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    • 1. 发明授权
    • Substrate cleaning system
    • 基材清洗系统
    • US06763839B2
    • 2004-07-20
    • US09871250
    • 2001-06-01
    • Ryoichi OhkuraYuji OnoHiroshi YamaguchiMiyuki TakaishiHideo Kamikochi
    • Ryoichi OhkuraYuji OnoHiroshi YamaguchiMiyuki TakaishiHideo Kamikochi
    • B08B300
    • H01L21/67196H01L21/67017H01L21/67766H01L21/67781Y10S134/902
    • A substrate cleaning system for cleaning wafers using a sheet-type wet cleaning treatment. The system has a sealable system body, a loading/unloading booth having a substrate carry-in section in which a plurality of substances are stocked to be carried in before a cleaning treatment is applied to them and a substrate carry-out section in which a plurality of substrates are stocked to be carried out after the cleaning treatment is applied, a processing booth provided with at least one sheet-type substrate cleaning chamber in which the cleaning treatment can be applied to a plurality of substrates by a plurality of cleaning solutions, and a robot booth provided with a transport robot for transporting the substrates one by one between the processing booth and the loading/unloading booth, the respective booths having partition walls.
    • 一种用于使用片式湿式清洗处理来清洗晶片的基板清洁系统。 该系统具有可密封的系统主体,一个装载/卸载舱,具有一个基板输入部分,在该部分中多个物质被储存在其上施加清洁处理之前被运载;以及基板执行部分,其中 在施加清洁处理之后,多个基板被储存以进行,设置有至少一个片状基板清洁室的处理室,其中可以通过多个清洁溶液将清洁处理应用于多个基板, 以及设置有运送机器人的机器人展位台,用于在处理室和装卸台之间逐一运送基板,各个展位具有分隔壁。