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    • 3. 发明授权
    • Overmold for a modular implantable medical device
    • 用于模块化可植入医疗设备的包覆模型
    • US07242982B2
    • 2007-07-10
    • US10730873
    • 2003-12-09
    • Ruchika SinghalDarren A. JanzigCarl D. WahlstrandRobert M. SkimePaulette C. Olson
    • Ruchika SinghalDarren A. JanzigCarl D. WahlstrandRobert M. SkimePaulette C. Olson
    • A61N1/36
    • A61N1/375A61N1/3605A61N1/3754A61N1/3758
    • A modular implantable medical device permits implantable medical devices to have a smaller profile in order to better fit into locations within the human body. A modular implantable medical device separates various functional components of the implantable medical device into a set of interconnected modules. This distributed architecture of a modular implantable medical device may permit the device footprint to be distributed over a larger area while making the profile smaller, and may permit the overall shape of the implantable medical device to better match the body location into which it is to be implanted. An overmold integrates the modules of a modular implantable medical device into a single structure. In some embodiments the overmold is flexible and provides a biocompatible interface from the component modules and the patient, while restraining potentially harmful intermodule motion.
    • 模块化可植入医疗装置允许植入式医疗装置具有更小的外形,以便更好地适应人体内的位置。 模块化可植入医疗装置将可植入医疗装置的各种功能部件分离成一组互连的模块。 模块化可植入医疗设备的这种分布式架构可以允许设备占地面积分布在更大的区域上,同时使轮廓更小,并且可以允许可植入医疗设备的整体形状更好地匹配要被植入的医疗设备的身体位置 植入。 包覆模具将模块化可植入医疗设备的模块集成到单个结构中。 在一些实施方案中,包覆成型是柔性的并且提供来自组件模块和患者的生物相容性界面,同时限制潜在有害的模块间运动。
    • 6. 发明授权
    • Low-profile implantable medical device
    • 低调植入式医疗器械
    • US08457744B2
    • 2013-06-04
    • US10730877
    • 2003-12-09
    • Darren A. JanzigCarl D. WahlstrandPaulette C. OlsonRobert M. Skime
    • Darren A. JanzigCarl D. WahlstrandPaulette C. OlsonRobert M. Skime
    • A61N1/08
    • A61N1/375A61N1/3605A61N1/3754A61N1/3758
    • Components of an implantable medical device are arranged to facilitate a low-profile housing. A circuit board within the housing carries integrated circuits and discrete components. In some embodiments, the integrated circuits and discrete components are located on first and second opposing surfaces of the circuit board, respectively. In some embodiments, the implantable medical device is implanted on a cranium of a patient and the housing is concave such that it substantially conforms to the cranium. In such embodiments, the integrated circuits and/or discrete components can be arranged on the circuit board according to height to better conform to the concavity of the housing. In some embodiments, the implantable medical device includes a telemetry coil that is positioned within the housing such that it occupies space that cannot be practically occupied by the circuit board.
    • 可植入医疗装置的部件被布置成便于小型外壳。 外壳内的电路板承载集成电路和分立元件。 在一些实施例中,集成电路和分立元件分别位于电路板的第一和第二相对表面上。 在一些实施例中,将可植入医疗装置植入患者的颅骨上,并且所述外壳是凹形的,使得其基本上符合颅骨。 在这样的实施例中,集成电路和/或分立组件可以根据高度布置在电路板上,以更好地符合壳体的凹面。 在一些实施例中,可植入医疗装置包括位于壳体内的遥测线圈,使其占据不能被电路板实际占据的空间。
    • 7. 发明授权
    • Concavity of an implantable medical device
    • 可植入医疗器械的凹陷
    • US07529586B2
    • 2009-05-05
    • US10731867
    • 2003-12-09
    • Carl D. WahlstrandDarren A. JanzigRuchika SinghalRobert M. SkimeErik R. ScottJames E. Randall
    • Carl D. WahlstrandDarren A. JanzigRuchika SinghalRobert M. SkimeErik R. ScottJames E. Randall
    • A61N1/36
    • A61N1/375A61N1/3605A61N1/3754A61N1/3758
    • At least one surface of an implantable medical device is concave along at least one axis such that it substantially conforms to a surface within a patient, such as the cranium, when it is implanted on that surface. In some embodiments, the surface of the implantable medical device substantially conforms to an arc with a radius that is between 4.5 and 9.5 centimeters, and is preferably approximately equal to 7 centimeters. In some embodiments, the implantable medical device comprises a plurality of interconnected modules, and an overmold that at least partially encapsulates each of the modules. In such embodiments, at least one surface of the overmold is concave along at least one axis. Further, each of the modules of such an implantable medical device may comprise a housing, and at least one surface of at least one of the housings may be concave along at least one axis.
    • 可植入医疗装置的至少一个表面沿着至少一个轴线是凹形的,使得当植入在该表面上时,其基本上符合患者(例如颅骨)内的表面。 在一些实施例中,可植入医疗装置的表面基本上符合半径在4.5和9.5厘米之间的弧度,并且优选地大约等于7厘米。 在一些实施例中,可植入医疗装置包括多个互连的模块,以及至少部分地封装每个模块的包覆模制。 在这样的实施例中,包覆模制体的至少一个表面沿着至少一个轴线是凹形的。 此外,这种可植入医疗装置的每个模块可以包括壳体,并且至少一个壳体的至少一个表面沿着至少一个轴线可以是凹形的。