart from the supporting parts. Accordingly, a package main body can be formed by an insert molding technique after the heat sink is coupled to the end portions of the supporting parts, and the heat sink and the lead terminals can be easily aligned.

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