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1. 发明申请

US20060014873A1 Encapsulating epoxy resin composition, and electronic parts device using the same 审中-公开
标题翻译：封装环氧树脂组合物和使用其的电子部件装置
公开(公告)号：US20060014873A1
公开(公告)日：2006-01-19
申请号：US10504513
申请日：2003-01-14
申请人： Ryoichi Ikezawa , Takayuki Akimoto , Yoshihiro Takahashi , Mitsuo Katayose
发明人： Ryoichi Ikezawa , Takayuki Akimoto , Yoshihiro Takahashi , Mitsuo Katayose
IPC分类号： C08K3/22
CPC分类号： H01L23/296 , C08K3/22 , H01L24/73 , H01L2224/05554 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/13034 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , C08L63/00 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： There is disclosed an encapsulating epoxy resin composition, containing an epoxy resin (A), a curing agent (B), and a composite metal hydroxide (C), and having a disk flow greater than or equal to 80 mm. The resin composition is preferably applied for encapsulating a semiconductor device having at least one of features including: (a) at least one of an encapsulating material of an upper side of a semiconductor chip and an encapsulating material of a lower side of the semiconductor chip has a thickness less than or equal to 0.7 mm; (b) a pin count is greater than or equal to 80; (c) a wire length is greater than or equal to 2 mm; (d) a pad pitch on the semiconductor chip is less than or equal to 90 μm; (e) a thickness of a package, in which the semiconductor chip is disposed on a mounting substrate, is less than or equal to 2 mm; and (f) an area of the semiconductor chip is greater than or equal to 25 mm2.
摘要翻译：公开了包含环氧树脂（A），固化剂（B）和复合金属氢氧化物（C），并且具有大于或等于80mm的盘流动的封装环氧树脂组合物。树脂组合物优选地用于封装具有以下特征中的至少一个的半导体器件：（a）半导体芯片的上侧的封装材料和半导体芯片的下侧的封装材料中的至少一个具有厚度小于或等于0.7mm; （b）引脚数大于或等于80; （c）电线长度大于或等于2mm; （d）半导体芯片上的焊盘间距小于或等于90μm; （e）半导体芯片设置在安装基板上的封装的厚度小于或等于2mm; 和（f）半导体芯片的面积大于或等于25mm 2。

2. 发明申请

US20050222300A1 Encapsulating epoxy resin composition, and electronic parts device using the same 审中-公开
标题翻译：封装环氧树脂组合物和使用其的电子部件装置
公开(公告)号：US20050222300A1
公开(公告)日：2005-10-06
申请号：US10505008
申请日：2003-01-14
申请人： Ryoichi Ikezawa , Takayuki Akimoto , Yoshihiro Takahashi , Mitsuo Katayose , Naoki Watanabe , Shinya Nakamura
发明人： Ryoichi Ikezawa , Takayuki Akimoto , Yoshihiro Takahashi , Mitsuo Katayose , Naoki Watanabe , Shinya Nakamura
IPC分类号： C08G65/26 , H01L23/29 , C08L63/00
CPC分类号： C08G65/2654 , H01L23/296 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/13034 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： There is disclosed an encapsulating epoxy resin composition, containing an epoxy resin (A), a curing agent (B), and a composite metal hydroxide (C), and having a mold release force under shearing after 10 shots of molding which is less than or equal to 200 KPa. The resin composition is preferably applied for encapsulating a semiconductor device having at least one of features including: (a) at least one of an encapsulating material of an upper side of a semiconductor chip and an encapsulating material of a lower side of the semiconductor chip has a thickness less than or equal to 0.7 mm; (b) a pin count is greater than or equal to 80; (c) a wire length is greater than or equal to 2 mm; (d) a pad pitch on the semiconductor chip is less than or equal to 90 (m; (e) a thickness of a package, in which the semiconductor chip is disposed on a mounting substrate, is less than or equal to 2 mm; and (f) an area of the semiconductor chip is greater than or equal to 25 mm2.
摘要翻译：公开了一种包含环氧树脂（A），固化剂（B）和复合金属氢氧化物（C）的封装环氧树脂组合物，并且在10次成型后具有在剪切下的脱模力小于或等于200KPa。树脂组合物优选地用于封装具有以下特征中的至少一个的半导体器件：（a）半导体芯片的上侧的封装材料和半导体芯片的下侧的封装材料中的至少一个具有厚度小于或等于0.7mm; （b）引脚数大于或等于80; （c）电线长度大于或等于2mm; （d）半导体芯片上的焊盘间距小于或等于90（m;（e）半导体芯片设置在安装基板上的封装的厚度小于或等于2mm; 和（f）半导体芯片的面积大于或等于25mm 2。

3. 发明授权

US11597217B2 Sheet conveyor, sheet heater, liquid discharge apparatus, and printer 有权
公开(公告)号：US11597217B2
公开(公告)日：2023-03-07
申请号：US17477757
申请日：2021-09-17
申请人： Kazuaki Kamihara , Masato Ogawa , Kohki Asada , Hiroshi Sawase , Yoshihiro Takahashi , Ryusaku Hida
发明人： Kazuaki Kamihara , Masato Ogawa , Kohki Asada , Hiroshi Sawase , Yoshihiro Takahashi , Ryusaku Hida
IPC分类号： B41J11/00 , B41J11/42
摘要： A sheet conveyor includes an endless conveyance belt configured to rotate to convey a sheet, a belt heater configured to heat the conveyance belt; and circuitry configured to control the conveyance belt to rotate. The conveyance belt has a belt joint joining both ends of a sheet member to form the conveyance belt, and the circuitry controls the conveyance belt to rotate to receive the sheet in an area of the conveyance belt other than the belt joint of the conveyance belt.

4. 发明授权

US09594957B2 Apparatus and method for identifying a still image contained in moving image contents 有权
标题翻译：用于识别运动图像内容中包含的静止图像的装置和方法
公开(公告)号：US09594957B2
公开(公告)日：2017-03-14
申请号：US13639044
申请日：2011-04-04
申请人： Kazumasa Tanaka , Kenji Tanaka , Yoshihiro Takahashi
发明人： Kazumasa Tanaka , Kenji Tanaka , Yoshihiro Takahashi
IPC分类号： G06K9/54 , G06K9/00 , G06F17/30 , G11B27/10 , G11B27/28 , G11B27/34 , H04N21/482 , H04N21/81
CPC分类号： G06K9/00758 , G06F17/30781 , G06F17/3079 , G06K9/00711 , G11B27/105 , G11B27/28 , G11B27/34 , H04N21/4828 , H04N21/8153
摘要： Apparatus for identifying one or more still images in one or more moving image contents. An identifying unit is configured to identify one or more still images included in the moving image contents having one or more features that closely resemble particular features. A display controller is configured to cause the display on a timeline associated with the moving image contents of the location of an identified still image in at least one of the moving image contents.
摘要翻译：用于识别一个或多个运动图像内容中的一个或多个静止图像的装置。识别单元被配置为识别包括在具有与特定特征非常相似的一个或多个特征的运动图像内容中的一个或多个静止图像。显示控制器被配置为使得显示在与至少一个运动图像内容中的所识别的静止图像的位置的运动图像内容相关联的时间线上。

5. 发明授权

US09405281B2 Load torque estimation apparatus, image forming apparatus, load torque estimation method and non-transitory computer-readable information recording medium 有权
标题翻译：负载转矩估计装置，图像形成装置，负载转矩估计方法和非暂时计算机可读信息记录介质
公开(公告)号：US09405281B2
公开(公告)日：2016-08-02
申请号：US14480763
申请日：2014-09-09
申请人： Takeo Seki , Yoshihiro Takahashi
发明人： Takeo Seki , Yoshihiro Takahashi
IPC分类号： G05B13/02 , G03G15/16 , G03G21/16
CPC分类号： G05B13/02 , G03G15/1615 , G03G21/1647 , G03G2221/1657 , G05B13/042
摘要： A load torque estimation apparatus inputs a controlling value for controlling the electric motor and an actually measured value of a rotational speed of the electric motor to a model to estimate load torque of the electric motor; and derives a mechanical time constant of the electric motor corresponding to the load torque estimated by the estimation part. The load torque estimation apparatus updates the mechanical time constant included in the model by using the mechanical time constant corresponding to the load torque estimated at an (n−1)th control period (where n denotes an integer greater than or equal to 2) and estimates the load torque of the electric motor at an nth control period by inputting the controlling value and the actually measured value acquired at the nth control period to the model acquired through the updating.
摘要翻译：负载转矩估计装置将用于控制电动机的控制值和电动机的转速的实际测量值输入到模型以估计电动机的负载转矩; 并导出与由估计部估计的负载转矩相对应的电动机的机械时间常数。负载转矩估计装置通过使用与在第（n-1）个控制周期（其中n表示大于或等于2的整数）估计的负载转矩相对应的机械时间常数来更新包括在模型中的机械时间常数，以及通过将在第n个控制周期获取的控制值和实际测量值输入到通过更新获得的模型，来估计第n个控制周期的电动机的负载转矩。

6. 发明授权

US08620971B2 Image processing apparatus, image processing method, and program 有权
标题翻译：图像处理装置，图像处理方法和程序
公开(公告)号：US08620971B2
公开(公告)日：2013-12-31
申请号：US13079347
申请日：2011-04-04
申请人： Kenji Tanaka , Kunio Kawaguchi , Kazumasa Tanaka , Yoshihiro Takahashi , Daisuke Kikuchi , Naohide Yamada , Hiroyuki Morisaki
发明人： Kenji Tanaka , Kunio Kawaguchi , Kazumasa Tanaka , Yoshihiro Takahashi , Daisuke Kikuchi , Naohide Yamada , Hiroyuki Morisaki
IPC分类号： G06F7/00
CPC分类号： G06F17/30781 , G06F17/30017 , G06F17/30271
摘要： An image processing apparatus includes: a database configured to, out of images extracted with a first frequency from the images making up a moving image content, register first layer summary data of a first size; a distance calculation block configured to calculate the distance between the first layer summary data based on the distance between vectors of which the elements are formed by the first layer summary data registered in the database; and a classification section configured to cluster into the same class the first layer summary data between which the distance calculated by the distance calculation block falls within a predetermined distance, the classification section further clustering moving image contents into a plurality of classes based on the classes into which the first layer summary data have been clustered.
摘要翻译：一种图像处理装置，包括：数据库，被配置为从构成运动图像内容的图像中的从第一频率提取的图像中，注册第一尺寸的第一层摘要数据; 距离计算块，其被配置为基于由所述数据库中登记的第一层摘要数据形成所述元素的向量之间的距离来计算所述第一层摘要数据之间的距离; 以及分类部，其将所述距离计算部计算出的距离落在预定距离内的第一层摘要数据进行聚类，所述分类部根据所述类别将运动图像内容进行聚类为多个类别第一层摘要数据已被聚集。

7. 发明申请

US20120276392A1 THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION VARNISH, PREPREG AND LAMINATE 审中-公开
标题翻译：热固性树脂组合物，用于生产树脂组合物变性的方法，PREPREG和层压体
公开(公告)号：US20120276392A1
公开(公告)日：2012-11-01
申请号：US13518578
申请日：2010-12-24
申请人： Yoshihiro Takahashi , Yasuo Kamigata , Hikari Murai , Masahiro Aoshima , Shinji Tsuchikawa , Masato Miyatake , Tomohiko Kotake , Hiroyuki Izumi
发明人： Yoshihiro Takahashi , Yasuo Kamigata , Hikari Murai , Masahiro Aoshima , Shinji Tsuchikawa , Masato Miyatake , Tomohiko Kotake , Hiroyuki Izumi
IPC分类号： C08K5/3415 , C09D163/00 , B32B15/092 , B05D5/00 , B32B15/08 , C08L63/00 , B32B37/14
CPC分类号： C09D163/04 , B32B15/08 , B32B27/04 , B32B27/18 , C08J5/24 , C08J2300/24 , C08J2363/00 , C08K3/013 , C08K3/22 , C08K3/34 , C08K3/36 , C08K5/3415 , C08K13/02 , C08K2003/2206 , C08K2003/2227 , C08K2003/2255 , C08K2003/2296 , C08L63/00 , C09D7/61 , C09D7/63 , C09D163/00 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K3/0047 , H05K2201/0129 , H05K2201/0209 , Y10T156/10 , Y10T428/31529 , Y10T428/31678
摘要： Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.
摘要翻译：公开了含有包含具有特定化学结构的不饱和马来酰亚胺化合物，热固性树脂，无机填料和钼化合物的马来酰亚胺化合物的热固性树脂组合物; 通过用含有热固性树脂，二氧化硅和特定的钼化合物的热固性树脂组合物涂覆基底材料然后进行半固化以形成预浸料而获得的布线板层叠板，并且对预浸料进行层压和模塑; 以及包括特定步骤的树脂组合物清漆的制造方法。根据本发明，可以提供具有低热膨胀性能和优异的钻孔加工性和耐热性的电子部件，例如预浸料，层压板，插入件等。

8. 发明授权

US08179098B2 Charge controlling semiconductor integrated circuit 有权
标题翻译：充电控制半导体集成电路
公开(公告)号：US08179098B2
公开(公告)日：2012-05-15
申请号：US12551781
申请日：2009-09-01
申请人： Gentaro Kurokawa , Yoshihiro Takahashi
发明人： Gentaro Kurokawa , Yoshihiro Takahashi
IPC分类号： H02J7/00 , H02J7/06 , H02M3/06
CPC分类号： H02J7/0029 , H02M2001/322 , Y10T307/516 , Y10T307/615 , Y10T307/625
摘要： Disclosed is a charge controlling semiconductor integrated circuit including: an electric current controlling transistor connected between a voltage input terminal and an output terminal to control an electric current which flows from the voltage input terminal to the output terminal; a power source monitoring circuit to detect status of input voltage of the voltage input terminal; and a transistor element connected between the voltage input terminal and a ground potential point, wherein a bypass capacitor is connected to the voltage input terminal; and the transistor element is turned on and the bypass capacitor discharges when the power source monitoring circuit detects the input voltage of the voltage input terminal is cut off.
摘要翻译：公开了一种充电控制半导体集成电路，包括：电流控制晶体管，连接在电压输入端子和输出端子之间，用于控制从电压输入端子流向输出端子的电流; 电源监视电路，用于检测电压输入端的输入电压状态; 以及连接在所述电压输入端子与地电位点之间的晶体管元件，其中旁路电容器连接到所述电压输入端子; 并且当电源监视电路检测到电压输入端子的输入电压被切断时，晶体管元件导通，旁路电容器放电。

9. 发明申请

US20120111042A1 HEAT PUMP APPARATUS 有权
标题翻译：热泵装置
公开(公告)号：US20120111042A1
公开(公告)日：2012-05-10
申请号：US13384680
申请日：2010-01-15
申请人： Mamoru Hamada , Fumitake Unezaki , Yoshihiro Takahashi , Kengo Takahashi , Kazuki Okada , Hirokazu Minamisako , Shinichi Uchino
发明人： Mamoru Hamada , Fumitake Unezaki , Yoshihiro Takahashi , Kengo Takahashi , Kazuki Okada , Hirokazu Minamisako , Shinichi Uchino
IPC分类号： F25B49/00
CPC分类号： F25B47/025 , F24F11/41 , F25B13/00 , F25B49/02 , F25B2400/0411 , F25B2600/01 , F25B2600/021 , F25B2600/2501 , F25B2600/2513 , F25B2600/2521 , F25B2700/21151 , F25B2700/21163 , Y02B30/741
摘要： In a heat pump apparatus, it is aimed to enhance efficiency of a defrost operation by reducing a loss of heat radiation during the defrost operation and reducing a compressor input during the defrost operation. The heat pump apparatus includes a main refrigerant circuit in which a compressor, a first heat exchanger, an expansion mechanism, and a second heat exchanger are connected sequentially, and also includes a bypass circuit including an on-off valve and providing a connection by bypassing the expansion mechanism. The main refrigerant circuit includes a four-way valve that switches between a heating operation and the defrost operation by switching an order in which the refrigerant circulates through the main refrigerant circuit. The main refrigerant circuit also includes a first temperature detection unit and a second temperature detection unit. Based on values detected by these temperature detection units, a degree of superheat of the first heat exchanger during the defrost operation is computed. When the heating operation is switched to the defrost operation, the heat pump apparatus increases a circulation amount of the refrigerant circulating through the refrigerant circuit by opening the on-off valve, and also controls an operation frequency of the compressor such that the degree of superheat is at a predetermined target value.
摘要翻译：在热泵装置中，旨在通过减少除霜操作期间的热辐射损失来提高除霜操作的效率，并且在除霜操作期间减少压缩机输入。热泵装置包括：主制冷剂回路，其中压缩机，第一热交换器，膨胀机构和第二热交换器依次连接，并且还包括旁通回路，旁路回路包括开关阀，并通过旁路提供连接扩张机制。主制冷剂回路包括四通阀，其通过切换制冷剂通过主制冷剂回路循环的顺序而在加热操作和除霜操作之间切换。主制冷剂回路还包括第一温度检测单元和第二温度检测单元。基于这些温度检测单元检测出的值，算出除霜运转时的第一热交换器的过热度。当加热操作切换到除霜操作时，热泵装置通过打开开关阀来增加通过制冷剂回路循环的制冷剂的循环量，并且还控制压缩机的操作频率使得过热度处于预定的目标值。

10. 发明申请

US20120103992A1 PLUG MEMBER AND LOW-TEMPERATURE STORAGE 审中-公开
标题翻译： PLUG会员和低温储存
公开(公告)号：US20120103992A1
公开(公告)日：2012-05-03
申请号：US13283814
申请日：2011-10-28
申请人： Yoshihiro Takahashi
发明人： Yoshihiro Takahashi
IPC分类号： B65D41/04
CPC分类号： F25D17/047 , F25D23/025
摘要： A plug member, which is to be used for a low-temperature storage including: a heat-insulating door to close an opening face of a heat-insulating housing; a cooling device; and a through-hole passing through a heat-insulating wall in the housing and having an internal thread on an inner periphery thereof, and which closes an opening portion of the through-hole on an outer side of the storage, includes: an external thread to be threadedly engaged with the internal thread; and a flange member to abut onto a face having the opening portion and close the portion, by threaded engagement between the external and internal threads, the external thread having a cut, which opens a part of the opening portion, formed in a portion of an outer periphery thereof, in a state where the flange member does not abut on the face, while the external thread is threadedly engaged with the internal thread.
摘要翻译：一种用于低温存储的插头构件，包括：绝热门，用于封闭绝热壳体的开口面; 冷却装置; 以及通孔，其穿过所述壳体中的绝热壁，并且在其内周上具有内螺纹，并且在所述储存器的外侧封闭所述通孔的开口部，所述通孔包括：外螺纹与内螺纹螺纹接合; 以及法兰构件，其通过所述外螺纹和所述内螺纹之间的螺纹接合而抵靠在具有所述开口部分的面上且闭合所述部分，所述外螺纹具有切口，所述切口形成在所述开口部分的一部分中在外螺纹与内螺纹螺纹接合的状态下，在凸缘部件不与表面抵接的状态下，

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