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    • 2. 发明申请
    • SYSTEM AND METHOD FOR BONDED CONFIGURATION PAD CONTINUITY CHECK
    • 用于绑定配置焊盘连续性检查的系统和方法
    • WO2012118770A1
    • 2012-09-07
    • PCT/US2012/026827
    • 2012-02-27
    • SANDISK TECNOLOGIES INC.LIU, BaojingGUTTA, ArunaSKALA, Stephen
    • LIU, BaojingGUTTA, ArunaSKALA, Stephen
    • G11C29/02G01R31/04G01R31/28G01R31/317
    • G11C29/022G01R31/026
    • A continuity test circuit for a boundary pad includes a pull-up transistor electrically connected between the boundary pad and a first power supply, and a pull-down transistor electrically connected between the boundary pad and a first reference ground potential. A normal output conductor is electrically connected to have a same electrical state as the boundary pad during normal operation. A continuity test output conductor is electrically connected to have a same electrical state as the boundary pad during continuity test operation. Continuity testing control circuitry is defined to control the pull-up transistor, the pull-down transistor, and the normal output conductor during continuity test operation such that an electrical state present on the continuity test output conductor indicates a status of electrical continuity between the boundary pad and either a second power supply or a second reference ground potential to which the boundary pad should be electrically connected.
    • 用于边界焊盘的连续性测试电路包括电连接在边界焊盘和第一电源之间的上拉晶体管以及电连接在边界焊盘和第一参考晶体管之间的下拉晶体管 地面潜力。 正常输出导体在正常操作期间电连接以具有与边界垫相同的电状态。 在连续性测试操作期间,连续性测试输出导体电连接以具有与边界焊盘相同的电气状态。 连续性测试控制电路被定义为在连续性测试操作期间控制上拉晶体管,下拉晶体管和正常输出导体,使得存在于连续性测试输出导体上的电状态指示边界之间的电连续性的状态 焊盘以及第二电源或第二参考地电位,边界焊盘应与之电连接。