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1. 发明申请

WO2012030185A3 SEMICONDUCTOR LIGHT-EMITTING DIODE CHIP, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：半导体发光二极管芯片，发光器件及其制造方法
公开(公告)号：WO2012030185A3
公开(公告)日：2012-06-14
申请号：PCT/KR2011006505
申请日：2011-09-01
申请人： SAMSUNG LED CO LTD , CHAE SEUNG WAN , KIM TAE HUN , LEE SU YEOL , LEE JIN BOCK , KIM JIN HWAN , LEE SEUNG JAE , KIM BO KYOUNG , LEE JONG HO
发明人： CHAE SEUNG WAN , KIM TAE HUN , LEE SU YEOL , LEE JIN BOCK , KIM JIN HWAN , LEE SEUNG JAE , KIM BO KYOUNG , LEE JONG HO
IPC分类号： H01L33/44 , H01L33/46
CPC分类号： H01L33/46 , H01L24/29 , H01L33/44 , H01L33/641 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73265 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： One aspect of the present invention provides a semiconductor light-emitting diode chip including: a light-transmitting substrate; and a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer which are sequentially formed on an upper surface of the light-transmitting substrate and a semiconductor light-emitting device including: a rear reflective type laminate which is formed on a lower surface of the light-transmitting substrate and has an optical auxiliary layer formed with a material having a predetermined refractive index and a metallic reflective layer formed on a lower surface of the optical auxiliary layer; a bonding metal layer which is provided on a lower surface of the rear reflective type laminate and is made of an eutectic metal; and a bonding laminate having a diffusion barrier which is formed to prevent the diffusion of the elements between the bonding metal layer and the metallic reflective layer.
摘要翻译：本发明的一个方面提供一种半导体发光二极管芯片，包括：透光基板; 以及顺序地形成在所述透光基板的上表面上的第一导电类型半导体层，有源层和第二导电类型半导体层，以及包括：形成的反射型层叠体在所述透光性基板的下表面上具有形成有具有规定折射率的材料的光学辅助层和形成在所述光学辅助层的下表面上的金属反射层; 接合金属层，其设置在后反射型层叠体的下表面上并且由共晶金属制成; 以及具有扩散阻挡层的接合层压体，其形成为防止元件在接合金属层和金属反射层之间的扩散。

2. 发明专利

JP2011181925A Semiconductor light emitting device including multi-cell array, light emitting module, and lighting system 有权
标题翻译：包括多细胞阵列，发光模块和照明系统的半导体发光器件
公开(公告)号：JP2011181925A
公开(公告)日：2011-09-15
申请号：JP2011040334
申请日：2011-02-25
申请人： Samsung Led Co Ltd , サムソンエルイーディーカンパニーリミテッド.
发明人： LEE SU YEOL , KIM YONG TAE , LEE JIN BOCK , KIM GI BUM
IPC分类号： H01L33/08 , F21S2/00 , F21Y101/02
CPC分类号： H01L27/156 , H01L24/24 , H01L27/153 , H01L33/30 , H01L33/62 , H01L2224/48091 , H01L2924/12041 , H01L2924/12042 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device having a structure arranged with a plurality of light emitting cells, a light emitting module including the same, and a lighting system. SOLUTION: The semiconductor light emitting device includes: a substrate; a plurality of light emitting cells located on the top surface of the substrate, and each including a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer which are sequentially formed on the top surface of the substrate; a plurality of connection parts formed on the substrate formed with the light emitting cells thereon so that the plurality of light emitting cells are connected in parallel to or in a combination of series and parallel to one another; and an insulation layer formed on the surfaces of LED cells to prevent undesired connection between the plurality of connection parts and the LED cells. The plurality of light emitting cells include at least one defective light emitting cell, and at least one of the connection parts connected to the defective light emitting cell is disconnected. Various measures are also provided for reducing the number of normal light emitting cells exhausted together when removing the connection parts connected to the defective light emitting cells. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种具有多个发光单元的结构的半导体发光器件，包括该发光单元的发光模块和照明系统。解决方案：半导体发光器件包括：衬底; 多个发光单元，其位于所述基板的上表面，并且各自包括依次形成在所述基板的上表面上的第一导电型半导体层，有源层和第二导电型半导体层; 形成在其上形成有发光单元的基板上的多个连接部分，使得多个发光单元彼此并联连接或串联并联; 以及形成在LED单元的表面上的绝缘层，以防止多个连接部分和LED电池之间的不期望的连接。多个发光单元包括至少一个有缺陷的发光单元，并且连接到不良发光单元的连接部分中的至少一个断开。还提供了各种措施，用于在去除连接到不良发光单元的连接部分时减少在一起排出的普通发光单元的数量。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2011040762A Light emitting diode package 审中-公开
标题翻译：发光二极管封装
公开(公告)号：JP2011040762A
公开(公告)日：2011-02-24
申请号：JP2010182560
申请日：2010-08-17
申请人： Samsung Led Co Ltd , サムソンエルイーディーカンパニーリミテッド.
发明人： LEE JIN BOCK , PARK HEE SEOK , KIM HYUN KUN , LEE YOUNG JIN
IPC分类号： H01L33/48
CPC分类号： H01L33/483 , H01L24/48 , H01L24/73 , H01L33/60 , H01L33/62 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/12041 , H01L2924/15153 , H01L2924/15165 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： PROBLEM TO BE SOLVED: To provide a light emitting diode package.
SOLUTION: The light emitting diode package includes a package mold having a first cavity and a second cavity smaller than the first cavity, a first electrode pad and second electrode pad arranged on bottom surfaces of the first cavity and second cavity, an LED chip mounted on the first electrode pad, a wire for electrically connecting the LED chip and the second electrode pad, and a molding material filled in the first cavity and second cavity.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供发光二极管封装。解决方案：发光二极管封装包括具有第一腔和比第一腔更小的第二腔的封装模具，布置在第一空腔和第二空腔的底表面上的第一电极焊盘和第二电极焊盘，LED 芯片安装在第一电极焊盘上，用于电连接LED芯片和第二电极焊盘的导线，以及填充在第一腔体和第二腔体中的模制材料。版权所有（C）2011，JPO＆INPIT

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