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    • 8. 发明申请
    • Electronic device
    • 电子设备
    • US20050117291A1
    • 2005-06-02
    • US10970289
    • 2004-10-21
    • Yohei FukumaRyo YamamotoToru Karashima
    • Yohei FukumaRyo YamamotoToru Karashima
    • G06F1/16G06F1/20H01L23/40H05K7/20
    • G06F1/1656G06F1/1616G06F1/203H01L2924/0002H01L2924/00
    • The object of the present invention is to provide an electronic device which is thin and whose heat-generating components are cooled efficiently. The electronic device of the present invention is characterized by heat-transmitting sheets 72 and 47 being stuck to inside surfaces of a lower section 27 and an upper section 28 of the electronic device's case and being in contact with heat-generating components 58 and 60, which are semiconductor components such as an image processor and a central processor mounted on both sides of a motherboard 30 provided in the case, and elastic sheets 83 and 48, which are laid between the portions, contacting the heat-generating components 58 and 60, of the heat-transmitting sheets 72 and 47 and the inside surfaces of the sections 27 and 28.
    • 本发明的目的是提供一种薄的电子器件,其发热部件被有效地冷却。 本发明的电子装置的特征在于,将热传递片72和47粘贴在电子装置的壳体的下部部分27和上部部分28的内表面上并与发热部件58和60接触, 这些半导体部件例如安装在设置在壳体中的母板30的两侧的图像处理器和中央处理器以及布置在部分之间的与发热部件58和60接触的弹性片83和48, 的透热片72和47以及部分27和28的内表面。