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1. 发明申请

WO2010101427A3 MOVING IMAGE ENCODING DEVICE/DECODING DEVICE, AND A BLOCK-MODE DETERMINING METHOD FOR MOVING-IMAGE ENCODING/DECODING IN THE ENCODING DEVICE/DECODING DEVICE 审中-公开
标题翻译：移动图像编码装置/解码装置以及用于编码装置/解码装置中的移动图像编码/解码的块模式确定方法
公开(公告)号：WO2010101427A3
公开(公告)日：2010-12-02
申请号：PCT/KR2010001364
申请日：2010-03-04
申请人： SAMSUNG ELECTRONICS CO LTD , UNIV KWANGWOON IND ACAD COLLAB , CHO DAE-SUNG , CHOI WOONG-IL , SONG KWAN-WOONG , JOO YOUNG-HUN , KIM YONG-SERK , SIM DONG-GYU , PARK SEA-NAE , CHO HYUN-HO
发明人： CHO DAE-SUNG , CHOI WOONG-IL , SONG KWAN-WOONG , JOO YOUNG-HUN , KIM YONG-SERK , SIM DONG-GYU , PARK SEA-NAE , CHO HYUN-HO
IPC分类号： H04N7/24
CPC分类号： H04N19/57 , H04N19/109 , H04N19/147 , H04N19/176 , H04N19/567
摘要： Provided is a block-mode determining method for moving-image encoding/decoding. The block-mode determining method according to the present invention comprises the steps of: predicting the movement of macroblocks, in macroblock units, when macroblocks to be encoded are input; selecting at least one encoding mode from among the block modes of the macroblocks, in accordance with the predicted movement prediction; calculating rate-distortion values corresponding to each of the 'at least one encoding mode(s)' selected; and determining the optimum block mode as being constituted by one of the 'at least one encoding mode(s)', in accordance with the results of the calculation of the rate-distortion values.
摘要翻译：提供了一种用于运动图像编码/解码的块模式确定方法。根据本发明的块模式确定方法包括以下步骤：在宏块单元中，当要被编码的宏块被输入时，预测宏块的移动; 根据预测的移动预测，从宏块的块模式中选择至少一个编码模式; 计算对应于所选“至少一个（一个或多个）编码模式”中的每一个的速率 - 失真值; 以及根据速率 - 失真值的计算结果将最佳块模式确定为由“至少一种编码模式”之一构成。

2. 发明专利

DE102004008900A1 Equipment front end module for processing semiconductor wafer, has inert gas nozzle allowing inert gas to enter flow chamber such that inert gas combines with air and flows into front opening unified pod 未知
公开(公告)号：DE102004008900A1
公开(公告)日：2004-10-14
申请号：DE102004008900
申请日：2004-02-24
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： LEE KUN-HYUNG , CHO HYUN-HO , CHAE HEE-SUN , LEE SUN-YONG , LEE SOO-WONG , JUNG JAE-HYUNG
IPC分类号： H01L21/677 , B65G49/07 , H01L21/00 , H01L21/18 , B65B31/04 , H01L21/30
摘要： The module (100) has a flow chamber with air inlet for allowing air to flow in the chamber. A wafer enters the chamber at a wafer inlet coupled to a front opening unified pod (FOUP) (120) and exits the chamber at a wafer outlet. A wafer handler moves the wafer from the inlet to the outlet. An inert gas nozzle (110) allows an inert gas to enter the chamber such that the inert gas combines with the air and flows into the FOUP. Independent claims are also included for the following: (A) a method for processing a wafer (B) an apparatus for manufacturing a semiconductor device, that has a wafer processing apparatus (C) a method for manufacturing a semiconductor device.

3. 发明专利

DE10310543A1 未知
公开(公告)号：DE10310543A1
公开(公告)日：2003-11-20
申请号：DE10310543
申请日：2003-03-11
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： YEO IN-JUN , KIM KYUNG-HYUN , NAM JEONG-LIM , YOON BYOUNG-MOON , CHO HYUN-HO , HAH SANG-ROK
IPC分类号： H01L21/304 , B08B3/02 , B08B3/12 , H01L21/00 , H01L21/302
摘要： Embodiments of the invention include a megasonic energy cleaning apparatus that has the ability to rotate the wafer to be cleaned, as well as rotate the cleaning probe during the cleaning process. Rotating the cleaning probe while the wafer is being cleaned is effective to increase the cleaning action of the apparatus while also minimizing damage to the wafer. Curved grooves, such as a spiral groove, can be etched into the cleaning probe to minimize forming harmful waves that could potentially cause damage to the wafer surface or to structures already made on the surface. Using a cleaning probe having a curved groove while also rotating the cleaning probe effectively cleans particles from a wafer while also limiting damage to the surface of the wafer.

4. 发明专利

DE10310543B4 未知
公开(公告)号：DE10310543B4
公开(公告)日：2006-11-16
申请号：DE10310543
申请日：2003-03-11
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： YEO IN-JUN , KIM KYUNG-HYUN , NAM JEONG-LIM , YOON BYOUNG-MOON , CHO HYUN-HO , HAH SANG-ROK
IPC分类号： H01L21/302 , H01L21/304 , B08B3/02 , B08B3/12 , H01L21/00
摘要： Embodiments of the invention include a megasonic energy cleaning apparatus that has the ability to rotate the wafer to be cleaned, as well as rotate the cleaning probe during the cleaning process. Rotating the cleaning probe while the wafer is being cleaned is effective to increase the cleaning action of the apparatus while also minimizing damage to the wafer. Curved grooves, such as a spiral groove, can be etched into the cleaning probe to minimize forming harmful waves that could potentially cause damage to the wafer surface or to structures already made on the surface. Using a cleaning probe having a curved groove while also rotating the cleaning probe effectively cleans particles from a wafer while also limiting damage to the surface of the wafer.

5. 发明专利

DE102004008900B4 未知
公开(公告)号：DE102004008900B4
公开(公告)日：2009-05-07
申请号：DE102004008900
申请日：2004-02-24
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： LEE KUN-HYUNG , CHO HYUN-HO , CHAE HEE-SUN , LEE SUN-YONG , LEE SOO-WONG , JUNG JAE-HYUNG
IPC分类号： H01L21/18 , H01L21/677 , B65B31/04 , B65G49/07 , H01L21/00 , H01L21/30
摘要： The module (100) has a flow chamber with air inlet for allowing air to flow in the chamber. A wafer enters the chamber at a wafer inlet coupled to a front opening unified pod (FOUP) (120) and exits the chamber at a wafer outlet. A wafer handler moves the wafer from the inlet to the outlet. An inert gas nozzle (110) allows an inert gas to enter the chamber such that the inert gas combines with the air and flows into the FOUP. Independent claims are also included for the following: (A) a method for processing a wafer (B) an apparatus for manufacturing a semiconductor device, that has a wafer processing apparatus (C) a method for manufacturing a semiconductor device.

6. 发明专利

DE102004008900A8 未知
公开(公告)号：DE102004008900A8
公开(公告)日：2005-05-19
申请号：DE102004008900
申请日：2004-02-24
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： LEE KUN-HYUNG , CHO HYUN-HO , CHAE HEE-SUN , LEE SUN-YONG , LEE SOO-WONG , JUNG JAE-HYUNG
IPC分类号： H01L21/677 , B65G49/07 , H01L21/00 , H01L21/18 , B65B31/04 , H01L21/30
摘要： The module (100) has a flow chamber with air inlet for allowing air to flow in the chamber. A wafer enters the chamber at a wafer inlet coupled to a front opening unified pod (FOUP) (120) and exits the chamber at a wafer outlet. A wafer handler moves the wafer from the inlet to the outlet. An inert gas nozzle (110) allows an inert gas to enter the chamber such that the inert gas combines with the air and flows into the FOUP. Independent claims are also included for the following: (A) a method for processing a wafer (B) an apparatus for manufacturing a semiconductor device, that has a wafer processing apparatus (C) a method for manufacturing a semiconductor device.

7. 发明专利

JP2004260172A Apparatus and method for wafer treatment 有权
标题翻译：用于水处理的装置和方法
公开(公告)号：JP2004260172A
公开(公告)日：2004-09-16
申请号：JP2004043111
申请日：2004-02-19
申请人： Samsung Electronics Co Ltd , 三星電子株式会社
发明人： RI KENKO , CHO HYUN-HO , CHAE HEE-SUN , LEE SUN-YONG , LEE SOO-WOONG , JUNG JAE-HYUNG
IPC分类号： H01L21/677 , B65G49/07 , H01L21/00 , H01L21/68
CPC分类号： H01L21/67017 , H01L21/67772 , Y10S414/14
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method for manufacturing a semiconductor device capable of reducing contaminants. SOLUTION: A wafer transfer apparatus 100 for transferring a wafer from a wafer container 120 to a wafer process treatment apparatus 150 comprises a flow chamber having a first gas inlet part that supplies a first gas and a gas nozzle 110 that is a second gas inlet part that supplies the flow chamber with a second gas, and the second gas flows in a state of being mixed with the first gas, thereby the amount of contaminants that flow into the wafer container 120 is reduced. COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够减少污染物的半导体器件的制造装置和方法。解决方案：用于将晶片从晶片容器120传送到晶片处理装置150的晶片传送装置100包括流动室，其具有供应第一气体的第一气体入口部分和作为第二气体的第二气体喷嘴110 气体入口部分，其向第二气体供应流动室，并且第二气体以与第一气体混合的状态流动，从而减少流入晶片容器120的污染物的量。版权所有（C）2004，JPO＆NCIPI

8. 发明专利

JP2003318147A System for cleaning wafer 有权
标题翻译：清洁系统
公开(公告)号：JP2003318147A
公开(公告)日：2003-11-07
申请号：JP2003074499
申请日：2003-03-18
申请人： Samsung Electronics Co Ltd , 三星電子株式会社
发明人： YEO IN-JUN , KIM KYUNG-HYUN , NAN TEIRIN , IN HEIBUN , CHO HYUN-HO , HAH SANG-ROK
IPC分类号： H01L21/304 , B08B3/02 , B08B3/12 , H01L21/00
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , Y10S134/902 , Y10S438/906
摘要： PROBLEM TO BE SOLVED: To provide a megasonic energy cleaning device in which a cleaning probe can be rotated while a wafer to be cleaned is rotated during a cleaning action.
SOLUTION: The effect of the cleaning action in the cleaning device is effectively increased by rotating the cleaning probe while the wafer is cleaned, and the occurrence of wafer patterning damages is suppressed to the minimum. In order to prevent harmful pulsation which may cause damages to the structure already formed in/on the surface of the wafer, a curved line group such as a spiral group can be formed in the cleaning probe by etching. If the cleaning probe having the curved line group is used while being rotated, particles can be effectively removed from the wafer while the damages to the surface of the wafer can be suppressed.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种兆声波能量清洁装置，其中在清洁动作期间待清洁的晶片旋转的同时可以旋转清洁探针。解决方案：通过在清洁晶片时旋转清洁探针，清洁装置中的清洁作用的效果被有效地提高，并且晶片图案化损坏的发生被抑制到最小。为了防止可能对已经形成在晶片表面上的结构造成损害的有害脉动，可以通过蚀刻在清洗探针中形成诸如螺旋组的曲线组。如果在旋转时使用具有曲线组的清洁探针，则可以有效地从晶片去除颗粒，同时可以抑制对晶片表面的损坏。版权所有（C）2004，JPO

9. 发明专利

JP2003332286A Apparatus and method for cleaning semiconductor wafer 有权
标题翻译：用于清洁半导体波形的装置和方法
公开(公告)号：JP2003332286A
公开(公告)日：2003-11-21
申请号：JP2003098391
申请日：2003-04-01
申请人： Samsung Electronics Co Ltd , 三星電子株式会社
发明人： YEO IN-JUN , IN HEIBUN , KIM KYUNG-HYUN , HAH SANG-ROK , NAN TEIRIN , CHO HYUN-HO
IPC分类号： H01L21/683 , B08B3/12 , C25F1/00 , H01L21/00 , H01L21/302 , H01L21/304 , H01L21/68
CPC分类号： H01L21/67051 , B08B3/12 , Y10S134/902
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method for cleaning a semiconductor wafer. SOLUTION: The apparatus for cleaning the semiconductor wafer includes; a cleaning medium feeding part for feeding a cleaning medium for providing a cleaning medium film onto a surface of the wafer to the surface of the wafer, an energy concentration relieving member positioned at the side of the wafer for extending the cleaning medium film outsides the surface of the wafer; a probe having an elongated stick-like portion positioned across the surface of the energy concentration relieving member and parallel to the surface of the wafer with the cleaning medium film between for feeding acoustic vibrational energy onto the surface of the wafer for cleaning the surface of the wafer; and a vibrator attached to a rear end of the probe for generating vibration for the acoustic vibrational energy. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种用于清洁半导体晶片的装置和方法。解决方案：用于清洁半导体晶片的装置包括：用于将清洁介质膜提供到晶片表面上的清洁介质供给部分的清洁介质供给部分，位于晶片侧面的用于延伸清洁介质膜的能量集中释放部件包围表面的晶片; 具有细长的棒状部分的探针，其横跨能量集中释放部件的表面并且平行于晶片表面与清洁介质膜平齐，用于将声振动能量提供到晶片的表面上，以清洁晶片的表面晶圆以及附接到探针的后端的用于产生声振动能的振动的振动器。版权所有（C）2004，JPO

10. 发明专利

JP2004181455A Pollution control apparatus, air conditioning system for substrate treatment facility using it, outside air conditioning system, and method for controlling air 审中-公开
标题翻译：污染控制装置，使用其的空调处理设备的空调系统，外部空调系统和控制空气的方法
公开(公告)号：JP2004181455A
公开(公告)日：2004-07-02
申请号：JP2003405970
申请日：2003-12-04
申请人： Samsung Electronics Co Ltd , 三星電子株式会社
发明人： KIM HYUN-JOON , CHO HYUN-HO , HAM DONG-SEOK
IPC分类号： F24F7/06 , B01D53/14 , B01D53/18 , C02F1/28 , C02F1/32 , C02F1/42 , C02F9/00 , F24F3/16 , H01L21/02
CPC分类号： F24F3/161
摘要： PROBLEM TO BE SOLVED: To provide an air conditioning system for a substrate treatment facility capable of controlling sources of pollution in the air at one time, keeping the decontamination efficiency constant. SOLUTION: The air conditioning apparatus comprises an injection device 100 having at least one nozzle, at least one stripper 110 for removing the pollutants in the air by making them contact with an injected material from the nozzle, and a circulator 160 connected to the injection device 100 for supplying the injection device 100 with water injected by the nozzle, the circulator 160 including a pH controller 140 for controlling pH of the water supplied to the injection device 100 and an organic substance removing device 145 for removing an organic substance in the water supplied to the injection device 100. COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供能够一次控制空气中的污染源的基板处理设备的空调系统，使净化效率保持不变。解决方案：空调设备包括具有至少一个喷嘴的喷射装置100，至少一个汽提器110，用于通过使其与来自喷嘴的喷射材料接触来除去空气中的污染物;循环器160，连接到用于向注射装置100供给由喷嘴喷射的水的注射装置100，循环器160包括用于控制供给到注射装置100的水的pH的pH控制器140和用于去除有机物质的有机物质去除装置145 供给到注射装置100的水。（C）2004，JPO＆NCIPI

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