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    • 3. 发明公开
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • KR20070079115A
    • 2007-08-06
    • KR20060009536
    • 2006-02-01
    • SAMSUNG ELECTRONICS CO LTD
    • NOH JIN TAEYANG SANG RYOLHWANG KI HYUNKIM JIN GYUNLEE SUNG HAEKIM HONG SUK
    • H01L21/336
    • A method for manufacturing a semiconductor device is provided to control effectively off-current of a cell transistor by increasing a work function of a gate electrode. A gate insulating layer(102) and a polysilicon layer doped with a P type impurity are formed on a substrate(100) including a cell area having a pin type active area and a peri/core area including a flat type active area. A photoresist pattern for exposing an NMOS transistor region of the peri/core area is formed on the polysilicon layer doped with the P type impurity. The exposed polysilicon layer is converted to an N type impurity-doped polysilicon layer by counter-doping an N type impurity on the polysilicon layer. A first polysilicon pattern(110) doped with the P type impurity, a second polysilicon pattern(112) doped with the P type impurity, and a third polysilicon pattern(114) doped with the N type impurity are formed by patterning the polysilicon layer doped with the P type impurity and the N type impurity. Source/drains are formed at both sides of the first to the third polysilicon patterns.
    • 提供一种用于制造半导体器件的方法,通过增加栅电极的功函数来有效地控制单元晶体管的截止电流。 在包括具有引脚型有源区域的单元区域和包括平面型有源区域的区域/核心区域的基板(100)上形成栅极绝缘层(102)和掺杂有P型杂质的多晶硅层。 在掺杂有P型杂质的多晶硅层上形成用于暴露周边/核心区域的NMOS晶体管区域的光致抗蚀剂图案。 曝光的多晶硅层通过在多晶硅层上相互掺杂N型杂质而转换成N型杂质掺杂多晶硅层。 掺杂有P型杂质的第一多晶硅图案(110),掺杂有P型杂质的第二多晶硅图案(112)和掺杂有N型杂质的第三多晶硅图案(114)通过将多晶硅层掺杂 具有P型杂质和N型杂质。 源极/漏极形成在第一至第三多晶硅图案的两侧。
    • 5. 发明公开
    • Semiconductor devices and methods of manufacturing semiconductor devices
    • 半导体器件及制造半导体器件的方法
    • KR20120027906A
    • 2012-03-22
    • KR20100089752
    • 2010-09-14
    • SAMSUNG ELECTRONICS CO LTD
    • YANG JUN KYUKIM HONG SUKLEE JU YULHWANG KI HYUNAHN JAE YOUNG
    • H01L27/115H01L21/8247
    • H01L21/28247H01L21/28273H01L21/764H01L27/11568H01L27/11521
    • PURPOSE: A semiconductor device and a manufacturing method thereof are provided to protect a metal film pattern by a capping film pattern, thereby preventing whisker on the metal film pattern. CONSTITUTION: A plurality of gate structures(200) include tunnel insulation film patterns, dielectric patterns, and control gates respectively. The tunnel insulation film patterns, the dielectric patterns, and the control gates are sequentially stacked. A control gate comprises a poly silicon film pattern and a metal film pattern in which impurities are doped. A capping film pattern(182) is formed on a sidewall of a pattern of each metal film. The capping film pattern includes a metal oxide. An insulation film is formed on the substrate while the insulation film covers gate structures and the capping film pattern. The insulation film has an air gap(212).
    • 目的:提供一种半导体器件及其制造方法,以通过覆盖膜图案保护金属膜图案,从而防止金属膜图案上的晶须。 构成:多个栅极结构(200)分别包括隧道绝缘膜图案,电介质图案和控制栅。 隧道绝缘膜图案,电介质图案和控制栅极依次层叠。 控制栅极包括掺杂杂质的多晶硅图案和金属膜图案。 在每个金属膜的图案的侧壁上形成覆盖膜图案(182)。 封盖膜图案包括金属氧化物。 绝缘膜形成在基板上,而绝缘膜覆盖栅极结构和封盖膜图案。 绝缘膜具有气隙(212)。