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    • 5. 发明授权
    • Resistive memory with small electrode and method for fabricating the same
    • 具有小电极的电阻记忆及其制造方法
    • US09142768B2
    • 2015-09-22
    • US13698799
    • 2012-05-02
    • Yimao CaiJun MaoRu HuangShenghu TanYinglong HuangYue Pan
    • Yimao CaiJun MaoRu HuangShenghu TanYinglong HuangYue Pan
    • H01L45/00
    • H01L45/1253H01L45/04H01L45/122H01L45/1233H01L45/1273H01L45/146H01L45/1608H01L45/1616H01L45/1625
    • Systems and methods are disclosed involving a resistive memory with a small electrode, relating to the field of semiconductor resistive memory in ULSI. An illustrative resistive memory may include an Al electrode layer, a SiO2 layer, a Si layer, a resistive material layer and a lower electrode layer in sequence, wherein the Al electrode layer and the resistive material layer are electrically connected through one or more conductive channel and the conductive channel is formed by penetrating Al material into the Si layer via defects in the SiO2 layer and dissolving Si material into the Al material. Methods may include forming a lower electrode layer, a resistive layer, a Si layer and a SiO2 layer over a substrate; fabricating a Al electrode layer over the SiO2 layer; and performing an anneal process to the resultant structure. Consistent with innovations herein, a small electrode may be obtained via a conventional process.
    • 公开了涉及具有与ULSI中的半导体电阻性存储器的领域相关的具有小电极的电阻性存储器的系统和方法。 示例性电阻存储器可以依次包括Al电极层,SiO 2层,Si层,电阻材料层和下电极层,其中Al电极层和电阻材料层通过一个或多个导电沟道电连接 并且通过SiO 2层中的缺陷将Al材料穿过Si层而将Si材料溶解到Al材料中而形成导电通道。 方法可以包括在衬底上形成下电极层,电阻层,Si层和SiO 2层; 在SiO 2层上制造Al电极层; 对所得到的结构进行退火处理。 与本文的创新一致,可以通过常规方法获得小电极。