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1. 发明授权

US08143604B2 Insulator system for a terminal structure of an ion implantation system 有权
标题翻译：用于离子注入系统的端子结构的绝缘体系统
公开(公告)号：US08143604B2
公开(公告)日：2012-03-27
申请号：US11394824
申请日：2006-03-31
申请人： Russell Low , Piortr R. Lubicki , D. Jeffrey Lischer , Steve Krause , Eric Hermanson , Joseph C. Olson
发明人： Russell Low , Piortr R. Lubicki , D. Jeffrey Lischer , Steve Krause , Eric Hermanson , Joseph C. Olson
IPC分类号： G21G5/00 , H01J37/08
CPC分类号： H01J37/16 , H01J37/3171 , H01J2237/026 , H01J2237/038
摘要： An ion implantation system includes an ion source configured to provide an ion beam, a terminal structure defining a cavity, the ion source at least partially disposed within the cavity, and an insulator system. The insulator system is configured to electrically insulate the terminal structure and is configured to provide an effective dielectric strength greater than about 72 kilovolts (kV)/inch in a region proximate at least one exterior surface of the terminal structure. A gas box insulator system to electrically insulate a gas box of the ion implantation system is also provided.
摘要翻译：离子注入系统包括被配置为提供离子束的离子源，限定空腔的端子结构，至少部分地设置在空腔内的离子源和绝缘体系统。绝缘体系统被配置为使端子结构电绝缘并且被配置为在靠近端子结构的至少一个外表面的区域中提供大于约72千伏（kV）/英寸的有效介电强度。还提供了一种用于对离子注入系统的气体箱进行电绝缘的气体箱绝缘体系统。

2. 发明授权

US07576337B2 Power supply for an ion implantation system 有权
标题翻译：离子注入系统的电源
公开(公告)号：US07576337B2
公开(公告)日：2009-08-18
申请号：US11620595
申请日：2007-01-05
申请人： Piotr Lubicki , Russell Low , Steve Krause , Eric Hermanson
发明人： Piotr Lubicki , Russell Low , Steve Krause , Eric Hermanson
IPC分类号： H01J37/08
CPC分类号： H02M7/103
摘要： A power supply system for an ion implantation system. In one particular exemplary embodiment, the system may be realized as a power supply system that includes a low frequency power inverter, a stack driver and a high voltage power generation unit that receives source power from the power inverter. The high voltage generation unit may include a high voltage transformer for providing an output power that is multiplied to a desired output level and delivered to an input terminal of an ion beam accelerator. The power supply system may also include a dielectric enclosure that encases at least a portion of the high voltage power generation unit, thereby preventing variation in the break down strength of the internal components.
摘要翻译：一种用于离子注入系统的电源系统。在一个具体示例性实施例中，系统可以被实现为包括低功率逆变器，堆栈驱动器和从电力逆变器接收电力源的高压发电单元的电源系统。高电压发生单元可以包括高压变压器，用于提供乘以期望输出电平并被输送到离子束加速器的输入端的输出功率。供电系统还可以包括封装高压发电单元的至少一部分的电介质外壳，从而防止内部元件的分解强度的变化。

3. 发明申请

US20080164408A1 Power Supply for an Ion Implantation System 有权
标题翻译：离子植入系统的电源
公开(公告)号：US20080164408A1
公开(公告)日：2008-07-10
申请号：US11620595
申请日：2007-01-05
申请人： Piotr R. Lubicki , Russell Low , Steve Krause , Eric Hermanson
发明人： Piotr R. Lubicki , Russell Low , Steve Krause , Eric Hermanson
IPC分类号： H01J37/248 , H01F38/00
CPC分类号： H02M7/103
摘要： A power supply system for an ion implantation system. In one particular exemplary embodiment, the system may be realized as a power supply system that includes a low frequency power inverter, a stack driver and a high voltage power generation unit that receives source power from the power inverter. The high voltage generation unit may include a high voltage transformer for providing an output power that is multiplied to a desired output level and delivered to an input terminal of an ion beam accelerator. The power supply system may also include a dielectric enclosure that encases at least a portion of the high voltage power generation unit, thereby preventing variation in the break down strength of the internal components.
摘要翻译：一种用于离子注入系统的电源系统。在一个具体示例性实施例中，系统可以被实现为包括低功率逆变器，堆栈驱动器和从电力逆变器接收电力源的高压发电单元的电源系统。高电压发生单元可以包括高压变压器，用于提供乘以期望输出电平并被输送到离子束加速器的输入端的输出功率。供电系统还可以包括封装高压发电单元的至少一部分的电介质外壳，从而防止内部元件的分解强度的变化。

4. 发明申请

US20070235663A1 Insulator system for a terminal structure of an ion implantation system 有权
标题翻译：用于离子注入系统的端子结构的绝缘体系统
公开(公告)号：US20070235663A1
公开(公告)日：2007-10-11
申请号：US11394824
申请日：2006-03-31
申请人： Russell Low , Piortr Lubicki , D. Lischer , Steve Krause , Eric Hermanson , Joseph Olson
发明人： Russell Low , Piortr Lubicki , D. Lischer , Steve Krause , Eric Hermanson , Joseph Olson
IPC分类号： G21G5/00
CPC分类号： H01J37/16 , H01J37/3171 , H01J2237/026 , H01J2237/038
摘要： An ion implantation system includes an ion source configured to provide an ion beam, a terminal structure defining a cavity, the ion source at least partially disposed within the cavity, and an insulator system. The insulator system is configured to electrically insulate the terminal structure and is configured to provide an effective dielectric strength greater than about 72 kilovolts (kV)/inch in a region proximate at least one exterior surface of the terminal structure. A gas box insulator system to electrically insulate a gas box of the ion implantation system is also provided.
摘要翻译：离子注入系统包括被配置为提供离子束的离子源，限定空腔的端子结构，至少部分地设置在空腔内的离子源和绝缘体系统。绝缘体系统被配置为使端子结构电绝缘并且被配置为在靠近端子结构的至少一个外表面的区域中提供大于约72千伏（kV）/英寸的有效介电强度。还提供了一种用于对离子注入系统的气体箱进行电绝缘的气体箱绝缘体系统。

5. 发明授权

US07402820B2 Ion beam contamination determination 有权
标题翻译：离子束污染测定
公开(公告)号：US07402820B2
公开(公告)日：2008-07-22
申请号：US11289885
申请日：2005-11-30
申请人： Russell Low , Joseph C. Olson , Antonella Cucchetti , Anthony Renau , Marie Welsch
发明人： Russell Low , Joseph C. Olson , Antonella Cucchetti , Anthony Renau , Marie Welsch
IPC分类号： H01L21/425 , H01J37/317
CPC分类号： H01J37/3171 , H01J37/304 , H01J2237/31705 , H01L22/12
摘要： A system, method and program product for determining contamination of an ion beam are disclosed. In the event of an isobaric interference, or near isobaric interference between a contaminant ion and an expected ion of an ion beam, which is difficult to detect, it is possible to measure a third ion in the ion beam and estimate, based on the amount of the third ion measured, a relative amount of the contaminant ion compared to the expected ion. The estimated relative amount of the contaminant ion is used together with a measured mass resolution of the ion implantation system to determine whether an ion implantation process needs to be suspended.
摘要翻译：公开了一种用于确定离子束污染的系统，方法和程序产品。在难以检测的等离子体干扰或离子束的预期离子之间的等压干扰或接近等压干扰的情况下，可以测量离子束中的第三离子并基于量测量的第三离子，与预期离子相比的污染物离子的相对量。污染物离子的估计相对量与离子注入系统的测量质量分辨率一起使用以确定离子注入过程是否需要暂停。

6. 发明申请

US20070125957A1 TECHNIQUES FOR REDUCING EFFECTS OF PHOTORESIST OUTGASSING 有权
标题翻译：降低光电导体效果的技术
公开(公告)号：US20070125957A1
公开(公告)日：2007-06-07
申请号：US11567522
申请日：2006-12-06
申请人： Russell Low , Jonathan England , Stephen Krause , Eric Hermanson
发明人： Russell Low , Jonathan England , Stephen Krause , Eric Hermanson
IPC分类号： G01K1/08 , H01J3/14
CPC分类号： H01J37/3171 , H01J37/09 , H01J37/15 , H01J37/18 , H01J37/302 , H01J37/3023 , H01J2237/0455 , H01J2237/0458 , H01J2237/1503 , H01J2237/182 , H01J2237/188 , H01J2237/30488 , H01J2237/31705 , H01L21/266
摘要： Techniques for reducing effects of photoresist outgassing are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus for reducing effects of photoresist outgassing in an ion implanter. The apparatus may comprise a drift tube located between an end-station and an upstream beamline component. The apparatus may also comprise a first variable aperture between the drift tube and the end-station. The apparatus may further comprise a second variable aperture between the drift tube and the upstream beamline component. The first variable aperture and the second variable aperture can be adjusted to facilitate differential pumping.
摘要翻译：公开了减少光阻剂除气效果的技术。在一个特定的示例性实施例中，技术可以被实现为用于减少离子注入机中的光致抗蚀剂除气的影响的装置。该装置可以包括位于终端站和上游束线组件之间的漂移管。该装置还可以包括漂移管和终端站之间的第一可变孔径。该装置还可以包括漂移管和上游束线部件之间的第二可变孔径。可以调节第一可变孔径和第二可变孔径以促进差动泵送。

7. 发明申请

US20110124186A1 APPARATUS AND METHOD FOR CONTROLLABLY IMPLANTING WORKPIECES 有权
标题翻译：用于控制工件的装置和方法
公开(公告)号：US20110124186A1
公开(公告)日：2011-05-26
申请号：US12947078
申请日：2010-11-16
申请人： Anthony Renau , Ludovic Godet , Timothy J. Miller , Joseph C. Olson , Vikram Singh , James Buonodono , Frank Sinclair , Deepak A. Ramappa , Russell Low , Atul Gupta , Kevin M. Daniels
发明人： Anthony Renau , Ludovic Godet , Timothy J. Miller , Joseph C. Olson , Vikram Singh , James Buonodono , Frank Sinclair , Deepak A. Ramappa , Russell Low , Atul Gupta , Kevin M. Daniels
IPC分类号： H01L21/265 , G21K5/10
CPC分类号： B01J19/081 , H01J37/3171 , H01J37/32357 , H01J37/32422 , H01J37/32623 , H01J2237/0453 , H01J2237/1205 , H01L21/2236 , H01L31/022425 , H01L31/068 , H01L31/08 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： A plasma processing apparatus comprises a plasma source configured to produce a plasma in a plasma chamber, such that the plasma contains ions for implantation into a workpiece. The apparatus also includes a focusing plate arrangement having an aperture arrangement configured to modify a shape of a plasma sheath of the plasma proximate the focusing plate such that ions exiting an aperture of the aperture arrangement define focused ions. The apparatus further includes a processing chamber containing a workpiece spaced from the focusing plate such that a stationary implant region of the focused ions at the workpiece is substantially narrower that the aperture. The apparatus is configured to create a plurality of patterned areas in the workpiece by scanning the workpiece during ion implantation.
摘要翻译：等离子体处理装置包括等离子体源，其被配置为在等离子体室中产生等离子体，使得等离子体包含用于注入工件的离子。该装置还包括聚焦板装置，该聚焦板装置具有孔结构，其被配置为修改离开聚焦板附近的等离子体鞘的等离子体鞘的形状，使得离开孔结构的孔的离子限定聚焦离子。该设备还包括处理室，其包含与聚焦板间隔开的工件，使得在工件处的聚焦离子的固定注入区域基本上比孔更窄。该装置被配置为通过在离子注入期间扫描工件来在工件中产生多个图案化区域。

8. 发明申请

US20080072413A1 Indirectly heated cathode clamp system and method 有权
标题翻译：间接加热阴极夹系统及方法
公开(公告)号：US20080072413A1
公开(公告)日：2008-03-27
申请号：US11194260
申请日：2005-08-01
申请人： Stephen Krause , Eric R. Cobb , Russell Low
发明人： Stephen Krause , Eric R. Cobb , Russell Low
IPC分类号： B23Q3/18 , H01J9/18 , H05H1/24
CPC分类号： H01J9/18 , Y10T29/49895 , Y10T29/49899 , Y10T29/53909
摘要： A method and clamp system for use on an ion implanter system for aligning a cathode and filament relative to one another in-situ are disclosed. The invention includes a clamp system having a clamp including a first clamp member separably coupled to a second clamp member, and an opening to a mount portion of one of the cathode and the filament in at least one of the clamp members. Each clamp member includes a surface to engage a mount portion of one of the cathode and the filament. The opening is adapted to receive a positioning tool to position the cathode and the filament relative to one another by moving the mount portion when the clamp is released. The mount portion may include a tool receiving member to facilitate accurate positioning.
摘要翻译：公开了一种用于离子注入机系统的方法和夹紧系统，用于将阴极和细丝相对于彼此原位排列。本发明包括具有夹具的夹具系统，该夹具包括可分离地联接到第二夹紧构件的第一夹紧构件以及至少一个夹紧构件中的阴极和细丝之一的安装部分的开口。每个夹持构件包括与阴极和细丝之一的安装部分接合的表面。开口适于接收定位工具以通过在夹具被释放时移动安装部分来相对于彼此定位阴极和灯丝。安装部分可以包括工具接收构件以便于精确定位。

9. 发明申请

US20060219954A1 Methods and apparatus for glitch recovery in stationary-beam ion implantation process using fast ion beam control 有权
标题翻译：使用快速离子束控制的固定射束离子注入过程中毛刺恢复的方法和装置
公开(公告)号：US20060219954A1
公开(公告)日：2006-10-05
申请号：US11241894
申请日：2005-09-30
申请人： Russell Low , Joseph Olson , David Timberlake , James McLane , Mark Saunders , James Cummings , Thomas Callahan , Jonathan England
发明人： Russell Low , Joseph Olson , David Timberlake , James McLane , Mark Saunders , James Cummings , Thomas Callahan , Jonathan England
IPC分类号： H01J37/08 , G21K5/10
CPC分类号： H01J37/304 , H01J37/3171 , H01J2237/30455 , H01J2237/31761 , Y10S438/961
摘要： An ion implanter includes a source of a stationary, planar ion beam, a set of beamline components that steer the ion beam along a normal beam path as determined by first operating parameter values, an end station that mechanically scans the wafer across the normal beam path, and control circuitry that responds to a glitch in the ion beam during implantation pass to (1) immediately alter an operating parameter of at least one of the beamline components to a second value to direct the ion beam away from the normal beam path and thereby cease implantation at an implantation transition location on the wafer, (2) subsequently move the wafer to an implantation-resuming position in which the implantation transition location on the wafer lies directly on the normal path of the ion beam, and (3) return the operating parameter to its first value to direct the ion beam along the normal beam path and resume ion implantation at the implantation transition location on the wafer. The operating parameter may be an output voltage of an extraction power supply, or other voltages and/or currents of beamline components that affect the path of the ion beam.
摘要翻译：离子注入机包括静止的平面离子束的源，一组束线分量，其通过由第一操作参数值确定的沿正常光束路径引导离子束;终端，其通过正常光束路径机械扫描晶片以及在注入期间响应于离子束中的毛刺的控制电路通过（1）立即将至少一个束线分量的操作参数改变为第二值，以将离子束引导离开正常光束路径，从而在晶片上的植入转变位置处停止植入，（2）随后将晶片移动到植入恢复位置，其中晶片上的注入转变位置直接位于离子束的正常路径上，并且（3）操作参数到其第一值以引导离子束沿着正常光束路径并在晶片上的注入转变位置处恢复离子注入。操作参数可以是提取电源的输出电压，或影响离子束路径的束线组件的其他电压和/或电流。

10. 发明申请

US20060163489A1 SOURCE ARC CHAMBER FOR ION IMPLANTER HAVING REPELLER ELECTRODE MOUNTED TO EXTERNAL INSULATOR 有权
标题翻译：具有安装在外部绝缘体上的转子电极的离子植绒的源室
公开(公告)号：US20060163489A1
公开(公告)日：2006-07-27
申请号：US11044659
申请日：2005-01-27
申请人： Russell Low , Eric Cobb , Joseph Olson , Leo Klos
发明人： Russell Low , Eric Cobb , Joseph Olson , Leo Klos
IPC分类号： H01J27/00
CPC分类号： H01J27/08
摘要： An ion implanter has a source arc chamber including a conductive end wall at a repeller end of the arc chamber, the end wall having a central portion surrounding an opening. A ceramic insulator is secured to an outer surface of the end wall, such as by peripheral screw threads engaging mating threads at the periphery of a recessed area of the end wall. A conductive repeller has a narrow shaft secured to the insulator and extending through the end wall opening, and a body disposed within the source arc chamber adjacent to the end wall. The end wall, insulator and repeller are configured to form a continuous vacuum gap between the central portion of the end wall and (i) the repeller body, (ii) the repeller shaft, and (iii) the insulator. The insulator interior surface can have a ridged cross section.
摘要翻译：离子注入机具有源电弧室，该电弧室包括在电弧室的排斥端处的导电端壁，端壁具有围绕开口的中心部分。陶瓷绝缘体固定在端壁的外表面上，例如通过外周螺纹与端壁的凹陷区域的周边处的配合螺纹啮合。导电排斥器具有固定到绝缘体并延伸通过端壁开口的窄轴，以及设置在源弧室内与主体壁相邻的主体。端壁，绝缘体和推斥器构造成在端壁的中心部分与（i）推斥体之间形成连续的真空间隙，（ii）推斥轴，和（iii）绝缘体。绝缘体内表面可以具有脊状横截面。

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