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    • 4. 发明申请
    • ELECTRONIC DEVICE
    • 电子设备
    • US20110122595A1
    • 2011-05-26
    • US12853126
    • 2010-08-09
    • Toshikazu SHIROISHITomohiro HAMADAToshio KONNOKohei WADARyosuke SAITO
    • Toshikazu SHIROISHITomohiro HAMADAToshio KONNOKohei WADARyosuke SAITO
    • H05K9/00
    • H05K9/0045G06F1/1616G06F1/1656
    • According to one embodiment, an electronic device includes a housing which has a shielding layer on its inner surface and is provided with an opening, a housed component which is contained inside the housing, and a module which is provided at the exterior of the housing, and has a first conducting section that is electrically connected to the housed component and a second conducting section that is different from the first conducting section. The electronic device includes a connection portion, and the connection portion has a contact portion and an elastic support portion which is extended to a part near the opening and supports the contact portion. The contact portion equalizes the potential of the shielding layer with the potential of the second conducting section by electrically connecting to the shielding layer by the opening, and contacting the second conducting section.
    • 根据一个实施例,一种电子设备包括壳体,其在其内表面上具有屏蔽层并且设置有开口,容纳在壳体内部的容纳部件和设置在壳体外部的模块, 并且具有电连接到所容纳的部件的第一导电部分和与第一导电部分不同的第二导电部分。 电子设备包括连接部分,并且连接部分具有接触部分和弹性支撑部分,该部分延伸到靠近开口的部分并且支撑接触部分。 接触部分通过由开口与屏蔽层电连接并与第二导电部分接触来使屏蔽层的电位与第二导电部分的电位相等。