专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110184569A1 VISCOUS MATERIAL NONCONTACT JETTING SYSTEM 有权
公开(公告)号：US20110184569A1
公开(公告)日：2011-07-28
申请号：US13079300
申请日：2011-04-04
申请人： Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, JR. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
发明人： Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, JR. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
IPC分类号： G05D7/00 , G05D13/02
CPC分类号： B05C11/1034 , B05C5/001 , B05C5/0225 , B05C11/10 , G05D7/0629 , H05K3/28 , H05K3/3484 , H05K2203/0736
摘要： A viscous material noncontact jetting system has a jetting dispenser mounted for relative motion with respect to a surface. A control is operable to cause the jetting dispenser to jet a viscous material droplet that is applied to the surface as a viscous material dot. A device, such as a camera or weigh scale, is connected to the control and provides a feedback signal representing a size-related physical characteristic of the dot applied to the surface. The size-related physical characteristics of subsequently applied dots is controlled by heating and cooling, or adjusting a piston stroke in the jetting dispenser, in response to the size-related physical characteristic feedback. Dispensed material volume control and velocity offset compensation are also provided.

2. 发明申请

US20110048575A1 VISCOUS MATERIAL NONCONTACT JETTING SYSTEM 有权
标题翻译： VISCOUS材料非接头喷射系统
公开(公告)号：US20110048575A1
公开(公告)日：2011-03-03
申请号：US12940360
申请日：2010-11-05
申请人： Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, JR. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
发明人： Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, JR. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
IPC分类号： B65B1/04
CPC分类号： B05C11/1034 , B05C5/001 , B05C5/0225 , B05C11/10 , G05D7/0629 , H05K3/28 , H05K3/3484 , H05K2203/0736
摘要： A viscous material noncontact jetting system has a jetting dispenser mounted for relative motion with respect to a surface. A control is operable to cause the jetting dispenser to jet a viscous material droplet that is applied to the surface as a viscous material dot. A device, such as a camera or weigh scale, is connected to the control and provides a feedback signal representing a size-related physical characteristic of the dot applied to the surface. The size-related physical characteristics of subsequently applied dots is controlled by heating and cooling, or adjusting a piston stroke in the jetting dispenser, in response to the size-related physical characteristic feedback. Dispensed material volume control and velocity offset compensation are also provided.
摘要翻译：粘性材料非接触喷射系统具有安装成相对于表面相对运动的喷射分配器。控制器可操作以使喷射分配器喷射作为粘性材料点施加到表面的粘性物质液滴。诸如相机或称重秤的装置连接到控制器，并且提供表示应用于表面的点的与尺寸有关的物理特性的反馈信号。响应于尺寸相关的物理特性反馈，随后施加的点的尺寸相关的物理特性由加热和冷却或喷射分配器中的活塞行程调节来控制。还提供分配材料体积控制和速度偏移补偿。

3. 发明申请

US20120285990A1 Viscous Material Noncontact Jetting System 审中-公开
标题翻译：粘性材料非接触喷射系统
公开(公告)号：US20120285990A1
公开(公告)日：2012-11-15
申请号：US13568278
申请日：2012-08-07
申请人： Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, JR. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
发明人： Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, JR. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
IPC分类号： B05C11/00
CPC分类号： B05C11/1034 , B05C5/001 , B05C5/0225 , B05C11/10 , G05D7/0629 , H05K3/28 , H05K3/3484 , H05K2203/0736
摘要： A viscous material noncontact jetting system has a jetting dispenser mounted for relative motion with respect to a surface. A control is operable to cause the jetting dispenser to jet a viscous material droplet that is applied to the surface as a viscous material dot. A device, such as a camera or weigh scale, is connected to the control and provides a feedback signal representing a size-related physical characteristic of the dot applied to the surface. The size-related physical characteristics of subsequently applied dots is controlled by heating and cooling, or adjusting a piston stroke in the jetting dispenser, in response to the size-related physical characteristic feedback. Dispensed material volume control and velocity offset compensation are also provided.
摘要翻译：粘性材料非接触喷射系统具有安装成相对于表面相对运动的喷射分配器。控制器可操作以使喷射分配器喷射作为粘性材料点施加到表面的粘性物质液滴。诸如相机或称重秤的装置连接到控制器，并且提供表示应用于表面的点的与尺寸有关的物理特性的反馈信号。响应于尺寸相关的物理特性反馈，随后施加的点的尺寸相关的物理特性由加热和冷却或喷射分配器中的活塞行程调节来控制。还提供分配材料体积控制和速度偏移补偿。

4. 发明授权

US07939125B2 Viscous material noncontact jetting system 有权
标题翻译：粘性材料非接触喷射系统
公开(公告)号：US07939125B2
公开(公告)日：2011-05-10
申请号：US12940360
申请日：2010-11-05
申请人： Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, Jr. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
发明人： Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, Jr. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
IPC分类号： C23C16/52
CPC分类号： B05C11/1034 , B05C5/001 , B05C5/0225 , B05C11/10 , G05D7/0629 , H05K3/28 , H05K3/3484 , H05K2203/0736
摘要： A viscous material noncontact jetting system has a jetting dispenser mounted for relative motion with respect to a surface. A control is operable to cause the jetting dispenser to jet a viscous material droplet that is applied to the surface as a viscous material dot. A device, such as a camera or weigh scale, is connected to the control and provides a feedback signal representing a size-related physical characteristic of the dot applied to the surface. The size-related physical characteristics of subsequently applied dots is controlled by heating and cooling, or adjusting a piston stroke in the jetting dispenser, in response to the size-related physical characteristic feedback. Dispensed material volume control and velocity offset compensation are also provided.
摘要翻译：粘性材料非接触喷射系统具有安装成相对于表面相对运动的喷射分配器。控制器可操作以使喷射分配器喷射作为粘性材料点施加到表面的粘性物质液滴。诸如相机或称重秤的装置连接到控制器，并且提供表示应用于表面的点的与尺寸有关的物理特性的反馈信号。响应于尺寸相关的物理特性反馈，随后施加的点的尺寸相关的物理特性由加热和冷却或喷射分配器中的活塞行程调节来控制。还提供分配材料体积控制和速度偏移补偿。

5. 发明授权

US09636701B2 Viscous material noncontact jetting system 有权
公开(公告)号：US09636701B2
公开(公告)日：2017-05-02
申请号：US13568278
申请日：2012-08-07
申请人： Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, Jr. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
发明人： Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, Jr. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
IPC分类号： B05C11/00 , B05C11/10 , B05C5/02 , H05K3/34
CPC分类号： B05C11/1034 , B05C5/001 , B05C5/0225 , B05C11/10 , G05D7/0629 , H05K3/28 , H05K3/3484 , H05K2203/0736
摘要： A viscous material noncontact jetting system has a jetting dispenser mounted for relative motion with respect to a surface. A control is operable to cause the jetting dispenser to jet a viscous material droplet that is applied to the surface as a viscous material dot. A device, such as a camera or weigh scale, is connected to the control and provides a feedback signal representing a size-related physical characteristic of the dot applied to the surface. The size-related physical characteristics of subsequently applied dots is controlled by heating and cooling, or adjusting a piston stroke in the jetting dispenser, in response to the size-related physical characteristic feedback. Dispensed material volume control and velocity offset compensation are also provided.

6. 发明授权

US08257779B2 Viscous material noncontact jetting system 有权
标题翻译：粘性材料非接触喷射系统
公开(公告)号：US08257779B2
公开(公告)日：2012-09-04
申请号：US13079300
申请日：2011-04-04
申请人： Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, Jr. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
发明人： Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, Jr. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
IPC分类号： C23C16/52
CPC分类号： B05C11/1034 , B05C5/001 , B05C5/0225 , B05C11/10 , G05D7/0629 , H05K3/28 , H05K3/3484 , H05K2203/0736
摘要： A viscous material noncontact jetting system has a jetting dispenser mounted for relative motion with respect to a surface. A control is operable to cause the jetting dispenser to jet a viscous material droplet that is applied to the surface as a viscous material dot. A device, such as a camera or weigh scale, is connected to the control and provides a feedback signal representing a size-related physical characteristic of the dot applied to the surface. The size-related physical characteristics of subsequently applied dots is controlled by heating and cooling, or adjusting a piston stroke in the jetting dispenser, in response to the size-related physical characteristic feedback. Dispensed material volume control and velocity offset compensation are also provided.
摘要翻译：粘性材料非接触喷射系统具有安装成相对于表面相对运动的喷射分配器。控制器可操作以使喷射分配器喷射作为粘性材料点施加到表面的粘性物质液滴。诸如相机或称重秤的装置连接到控制器，并且提供表示应用于表面的点的与尺寸有关的物理特性的反馈信号。响应于尺寸相关的物理特性反馈，随后施加的点的尺寸相关的物理特性由加热和冷却或喷射分配器中的活塞行程调节来控制。还提供分配材料体积控制和速度偏移补偿。

7. 发明授权

US06173864B1 Viscous material dispensing system and method with feedback control 有权
标题翻译：粘性材料分配系统和方法与反馈控制
公开(公告)号：US06173864B1
公开(公告)日：2001-01-16
申请号：US09298325
申请日：1999-04-23
申请人： Michael A. Reighard , John P. Byers , Rick Zakrajsek , Alec J. Babiarz , Alan R. Lewis , Floriana Suriawidjaja
发明人： Michael A. Reighard , John P. Byers , Rick Zakrajsek , Alec J. Babiarz , Alan R. Lewis , Floriana Suriawidjaja
IPC分类号： B67D508
CPC分类号： G01F25/0092
摘要： A system for accurately dispensing controlled amounts of viscous material. The system includes a pressurized supply of the viscous material, a dispenser connected with the pressurized supply and a feedback control for ensuring that a discrete dispensed amount corresponds closely to the desired dispensed amount for a particular application. The different methods of feedback control include changing pressure of the pressurized supply after measuring a dispensed amount and comparing the dispensed amount with a stored value representing the desired amount. Another manner of feedback control includes changing an air operating pressure associated with the dispenser. A third type of feedback control includes adjusting the duration that the dispenser is maintained on to dispense the viscous material. Each of these types of feedback control are preferably used in succession, as necessary, to ensure that the desired amount of viscous material is discharged from the dispenser. Methods of controlling an amount of viscous material discharged from a dispenser further include using one or more of the feedback controls described above.
摘要翻译：用于精确分配受控量的粘性材料的系统。该系统包括加压供应的粘性材料，与加压供应器连接的分配器和用于确保离散分配量与特定应用的期望分配量紧密相对应的反馈控制。反馈控制的不同方法包括在测量分配量之后改变加压供应的压力，并将分配量与表示期望量的存储值进行比较。反馈控制的另一种方式包括改变与分配器相关联的空气操作压力。第三类反馈控制包括调整分配器维持的持续时间以分配粘性材料。根据需要，这些类型的反馈控制中的每一种优选连续使用以确保从分配器中排出所需量的粘性材料。控制从分配器排出的粘性物质的量的方法还包括使用上述一个或多个反馈控制。

8. 发明申请

US20120295405A1 METHODS FOR VACUUM ASSISTED UNDERFILLING 有权
标题翻译：真空辅助方法
公开(公告)号：US20120295405A1
公开(公告)日：2012-11-22
申请号：US13548965
申请日：2012-07-13
申请人： Alec J. Babiarz , Horatio Quinones , Thomas L. Ratledge , Jiangang Zhao
发明人： Alec J. Babiarz , Horatio Quinones , Thomas L. Ratledge , Jiangang Zhao
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , B23K37/00 , H01L21/324 , H01L24/27 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/01029 , H05K13/0465 , H01L2924/00 , H01L2924/3512
摘要： Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill onto a substrate proximate to at least one exterior edge of an electronic device attached to the substrate. A space between the electronic device and the substrate is evacuated through at least one gap in the underfill. The method further includes heating the underfill to cause the underfill to flow into the space. Because a vacuum condition is supplied in the open portion of the space before flow is initiated, the incidence of underfill voiding is lowered.
摘要翻译：在真空辅助下应用底部填充物的方法。该方法可以包括将底部填充物分配到靠近附接到衬底的电子设备的至少一个外部边缘的衬底上。电子设备和基板之间的空间通过底部填充物中的至少一个间隙被排出。该方法还包括加热底部填充物以使底部填充物流入空间。因为在开始流动之前在空间的开放部分中提供真空条件，所以底部填充排泄的发生率降低。

9. 发明申请

US20120178219A1 METHODS FOR VACUUM ASSISTED UNDERFILLING 审中-公开
公开(公告)号：US20120178219A1
公开(公告)日：2012-07-12
申请号：US13004198
申请日：2011-01-11
申请人： Alec J. Babiarz , Thomas L. Ratledge , Horatio Quinones
发明人： Alec J. Babiarz , Thomas L. Ratledge , Horatio Quinones
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , H01L23/295 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/131 , H01L2224/13147 , H01L2224/16227 , H01L2224/29012 , H01L2224/29026 , H01L2224/2929 , H01L2224/29388 , H01L2224/32225 , H01L2224/73204 , H01L2224/83048 , H01L2224/8309 , H01L2224/83102 , H01L2224/92125 , H01L2924/01029 , H01L2924/15311 , H01L2224/16225 , H01L2924/00 , H01L2924/3512 , H01L2924/0665 , H01L2924/00012 , H01L2924/014
摘要： Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill onto a substrate proximate to at least one exterior edge of an electronic device attached to the substrate. A space between the electronic device and the substrate is evacuated through at least one gap in the underfill. The method further includes heating the underfill to cause the underfill to flow into the space. Because a vacuum condition is supplied in the open portion of the space before flow is initiated, the incidence of underfill voiding is lowered.

10. 发明授权

US06352423B1 Apparatus for underfilling semiconductor devices 失效
标题翻译：用于底部填充半导体器件的设备
公开(公告)号：US06352423B1
公开(公告)日：2002-03-05
申请号：US09567165
申请日：2000-05-08
申请人： Alec J. Babiarz , Carlos Edward Bouras , Drusilla Bertone Cursi , Alan Ray Lewis , Jason Thomas Vint
发明人： Alec J. Babiarz , Carlos Edward Bouras , Drusilla Bertone Cursi , Alan Ray Lewis , Jason Thomas Vint
IPC分类号： H01L2144
CPC分类号： H01L21/67126 , H01L21/563 , H01L24/743 , H01L2224/16225 , H01L2224/73203 , H01L2924/01077 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H01L2924/00
摘要： A method and apparatus for underfilling a gap between a multi-sided semiconductor device and a substrate with viscous underfill material. The viscous underfill material is moved into the gap to encapsulate a plurality of electrical interconnections formed between the semiconductor device and the substrate. A seal is provided between the semiconductor device and the substrate to seal the gap along multiple sides of the device, while the gap is left unsealed along at least one side of the device to permit fluid communication with the gap. The viscous underfill material is dispensed adjacent the at least one side of the device along which the gap is unsealed, and a pressure differential is created across the underfill material to draw the underfill material into the gap and thereby encapsulate the electrical interconnections.
摘要翻译：一种在多面半导体器件与具有粘性底部填充材料的衬底之间填充间隙的方法和装置。将粘性底部填充材料移动到间隙中以封装形成在半导体器件和衬底之间的多个电互连。在半导体器件和衬底之间提供密封件，以沿着器件的多个边缘密封间隙，同时间隙沿着器件的至少一侧被开封以允许与间隙的流体连通。粘性底部填充材料邻近装置的至少一侧被分配，沿间隙开口封闭，并且在底部填充材料之间产生压差，以将底部填充材料拉入间隙中，从而封装电气互连。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式