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1. 发明授权

US06563710B1 Electronic device, panel device, and supporting rail 失效
标题翻译：电子设备，面板设备和支撑轨
公开(公告)号：US06563710B1
公开(公告)日：2003-05-13
申请号：US09647220
申请日：2000-12-01
申请人： Ryoichi Okuda , Tetsuya Waniishi
发明人： Ryoichi Okuda , Tetsuya Waniishi
IPC分类号： H05K720
CPC分类号： H05K7/20918 , H02B1/042 , H02B1/052 , H02B1/56
摘要： A rear opening of a housing 1 is covered by a first plate member portion 35 of a member 4. Heat generating elements 26 and 31 are mounted on a second plate member portions 36 of the member 4, which are elongated from the first plate member portion 35 and which are positioned in the housing 1, thereby causing the back face of the first plate member portion 35 to face the outside of the housing 1. A support rail attaching portion 38 is disposed on the back face. The first plate member portion 35 is grounded via a DIN rail 34 attached to the portion. Even when the housing is configured by a resin, therefore, heat generated by the heat generating elements in the housing can be efficiently discharged to the outside of the housing, with the result that an electronic device of excellent heat radiating properties is obtained.
摘要翻译：壳体1的后开口由构件4的第一板构件部分35覆盖。发热元件26和31安装在构件4的第二板构件部分36上，第二板构件部分36从第一板构件部分并且它们位于壳体1中，从而使第一板构件部分35的背面面向壳体1的外部。支撑轨安装部分38设置在背面上。第一板构件部分35经由安装在该部分上的DIN导轨34接地。因此，即使由树脂构成壳体，也能够将壳体内的发热元件产生的热量有效地排出到壳体外部，从而得到散热性优异的电子设备。

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