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1. 发明申请

WO2004109750A3 WIRING FOR SEMICONDUCTOR DEVICE, THIN FILM TRANSISTOR ARRAY PANEL INCLUDING WIRING, AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：半导体器件布线，薄膜晶体管阵列，包括布线及其制造方法
公开(公告)号：WO2004109750A3
公开(公告)日：2006-01-26
申请号：PCT/KR2004001381
申请日：2004-06-10
申请人： SAMSUNG ELECTRONICS CO LTD , CHO BEOM-SEOK , YANG HEE-JUNG , JEONG CHANG-OH , LEE JAE-GAB , SUNG MYUNG-MO
发明人： CHO BEOM-SEOK , YANG HEE-JUNG , JEONG CHANG-OH , LEE JAE-GAB , SUNG MYUNG-MO
IPC分类号： H01L21/768 , H01L20060101
CPC分类号： B82Y30/00 , B82Y10/00
摘要： A method of manufacturing a thin film panel is provided, which includes: forming a gate line (20) on a substrate (10), the gate line including a gate electrode; forming a gate insulating layer on the gate line; forming a silicon layer formed on the gate insulating layer; forming a data line intersecting the gate line and a drain electrode separated from the data line on the silicon layer or on the gate insulating layer; and forming a self assembled monolayer (SAM) (30) on at least one of the gate line and the data line.
摘要翻译：提供一种制造薄膜面板的方法，其包括：在衬底（10）上形成栅极线（20），所述栅极线包括栅电极; 在栅极线上形成栅极绝缘层; 形成在所述栅绝缘层上的硅层; 形成与所述栅极线相交的数据线和与所述硅层或所述栅极绝缘层上的所述数据线分离的漏电极; 以及在所述栅极线和所述数据线中的至少一个上形成自组装单层（SAM）（30）。

2. 发明专利

GB2326052A Portable communication terminal having dual opposing flip covers 未知
公开(公告)号：GB2326052A
公开(公告)日：1998-12-09
申请号：GB9811774
申请日：1998-06-02
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： LEE JAE-GAB
IPC分类号： H04M1/02 , H04M1/03 , H04Q7/32
摘要： A portable telephone has dual opposing flip covers 40,200. The telephone includes a body 10 having a plurality of function keys, and an LCD window, a first flip cover 200 connected to a lower portion of the body, a microphone positioned in the first flip cover to be connected to the body, a second flip cover 40 connected to an upper portion of the body, and a speaker positioned in the second flip cover to be connected to the body.

3. 发明专利

AU2002367339A1 A THIN FILM TRANSISTOR ARRAY PANEL AND A METHOD FOR MANUFACTURING THE SAME 未知
公开(公告)号：AU2002367339A1
公开(公告)日：2003-07-24
申请号：AU2002367339
申请日：2002-07-02
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： CHO BEOM-SEOK , JEONG CHANG-OH , LEE JAE-GAB , KANG BONG-JOO
IPC分类号： G02F1/1368 , H01L21/28 , H01L21/3205 , H01L21/336 , H01L21/77 , H01L21/84 , H01L23/52 , H01L27/12 , H01L29/423 , H01L29/45 , H01L29/49 , H01L29/786 , H01L51/50
摘要： A thin film transistor array panel includes an insulating substrate, a gate wire formed on the insulating substrate. A gate insulating layer covers the gate wire. A semiconductor pattern is formed on the gate insulating layer. A data wire having source electrodes, drain electrodes and data lines is formed on the gate insulating layer and the semiconductor pattern. A protective layer is formed on the data wire. Pixel electrodes connected to the drain electrode via contact holes are formed on the protective layer. The gate wire and the data wire are made of Ag alloy containing Ag and an additive including at least one selected from Zn, In, Sn and Cr.

4. 发明专利

DE60303531T2 未知
公开(公告)号：DE60303531T2
公开(公告)日：2006-09-21
申请号：DE60303531
申请日：2003-05-08
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： LEE JAE-GAB , BAE JONG-GUN
IPC分类号： H04B1/38 , H04M1/02
摘要： A sliding-type portable wireless terminal that has a main body, and a sub body that longitudinally slides on the main body to open from and close into the main body. The sliding-type portable wireless terminal comprises a spring module that is fixed to the main body and includes torsion springs for supplying a sliding force in a direction of closing the sub body into the main body when the sub body is downwardly slid on the main body by a designated distance in the direction of closing the sub body into the main body, and supplying a sliding force in a direction of opening the sub body from the main body when the sub body is upwardly slid on the main body by the designated distance in the direction of opening the sub body from the main body. The sliding-type portable wireless terminal uses the torsion springs as means for sliding the sub body on the main body, thereby ensuring a smooth sliding motion of the sub body. In addition, the sliding-type portable wireless terminal use the torsion springs having a small height, thereby manufacturing the spring module with a slim size and being advantageous in terms of the miniaturization of the terminal.

5. 发明专利

DE60303531D1 未知
公开(公告)号：DE60303531D1
公开(公告)日：2006-04-20
申请号：DE60303531
申请日：2003-05-08
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： LEE JAE-GAB , BAE JONG-GUN
IPC分类号： H04B1/38 , H04M1/02
摘要： A sliding-type portable wireless terminal that has a main body, and a sub body that longitudinally slides on the main body to open from and close into the main body. The sliding-type portable wireless terminal comprises a spring module that is fixed to the main body and includes torsion springs for supplying a sliding force in a direction of closing the sub body into the main body when the sub body is downwardly slid on the main body by a designated distance in the direction of closing the sub body into the main body, and supplying a sliding force in a direction of opening the sub body from the main body when the sub body is upwardly slid on the main body by the designated distance in the direction of opening the sub body from the main body. The sliding-type portable wireless terminal uses the torsion springs as means for sliding the sub body on the main body, thereby ensuring a smooth sliding motion of the sub body. In addition, the sliding-type portable wireless terminal use the torsion springs having a small height, thereby manufacturing the spring module with a slim size and being advantageous in terms of the miniaturization of the terminal.

6. 发明专利

AU2003215959A1 THIN FILM TRANSISTOR SUBSTRATE AND METHOD FOR FORMING METAL WIRE THEREOF 未知
公开(公告)号：AU2003215959A1
公开(公告)日：2004-07-29
申请号：AU2003215959
申请日：2003-03-26
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： LEE JAE-GAB , JEONG CHANG-OH , SUNG MYUNG-MO , YANG HEE-JUNG , CHO BEOM-SEOK
IPC分类号： G02F1/1362 , H01L21/77 , H01L21/84 , H01L27/12 , H01L29/45 , H01L29/49 , H01L29/786 , H01L51/20 , H01L29/78
摘要： The present invention relates to a thin film transistor substrate and a metal wiring method thereof, more particularly to a thin film transistor substrate comprising self-assembled monolayers between the substrate and the metal wiring, and a metal wiring thereof. Since a thin film transistor substrate of the present invention comprises three-dimensionally cross-linked self-assembled monolayers between the Si surface and the metal wiring, it has good adhesion ability and anti-diffusion ability.

7. 发明专利

GB2326052B Portable communications terminal having dual opposing flip covers 未知
公开(公告)号：GB2326052B
公开(公告)日：1999-08-18
申请号：GB9811774
申请日：1998-06-02
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： LEE JAE-GAB
IPC分类号： H04M1/02 , H04M1/03 , H04Q7/32
摘要： A portable terminal having dual opposing flip covers. The portable terminal includes a body having a plurality of function keys, and an LCD window, a first flip cover folding device in a lower portion of the body, a first flip cover connected to the first flip cover folding device, a microphone positioned in the first flip cover to be connected to the body, a second flip cover folding device in an upper portion of the body, a second flip cover connected to the second flip cover folding device, and a speaker positioned in the second flip cover to be connected to the body.

8. 发明专利

JP2002328629A WIRING AND METHOD OF MANUFACTURING THE SAME, AS WELL AS THIN-FILM TRANSISTOR SUBSTRATE INCLUDING THE WIRING AND METHOD OF MANUFACTURING THE SAME 审中-公开
公开(公告)号：JP2002328629A
公开(公告)日：2002-11-15
申请号：JP2001212621
申请日：2001-07-12
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： JEONG CHANG-OH , KANG BONG-JOO , LEE JAE-GAB , CHO BEOM-SEOK
IPC分类号： G02F1/1345 , G02F1/1362 , G02F1/1368 , G09F9/00 , G09F9/30 , H01L21/3205 , H01L21/336 , H01L21/77 , H01L21/84 , H01L23/52 , H01L23/532 , H01L27/12 , H01L29/43 , H01L29/49 , H01L29/786
摘要： PROBLEM TO BE SOLVED: To provide wiring having a low resistance and simultaneously having excellent adhesive strength and a method of manufacturing the same, as well as a thin-film transistor array substrate having the wiring and a method of manufacturing the same. SOLUTION: This wiring for display device is formed in the upper part of a silicon or glass substrate and includes thin films consisting of silver or silver alloy.

9. 发明专利

JP2002151434A INTERCONNECTION FOR DISPLAY ELEMENT, THIN FILM TRANSISTOR SUBSTRATE USING THE SAME AND METHOD OF MANUFACTURING THE SUBSTRATE 审中-公开
公开(公告)号：JP2002151434A
公开(公告)日：2002-05-24
申请号：JP2001231153
申请日：2001-07-31
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： JEONG CHANG-OH , LEE JAE-GAB , CHO BEOM-SEOK
IPC分类号： G02F1/1343 , C22C5/06 , C23C14/34 , G02F1/1362 , G02F1/1368 , H01B1/02 , H01L21/28 , H01L21/3205 , H01L21/77 , H01L21/84 , H01L23/52 , H01L23/532 , H01L27/12 , H01L29/786
摘要： PROBLEM TO BE SOLVED: To provide an interconnection for display element having an improved physical adhesion and a good electrical contact resistance, and also to provide a thin film transistor substrate using the same and a method of manufacturing the substrate. SOLUTION: The interconnection for display element is formed of an Ag alloy with at least one alloy element of a low melting point metal. In a liquid- crystal display panel, by forming gate interconnections 22, 24, and 26 and data interconnections 65, 66, and 68 using such interconnections for display element, it is prevented that corrosion occurs in a process of connecting these interconnections to other conductive material in a contact section and characteristics of the element are degraded.

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