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1. 发明申请

US20150375273A1 SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：基板加工设备
公开(公告)号：US20150375273A1
公开(公告)日：2015-12-31
申请号：US14767014
申请日：2013-11-01
申请人： SCREEN HOLDINGS CO., LTD.
发明人： Junichi ISHII , Koichi OKAMOTO
IPC分类号： B08B3/14 , B01D19/00 , B01D35/02 , H01L21/67
CPC分类号： B08B3/14 , B01D19/0031 , B01D35/02 , H01L21/67017 , H01L21/67023 , H01L21/67051 , H01L21/6708
摘要： A technique for reducing the amount of particles adhering to a substrate with a simple structure is provided. A substrate processing apparatus is an apparatus for processing a substrate by ejecting a processing liquid from a nozzle. The substrate processing apparatus includes supply piping and an air-bubble capturing part. One end of the supply piping is connected via a first filter for removing particles to a tank of a processing-liquid supply part that supplies the processing liquid, and the other end of the supply piping is connected to the nozzle. The air-bubble capturing part is inserted at a position between the first filter and the nozzle in the supply piping, and captures air bubbles contained in the processing liquid. Pressure loss caused by the air-bubble capturing part is approximately equal to or smaller than pressure loss caused by the first filter.
摘要翻译：提供了一种以简单的结构减少附着在基板上的粒子的量的技术。基板处理装置是通过从喷嘴喷射处理液来处理基板的装置。基板处理装置包括供给管线和气泡捕获部。供给管道的一端通过用于将颗粒除去到供给处理液的处理液供给部的罐的第一过滤器连接，供给配管的另一端与喷嘴连接。气泡捕获部分插入在供应管道中的第一过滤器和喷嘴之间的位置处，并捕获包含在处理液体中的气泡。由气泡捕获部引起的压力损失大致等于或小于由第一过滤器引起的压力损失。

2. 发明公开

US20240342672A1 CHEMICAL LIQUID PREPARATION DEVICE, AND SUBSTRATE PROCESSING DEVICE 审中-公开
公开(公告)号：US20240342672A1
公开(公告)日：2024-10-17
申请号：US18755680
申请日：2024-06-27
申请人： SCREEN Holdings Co., Ltd.
发明人： Hajime NISHIDE , Takashi IZUTA , Takatoshi HAYASHI , Katsuhiro FUKUI , Koichi OKAMOTO , Kazuhiro FUJITA , Atsuyasu MIURA , Kenji KOBAYASHI , Sei NEGORO , Hiroki TSUJIKAWA
IPC分类号： B01F35/82 , B01F23/231 , B01F23/237 , B01F35/21 , B01F35/22 , G05D11/00 , G05D21/02 , H01L21/306 , H01L21/3213 , H01L21/67 , B01F101/58
CPC分类号： B01F35/82 , B01F23/231 , B01F23/237611 , B01F23/237612 , B01F23/23765 , B01F35/2132 , B01F35/2202 , G05D11/00 , G05D21/02 , H01L21/30608 , H01L21/32134 , H01L21/67017 , H01L21/67028 , H01L21/67051 , H01L21/67075 , H01L21/6708 , B01F2101/58
摘要： A chemical liquid preparation method of preparing a TMAH-containing chemical liquid, including, a correspondence relationship preparing step of preparing a correspondence relationship between a supply flow rate ratio between an oxygen-containing gas and an inert-gas-containing gas and a convergent dissolved oxygen concentration in the TMAH-containing chemical liquid that is converged to when the oxygen-containing gas and the inert-gas-containing gas are supplied into the TMAH-containing chemical liquid; a concentration setting step of setting a target dissolved oxygen concentration in the TMAH-containing chemical liquid; a supply-flow-rate-ratio acquiring step of acquiring the supply flow rate ratio between the oxygen-containing gas and the inert-gas-containing gas corresponding to the target dissolved oxygen concentration in accordance with the correspondence relationship prepared in the correspondence relationship preparing step; and a gas supplying step of supplying the oxygen-containing gas and the inert-gas-containing gas with the supply flow rate ratio acquired in the supply-flow-rate-ratio acquiring step.

3. 发明申请

US20220347641A1 CHEMICAL LIQUID PREPARATION DEVICE, AND SUBSTRATE PROCESSING DEVICE 有权
公开(公告)号：US20220347641A1
公开(公告)日：2022-11-03
申请号：US17867693
申请日：2022-07-19
申请人： SCREEN Holdings Co., Ltd.
发明人： Hajime NISHIDE , Takashi IZUTA , Takatoshi HAYASHI , Katsuhiro FUKUI , Koichi OKAMOTO , Kazuhiro FUJITA , Atsuyasu MIURA , Kenji KOBAYASHI , Sei NEGORO , Hiroki TSUJIKAWA
IPC分类号： B01F35/82 , H01L21/67 , G05D21/02 , H01L21/306 , G05D11/00 , H01L21/3213 , B01F23/231 , B01F35/21 , B01F35/22
摘要： A chemical liquid preparation method of preparing a chemical liquid for treating a film formed on a substrate, including a gas dissolving process in which an oxygen-containing gas and an inert-gas-containing gas are dissolved in the chemical liquid by supplying the oxygen-containing gas which contains oxygen gas and the inert-gas-containing gas which contains an inert gas to a chemical liquid, wherein in the gas dissolving process, a dissolved oxygen concentration in the chemical liquid is adjusted by setting a mixing ratio between the oxygen-containing gas and the inert-gas-containing gas supplied to the chemical liquid as a mixing ratio corresponding to a predetermined target dissolved oxygen concentration.

4. 发明申请

US20190091640A1 CHEMICAL LIQUID PREPARATION METHOD, CHEMICAL LIQUID PREPARATION DEVICE, AND SUBSTRATE PROCESSING DEVICE 审中-公开
公开(公告)号：US20190091640A1
公开(公告)日：2019-03-28
申请号：US16114253
申请日：2018-08-28
申请人： SCREEN Holdings Co., Ltd.
发明人： Hajime NISHIDE , Takashi IZUTA , Takatoshi HAYASHI , Katsuhiro FUKUI , Koichi OKAMOTO , Kazuhiro FUJITA , Atsuyasu MIURA , Kenji KOBAYASHI , Sei NEGORO , Hiroki TSUJIKAWA
IPC分类号： B01F15/04 , H01L21/67 , B01F3/04 , B01F15/00 , G05D21/02
摘要： A chemical liquid preparation method of preparing a chemical liquid for treating a film formed on a substrate, including a gas dissolving process in which an oxygen-containing gas and an inert-gas-containing gas are dissolved in the chemical liquid by supplying the oxygen-containing gas which contains oxygen gas and the inert-gas-containing gas which contains an inert gas to a chemical liquid, wherein in the gas dissolving process, a dissolved oxygen concentration in the chemical liquid is adjusted by setting a mixing ratio between the oxygen-containing gas and the inert-gas-containing gas supplied to the chemical liquid as a mixing ratio corresponding to a predetermined target dissolved oxygen concentration.

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