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1. 发明申请

US20060240338A1 Pattern formation method, electronic circuit manufactured by the same, and electronic device using the same 失效
标题翻译：图案形成方法，由其制造的电子电路和使用其的电子装置
公开(公告)号：US20060240338A1
公开(公告)日：2006-10-26
申请号：US11431504
申请日：2006-05-11
申请人： Ryohei Satoh , Yoshinori Iwata , Koji Nakagawa , Reo Usui
发明人： Ryohei Satoh , Yoshinori Iwata , Koji Nakagawa , Reo Usui
IPC分类号： G03C5/00 , G03F1/00
CPC分类号： H01L21/76838 , H01L21/0272
摘要： There is provided a method for forming a continuous thin film circuit pattern with good precision, at low cost and with low environmental burden; an electronic circuit fabricated by the same, and an electronic device including the same. There are a step for forming a mask layer 2 on a substrate 1; a step for forming an opening pattern in the mask layer 2; a step for forming a thin film 3 on the substrate 1 and on the mask layer 2; and a step for removing, from the substrate 1, the mask layer 2 and a portion of the thin film 3 formed on the mask layer 2; wherein the opening pattern is formed under a dry condition.
摘要翻译：提供了一种以低成本，低环境负荷精度良好地形成连续薄膜电路图案的方法。由其制造的电子电路和包括该电子电路的电子设备。在基板1上形成掩模层2的步骤; 用于在掩模层2中形成开口图案的步骤; 在基板1和掩模层2上形成薄膜3的工序; 以及从基板1除去掩模层2和形成在掩模层2上的薄膜3的一部分的步骤; 其中所述开口图案在干燥条件下形成。

2. 发明授权

US07790358B2 Pattern formation method, electronic circuit manufactured by the same, and electronic device using the same 失效
标题翻译：图案形成方法，由其制造的电子电路和使用其的电子装置
公开(公告)号：US07790358B2
公开(公告)日：2010-09-07
申请号：US11431504
申请日：2006-05-11
申请人： Ryohei Satoh , Yoshinori Iwata , Koji Nakagawa , Reo Usui
发明人： Ryohei Satoh , Yoshinori Iwata , Koji Nakagawa , Reo Usui
IPC分类号： H01L21/00
CPC分类号： H01L21/76838 , H01L21/0272
摘要： There is provided a method for forming a continuous thin film circuit pattern with good precision, at low cost and with low environmental burden; an electronic circuit fabricated by the same, and an electronic device including the same.There are a step for forming a mask layer 2 on a substrate 1; a step for forming an opening pattern in the mask layer 2; a step for forming a thin film 3 on the substrate 1 and on the mask layer 2; and a step for removing, from the substrate 1, the mask layer 2 and a portion of the thin film 3 formed on the mask layer 2; wherein the opening pattern is formed under a dry condition.
摘要翻译：提供了一种以低成本，低环境负荷精度良好地形成连续薄膜电路图案的方法。由其制造的电子电路和包括该电子电路的电子设备。在基板1上形成掩模层2的步骤; 用于在掩模层2中形成开口图案的步骤; 在基板1和掩模层2上形成薄膜3的工序; 以及从基板1除去掩模层2和形成在掩模层2上的薄膜3的一部分的步骤; 其中所述开口图案在干燥条件下形成。

3. 发明授权

US07772778B2 Method for forming electrodes and/or black stripes for plasma display substrate 有权
标题翻译：用于形成用于等离子体显示基板的电极和/或黑色条纹的方法
公开(公告)号：US07772778B2
公开(公告)日：2010-08-10
申请号：US11691689
申请日：2007-03-27
申请人： Ryohei Satoh , Yoshinori Iwata , Koji Nakagawa , Kenji Tanaka , Satoru Takaki
发明人： Ryohei Satoh , Yoshinori Iwata , Koji Nakagawa , Kenji Tanaka , Satoru Takaki
IPC分类号： H01J17/49
CPC分类号： H01J9/02 , H01J11/12 , H01J11/22 , H01J11/44 , H01J2211/444
摘要： To provide a method for forming electrodes and/or black stripes for a plasma display substrate, wherein display electrodes, bus electrodes and optionally black stripes for a plasma display panel are formed of the same material by the same dry step, whereby a clear image having reflection prevented, can be displayed on a PDP display device with a low load on the environment, at low costs, with low resistance, without erosion by a dielectric.A method for forming electrodes and/or black stripes for a plasma display substrate, which comprises applying a laser beam to a mask layer formed on a transparent substrate to form openings at areas corresponding to the respective patterns of display electrodes, bus electrodes and optionally black stripes, then continuously forming an antireflection layer to provide an antireflection effect over the entire surface and an electrode layer, and applying again a laser beam to peel off the mask layer and at the same time to remove an unnecessary thin film layer.
摘要翻译：为了提供用于等离子体显示基板形成电极和/或黑色条纹的方法，其中显示电极，总线电极和用于等离子体显示面板的任选的黑色条纹由相同的干燥步骤由相同的材料形成，由此具有防止反射，可以低成本地以低电阻显示在环境中的低负载的PDP显示装置上，而不会被电介质侵蚀。一种用于形成等离子体显示基板的电极和/或黑色条纹的方法，包括将激光束施加到形成在透明基板上的掩模层，以在对应于显示电极，总线电极和任选黑色的各个图案的区域处形成开口然后连续地形成抗反射层以在整个表面和电极层上提供抗反射效果，并再次施加激光束以剥离掩模层，同时去除不需要的薄膜层。

4. 发明申请

US20070190886A1 METHOD FOR FORMING ELECTRODES AND/OR BLACK STRIPES FOR PLASMA DISPLAY SUBSTRATE 有权
标题翻译：用于形成等离子显示基板的电极和/或黑条的方法
公开(公告)号：US20070190886A1
公开(公告)日：2007-08-16
申请号：US11691689
申请日：2007-03-27
申请人： Ryohei Satoh , Yoshinori Iwata , Koji Nakagawa , Kenji Tanaka , Satoru Takaki
发明人： Ryohei Satoh , Yoshinori Iwata , Koji Nakagawa , Kenji Tanaka , Satoru Takaki
IPC分类号： H01J9/24 , H01J9/00
CPC分类号： H01J9/02 , H01J11/12 , H01J11/22 , H01J11/44 , H01J2211/444
摘要： To provide a method for forming electrodes and/or black stripes for a plasma display substrate, wherein display electrodes, bus electrodes and optionally black stripes for a plasma display panel are formed of the same material by the same dry step, whereby a clear image having reflection prevented, can be displayed on a PDP display device with a low load on the environment, at low costs, with low resistance, without erosion by a dielectric. A method for forming electrodes and/or black stripes for a plasma display substrate, which comprises applying a laser beam to a mask layer formed on a transparent substrate to form openings at areas corresponding to the respective patterns of display electrodes, bus electrodes and optionally black stripes, then continuously forming an antireflection layer to provide an antireflection effect over the entire surface and an electrode layer, and applying again a laser beam to peel off the mask layer and at the same time to remove an unnecessary thin film layer.
摘要翻译：为了提供用于等离子体显示基板形成电极和/或黑色条纹的方法，其中显示电极，总线电极和用于等离子体显示面板的任选的黑色条纹由相同的干燥步骤由相同的材料形成，由此具有防止反射，可以低成本地以低电阻显示在环境中的低负载的PDP显示装置上，而不会被电介质侵蚀。一种用于形成等离子体显示基板的电极和/或黑色条纹的方法，包括将激光束施加到形成在透明基板上的掩模层，以在对应于显示电极，总线电极和任选黑色的各个图案的区域处形成开口然后连续地形成抗反射层以在整个表面和电极层上提供抗反射效果，并再次施加激光束以剥离掩模层，同时去除不需要的薄膜层。

5. 发明授权

US4735354A Method of soldering component on printed circuit board 失效
标题翻译：在印刷电路板上焊接部件的方法
公开(公告)号：US4735354A
公开(公告)日：1988-04-05
申请号：US927430
申请日：1986-11-06
申请人： Kinsaku Yagi , Yoshinori Iwata
发明人： Kinsaku Yagi , Yoshinori Iwata
IPC分类号： B23K3/04 , B23K3/00 , H05K3/34 , H05K13/02 , H05K13/04 , B23K31/00
CPC分类号： H05K3/3494 , B23K3/00 , H05K13/0408 , H05K13/0465 , B23K2201/42 , H05K2201/10636 , H05K2203/0186 , H05K2203/0195 , H05K2203/081 , H05K2203/082 , H05K2203/1121 , H05K2203/304 , Y02P70/611
摘要： A method of soldering a component on a printed circuit board which has the steps of sucking the components supplied in an irregularly aligned disposition by a feeding sucking nozzle tube, then holding the components by a pair of holding arms of a soldering iron from right and left sides to always direct the component in a predetermined direction, placing the components at predetermined positions on a printed circuit board as in this state, melting the preliminary solder placed in advance on the board, air-cooling to solidify the solder to solder a number of components with a short time by always obtaining the desired designating direction so as not to displace the positions and to locally heat the chip components. Thus, this method can delete thermal adverse influence to the component and obviate an unintentional drop of chip components during the step of feeding the components.
摘要翻译：一种在印刷电路板上焊接部件的方法，该方法具有以下步骤：通过供给吸嘴管抽吸以不规则排列的配置供给的部件，然后由左右一对烙铁的夹持臂保持部件侧面总是沿着预定方向引导部件，将部件放置在印刷电路板上的预定位置，如在该状态下熔化预先放置在板上的预焊料，空气冷却以使焊料固化以焊接多个通过总是获得所需的指定方向以便不移动位置并局部加热芯片部件，具有短时间的部件。因此，该方法可以消除对部件的热不利影响，并且在馈送部件的步骤期间消除芯片部件的无意的下降。

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