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1. 发明专利

JPH1029662A EMBOSSED CARRIER TAPE FOR CHIP-LIKE ELECTRONIC COMPONENT AND ITS MANUFACTURE 失效
公开(公告)号：JPH1029662A
公开(公告)日：1998-02-03
申请号：JP20278696
申请日：1996-07-15
申请人： SANTOKU TRADING CO LTD , SANSEI KK , SHINFUJI SEISHI KK
发明人： NAKAYAMA NORIYOSHI , SAKURAGI KAZUSHI , HIRANO IWAO
IPC分类号： B65D73/02 , B65D85/86
摘要： PROBLEM TO BE SOLVED: To eliminate separation between paperboard layers and improve adhesive properties of a tape by embossing paper or paperboard by dies comprising a male die and a female die, and providing a plurality of recessed portions in which chip-like electronic components are loadable. SOLUTION: An embossed carrier tape 1 to be utilized in the case of obtaining a taping package of electronic components such as ICs and LSIs has a plurality of recessed portions in which the electronic components are loadable and which are provided by effecting embosses 3 to paper or paperboard. Paper having 0.5-30% of rayon, etc., incorporated in a paper layer 2 is preferably used as a material. Further, in the case where paper or paperboard held between a die having a protrusion type punch and a die having a recessed portion is embossed, embossing is performed in the state that the clearance between a side face of the protrusion type punch and a side face of the recessed portion is made to be 90-180% of the thickness of paper and in the state that the clearance between a corner part of the protrusion type punch and a corner part of the recessed portion is made to be 60-65% of the thickness of paper. By forming the embosses 3 under these conditions, paper powder is not produced, and the electronic components can be prevented from becoming dirty.

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