专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

KR100771872B1 SENSING SYSTEM OF SHAPE OF CHIP AND METHOD OF SENSING USING THE SAME 无效
标题翻译：芯片形状感应系统及其使用方法
公开(公告)号：KR100771872B1
公开(公告)日：2007-11-01
申请号：KR20060048307
申请日：2006-05-29
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： HAN DONG CHUL , WOO JUNG HWAN , KO YOUN SUNG
IPC分类号： H01L21/66
CPC分类号： G01B11/24 , G01B11/245
摘要： A system for sensing a shape of a chip and a sensing method using the same are provided to discern accurately the shape of the chip by utilizing a lower illuminating part disposed under a chip, and to determine the shape of the chip by using binary image. At least one chip(122) is attached to a support plate(120) made of a polymer film, and a lower illuminating part(112) is disposed under the support plate to emit light that transmits the support plate. A light sensing part(140) detects the light transmitting the support plate. The lower illuminating part has a light source(114) and a light guide layer(116) housing the light source and guiding the light emitted from the light source.
摘要翻译：提供一种用于感测芯片形状的系统和使用其的感测方法，通过利用设置在芯片下方的下部照明部分来精确地识别芯片的形状，并且通过使用二进制图像来确定芯片的形状。至少一个芯片（122）附接到由聚合物膜制成的支撑板（120）上，并且下部照明部分（112）设置在支撑板下方以发射透射支撑板的光。光检测部分（140）检测透射支撑板的光。下照明部分具有容纳光源并引导从光源发射的光的光源（114）和导光层（116）。

2. 发明公开

KR20070120319A APPARATUS HAVING A PAIR OF EJECTORS FOR DETACHING SEMICONDUCTOR CHIPS AND METHOD OF DETACHING SEMICONDUCTOR CHIPS USING THE APPARATUS 审中-公开
标题翻译：具有用于分离半导体芯片的喷射器对的装置和使用装置分离半导体芯片的方法
公开(公告)号：KR20070120319A
公开(公告)日：2007-12-24
申请号：KR20060054922
申请日：2006-06-19
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： KO YOUN SUNG , BYUN HAK KYOON , WOO JUNG HWAN , SONG HYUN JUNG
IPC分类号： H01L21/683 , H01L21/60
CPC分类号： H01L21/67132 , H01L21/67092 , Y10T29/41 , Y10T29/49815 , Y10T29/49819 , Y10T29/49824 , Y10T29/53091 , Y10T29/53187 , Y10T29/53274
摘要： An apparatus for attaching or detaching a semiconductor chip with a pair of ejectors is provided to suppress or reduce the generation of crack in the semiconductor chip by raising ejectors in two steps so that the pressure applied to the semiconductor chip is lowered. A holder(110) has an upper surface for mounting at least one semiconductor chip attached to the surface of tape wherein the upper surface has a through hole. A first ejector moves up and down by a first length through the through hole of the holder so as to push up the semiconductor chip on the holder. A second ejector moves up and down by a second length greater than the first length through the through hole of the holder so as to push the semiconductor chip on the holder. Power is commonly transferred to the first and second ejectors by a shaft(150).
摘要翻译：提供一种用一对喷射器安装或拆卸半导体芯片的装置，以通过两个步骤中的喷射器来抑制或减少半导体芯片中的裂纹的产生，使得施加到半导体芯片的压力降低。保持器（110）具有用于安装至少一个半导体芯片的上表面，所述至少一个半导体芯片附接到带的表面，其中上表面具有通孔。第一喷射器通过保持器的通孔上下移动第一长度，以将半导体芯片推到保持器上。第二喷射器通过保持器的通孔上下移动大于第一长度的第二长度，以将半导体芯片推到保持器上。功率通常由轴（150）传递到第一和第二喷射器。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式