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1. 发明申请

US20050043007A1 Integrated low noise amplifier 有权
标题翻译：集成低噪声放大器
公开(公告)号：US20050043007A1
公开(公告)日：2005-02-24
申请号：US10943382
申请日：2004-09-17
申请人： Rozleh Rofougaran , Jesus Castaneda , Hung Yang , Lijun Zhang
发明人： Rozleh Rofougaran , Jesus Castaneda , Hung Yang , Lijun Zhang
IPC分类号： H03F1/26 , H03F3/193 , H03F3/45 , H03H7/38 , H03H7/42 , H04B1/28
CPC分类号： H03F3/195 , H03F1/26 , H03F3/193 , H03F3/245 , H03F3/45188 , H03F2200/06 , H03F2200/294 , H03F2200/372 , H03F2200/451 , H03F2203/45386 , H03F2203/45464 , H03F2203/45544 , H03F2203/45596 , H03F2203/45621 , H03F2203/45638 , H03H7/38 , H03H7/42
摘要： An integrated circuit (IC) low noise amplifier includes an on-chip balun and an on-chip differential amplifier. The on-chip balun is operably coupled to convert a single-ended signal into a differential signal. The on-chip differential amplifier is operably coupled to amplify the differential signal.
摘要翻译：集成电路（IC）低噪声放大器包括片上平衡 - 不平衡转换器和片上差分放大器。片上平衡 - 不平衡变换器可操作地耦合以将单端信号转换成差分信号。片上差分放大器可操作地耦合以放大差分信号。

2. 发明申请

US20070213027A1 INTEGRATED LOW NOISE AMPLIFIER 有权
标题翻译：集成低噪声放大器
公开(公告)号：US20070213027A1
公开(公告)日：2007-09-13
申请号：US11747966
申请日：2007-05-14
申请人： Rozieh Rofougaran , Jesus Castaneda , Hung Yu Yang , Lijun Zhang
发明人： Rozieh Rofougaran , Jesus Castaneda , Hung Yu Yang , Lijun Zhang
IPC分类号： H04B1/00
CPC分类号： H03F3/195 , H03F1/26 , H03F3/193 , H03F3/245 , H03F3/45188 , H03F2200/06 , H03F2200/294 , H03F2200/372 , H03F2200/451 , H03F2203/45386 , H03F2203/45464 , H03F2203/45544 , H03F2203/45596 , H03F2203/45621 , H03F2203/45638 , H03H7/38 , H03H7/42
摘要： An integrated circuit (IC) low noise amplifier includes an on-chip balun and an on-chip differential amplifier. The on-chip balun is coupled to convert a single-ended signal into a differential signal. The on-chip differential amplifier is coupled to amplify the differential signal.
摘要翻译：集成电路（IC）低噪声放大器包括片上平衡 - 不平衡转换器和片上差分放大器。片上平衡 - 不平衡转换器将单端信号转换成差分信号。片上差分放大器被耦合以放大差分信号。

3. 发明申请

US20120086114A1 MILLIMETER DEVICES ON AN INTEGRATED CIRCUIT 审中-公开
标题翻译：集成电路中的毫米设备
公开(公告)号：US20120086114A1
公开(公告)日：2012-04-12
申请号：US13022291
申请日：2011-02-07
申请人： Sam Ziqun ZHAO , Ahmadreza Rofougaran , Arya Behzad , Jesus Castaneda , Michael Boers
发明人： Sam Ziqun ZHAO , Ahmadreza Rofougaran , Arya Behzad , Jesus Castaneda , Michael Boers
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L23/66 , H01L23/48 , H01L23/481 , H01L23/5227 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2223/6627 , H01L2223/6677 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/1903 , H01L2924/19041 , H01L2924/19042 , H01L2924/19051 , H01L2924/19104 , H01Q1/38 , H01Q9/285 , H01Q23/00 , H01L2924/0665 , H01L2924/00 , H01L2924/00012 , H01L2224/05552
摘要： An integrated circuit (IC) device arrangement includes a substrate, an IC die coupled to the substrate, an antenna coupled to the IC die, and a first wirelessly enabled functional block coupled to the IC die. The wirelessly enabled functional block is configured to wirelessly communicate with a second wirelessly enabled functional block coupled to the substrate. The antenna is configured to communicate with another antenna coupled to another device.
摘要翻译：集成电路（IC）器件布置包括衬底，耦合到衬底的IC管芯，耦合到IC管芯的天线以及耦合到IC管芯的第一无线功能块。无线启用的功能块被配置为与耦合到衬底的第二无线启用功能块无线通信。天线被配置为与耦合到另一设备的另一天线进行通信。

4. 发明申请

US20070069818A1 Multilevel power amplifier architecture using multi-tap transformer 有权
标题翻译：多级功率放大器架构采用多抽头变压器
公开(公告)号：US20070069818A1
公开(公告)日：2007-03-29
申请号：US11553190
申请日：2006-10-26
申请人： Iqbal Bhatti , Jesus Castaneda
发明人： Iqbal Bhatti , Jesus Castaneda
IPC分类号： H03F3/68
CPC分类号： H03F3/602 , H03F3/211 , H03F3/45188 , H03F2200/108 , H03F2200/372 , H03F2200/541 , H03F2203/45731
摘要： A multi-level power amplifier architecture using a multi-tap transformer implemented on a single CMOS integrated circuit wireless communications device is described. By providing a multi-tap transformer for coupling a plurality of power amplifiers to a shared output impedance, such as an antenna, power transmission may be made at different levels while maintaining efficiency. With a multi-tap transformer having “N” taps featuring “N” different impedance levels, each tap may be connected to an amplifier cell which delivers power into the transformer at the tap for coupling to the output load. Any one of the “N” amplifier cells can be turned on at once along with any combination of the “N” amplifier cells.
摘要翻译：描述了使用在单个CMOS集成电路无线通信设备上实现的多抽头变压器的多电平功率放大器架构。通过提供用于将多个功率放大器耦合到诸如天线的共享输出阻抗的多抽头变压器，可以在保持效率的同时进行功率传输。利用具有“N”个不同阻抗电平的“N”抽头的多抽头变压器，每个抽头可以连接到放大器单元，该放大器在抽头处将功率输送到变压器以耦合到输出负载。任何一个“N”个放大器单元可以与“N”个放大器单元的任何组合一起打开。

5. 发明授权

US07129784B2 Multilevel power amplifier architecture using multi-tap transformer 失效
标题翻译：多级功率放大器架构采用多抽头变压器
公开(公告)号：US07129784B2
公开(公告)日：2006-10-31
申请号：US10975240
申请日：2004-10-28
申请人： Iqbal Bhatti , Jesus Castaneda
发明人： Iqbal Bhatti , Jesus Castaneda
IPC分类号： H03F3/68
CPC分类号： H03F3/602 , H03F3/211 , H03F3/45188 , H03F2200/108 , H03F2200/372 , H03F2200/541 , H03F2203/45731
摘要： A multi-level power amplifier architecture using a multi-tap transformer implemented on a single CMOS integrated circuit wireless communications device is described. By providing a multi-tap transformer for coupling a plurality of power amplifiers to a shared output impedance, such as an antenna, power transmission may be made at different levels while maintaining efficiency. With a multi-tap transformer having “N” taps featuring “N” different impedance levels, each tap may be connected to an amplifier cell which delivers power into the transformer at the tap for coupling to the output load. Any one of the “N” amplifier cells can be turned on at once along with any combination of the “N” amplifier cells.
摘要翻译：描述了使用在单个CMOS集成电路无线通信设备上实现的多抽头变压器的多电平功率放大器架构。通过提供用于将多个功率放大器耦合到诸如天线的共享输出阻抗的多抽头变压器，可以在保持效率的同时进行功率传输。利用具有“N”个不同阻抗电平的“N”抽头的多抽头变压器，每个抽头可以连接到放大器单元，该放大器在抽头处将功率输送到变压器以耦合到输出负载。任何一个“N”个放大器单元可以与“N”个放大器单元的任何组合一起打开。

6. 发明授权

US08901945B2 Test board for use with devices having wirelessly enabled functional blocks and method of using same 有权
标题翻译：与具有无线功能块的设备一起使用的测试板及其使用方法
公开(公告)号：US08901945B2
公开(公告)日：2014-12-02
申请号：US13149315
申请日：2011-05-31
申请人： Sam Ziqun Zhao , Ahmadreza Rofougaran , Arya Behzad , Jesus Castaneda , Michael Boers
发明人： Sam Ziqun Zhao , Ahmadreza Rofougaran , Arya Behzad , Jesus Castaneda , Michael Boers
IPC分类号： G01R31/00 , G01R31/302 , G01R31/28
CPC分类号： G01R31/3025 , G01R31/2889 , H01L2224/48227 , H01L2924/15311
摘要： A test board is provided. The test board includes a test module configured to accommodate an integrated circuit (IC) device and first wirelessly enabled functional blocks located in the test module and configured to communicate with second wirelessly enabled functional blocks of the IC device.
摘要翻译：提供测试板。测试板包括测试模块，该测试模块被配置为容纳集成电路（IC）设备和位于测试模块中的第一无线功能功能块，并被配置为与IC设备的第二无线功能块通信。

7. 发明授权

US08884428B2 Device having wirelessly enabled functional blocks 有权
公开(公告)号：US08884428B2
公开(公告)日：2014-11-11
申请号：US13249885
申请日：2011-09-30
申请人： Sam Ziqun Zhao , Michael Boers , Ahmadreza Rofougaran , Arya Behzad , Jesus Castaneda
发明人： Sam Ziqun Zhao , Michael Boers , Ahmadreza Rofougaran , Arya Behzad , Jesus Castaneda
IPC分类号： H01L23/34 , H01L23/552 , H05K1/00 , H01L23/498 , H01L23/48
摘要： Embodiments described herein provide enhanced integrated circuit (IC) devices. In an embodiment, an IC device includes a substrate, an IC die coupled to a surface of the substrate, a first wirelessly enabled functional block located, on the IC die, the first wirelessly enabled functional block being configured to wirelessly communicate with a second wirelessly enabled functional block located on the substrate, and a ground ring configured to provide electromagnetic shielding for the first and second wirelessly enabled functional blocks.

8. 发明授权

US08588805B2 Receiver utilizing multiple radiation patterns to determine angular position 有权
标题翻译：利用多个辐射图来确定角位置的接收器
公开(公告)号：US08588805B2
公开(公告)日：2013-11-19
申请号：US12475479
申请日：2009-05-30
申请人： Alfred Grau Besoli , Nicolaos G. Alexopoulos , Jesus Castaneda
发明人： Alfred Grau Besoli , Nicolaos G. Alexopoulos , Jesus Castaneda
IPC分类号： H04B1/00 , H04B7/00 , H04B1/06 , H04W24/00 , H04M1/00
CPC分类号： H04B17/0037 , H04B7/084 , H04B17/104
摘要： A receiver includes an antenna array, an angular positioning module, a low noise amplifier module, and a down conversion module. The antenna array is operable to receive an inbound wireless signal. The angular positioning module is operable to: receive a plurality of received inbound wireless signals from the antenna array; determine angular position of a source of the inbound wireless signal from at least some of the plurality of received inbound wireless signals based on a first radiation pattern and a second radiation pattern of the plurality of received inbound wireless signals; and output a representation of the inbound wireless signal. The low noise amplifier module is operably coupled to amplify the representation of the inbound wireless signal to produce an amplified inbound wireless signal. The down conversion module is operably coupled to convert the amplified inbound wireless signal into a baseband or near baseband signal.
摘要翻译：接收机包括天线阵列，角度定位模块，低噪声放大器模块和下变频模块。天线阵列可操作以接收入站无线信号。所述角度定位模块可操作以：从所述天线阵列接收多个接收到的入站无线信号; 基于所述多个接收到的入站无线信号中的第一辐射图和第二辐射图，确定所述多个接收的入站无线信号中的至少一些的所述入站无线信号的源的角位置; 并输出入站无线信号的表示。低噪声放大器模块可操作地耦合以放大入站无线信号的表示以产生放大的入站无线信号。下变频模块可操作地耦合以将放大的入站无线信号转换成基带或近基带信号。

9. 发明申请

US20120212244A1 Test Board and Method of Using Same 有权
标题翻译：测试板和使用方法
公开(公告)号：US20120212244A1
公开(公告)日：2012-08-23
申请号：US13149315
申请日：2011-05-31
申请人： Sam Ziqun ZHAO , Ahmadreza Rofougaran , Arya Behzad , Jesus Castaneda , Michael Boers
发明人： Sam Ziqun ZHAO , Ahmadreza Rofougaran , Arya Behzad , Jesus Castaneda , Michael Boers
IPC分类号： G01R31/00
CPC分类号： G01R31/3025 , G01R31/2889 , H01L2224/48227 , H01L2924/15311
摘要： A test board is provided. The test board includes a test module configured to accommodate an integrated circuit (IC) device and first wirelessly enabled functional blocks located in the test module and configured to communicate with second wirelessly enabled functional blocks of the IC device.
摘要翻译：提供测试板。测试板包括测试模块，该测试模块被配置为容纳集成电路（IC）设备和位于测试模块中的第一无线功能功能块，并被配置为与IC设备的第二无线功能块通信。

10. 发明申请

US20050200426A1 Off-chip LC circuit for lowest ground and VDD impedance for power amplifier 失效
标题翻译：用于功率放大器的最低接地和VDD阻抗的片外LC电路
公开(公告)号：US20050200426A1
公开(公告)日：2005-09-15
申请号：US10844237
申请日：2004-05-12
申请人： Jesus Castaneda , Qiang (Tom) Li
发明人： Jesus Castaneda , Qiang (Tom) Li
IPC分类号： H03F1/56 , H03F3/195 , H03F3/24 , H03H7/38
CPC分类号： H03F1/565 , H03F3/195 , H03F3/24 , H03F2200/09 , H03F2200/294 , H03F2200/372 , H03H7/38
摘要： Off-chip LC circuit for lowest ground and VDD impedance for power amplifier. A novel approach is made by which a chip to PCB (Printer Circuit Board) interface may be made such that the ground and VDD potential levels are effectively brought onto the die of the chip such that a true ground potential is maintained within the chip. This off-chip LC circuit operates cooperatively with an on-chip decoupling capacitor to reduce the overall effective inductance of the bond wires employed to bring signal and voltage levels from the die to the chip exterior. This circuit ensures a relatively low impedance for a PA (Power Amplifier) that is implemented within chip thereby providing for improved performance.
摘要翻译：用于功率放大器的最低接地和VDD阻抗的片外LC电路。可以制造一种新颖的方法，通过其可以制造芯片到PCB（打印机电路板）接口，使得接地和VDD电位有效地被带到芯片的管芯上，使得在芯片内保持真实的接地电位。该片外LC电路与片上去耦电容协同工作，以减少用于将信号和电压电平从模具外部输送到芯片外部的接合线的整体有效电感。该电路确保在芯片内实现的PA（功率放大器）具有相对低的阻抗，从而提供改进的性能。

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