专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US6126532A Polishing pads for a semiconductor substrate 失效
标题翻译：用于半导体衬底的抛光垫
公开(公告)号：US6126532A
公开(公告)日：2000-10-03
申请号：US114003
申请日：1998-07-10
申请人： Roland K. Sevilla , Frank B. Kaufman , Sriram P. Anjur
发明人： Roland K. Sevilla , Frank B. Kaufman , Sriram P. Anjur
IPC分类号： B24B37/22 , B24B37/24 , B24B41/047 , B24D3/32 , B24D13/14 , C09K3/14 , H01L21/304 , B24D7/22
CPC分类号： B24B37/24 , B24B37/22 , B24B41/047 , B24D3/32
摘要： A polishing pad for polishing a semiconductor wafer which includes an open-celled, porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capillary passage. The pores of the porous substrate have an average pore diameter of from about 5 to about 100 microns which enhances pad polishing performance.
摘要翻译：一种用于抛光半导体晶片的抛光垫，其包括具有合成树脂烧结颗粒的开孔多孔基材。多孔基材是均匀，连续且曲折的互连网络的毛细管通道。多孔基材的孔具有约5至约100微米的平均孔径，这增强了抛光性能。

2. 发明授权

US6062968A Polishing pad for a semiconductor substrate 失效
标题翻译：半导体衬底抛光垫
公开(公告)号：US6062968A
公开(公告)日：2000-05-16
申请号：US062327
申请日：1998-04-17
申请人： Roland K. Sevilla , Frank B. Kaufman , Sriram P. Anjur
发明人： Roland K. Sevilla , Frank B. Kaufman , Sriram P. Anjur
IPC分类号： B24B37/22 , B24B37/24 , B24B41/047 , B24D3/32 , B24D13/14 , H01L21/304 , B24D7/22
CPC分类号： B24B37/24 , B24B37/22 , B24B41/047 , B24D3/32
摘要： A polishing pad for polishing a semiconductor wafer which includes an open-celled, porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capillary passage.
摘要翻译：一种用于抛光半导体晶片的抛光垫，其包括具有合成树脂烧结颗粒的开孔多孔基材。多孔基材是均匀，连续且曲折的互连网络的毛细管通道。

3. 发明授权

US08741009B2 Polishing composition containing polyether amine 有权
标题翻译：含聚醚胺的抛光组合物
公开(公告)号：US08741009B2
公开(公告)日：2014-06-03
申请号：US12462067
申请日：2009-07-29
申请人： Jeffrey M. Dysard , Paul M. Feeney , Sriram P. Anjur , Timothy P. Johns , Yun-Biao Xin , Li Wang
发明人： Jeffrey M. Dysard , Paul M. Feeney , Sriram P. Anjur , Timothy P. Johns , Yun-Biao Xin , Li Wang
IPC分类号： C09K3/14 , B24D3/02 , C09C1/68 , C09G1/02
CPC分类号： C09K3/1463 , B24B37/044 , C09G1/02 , H01L21/3212
摘要： The inventive chemical-mechanical polishing system comprises a polishing component, a liquid carrier, and a polyether amine. The inventive method comprises chemically-mechanically polishing a substrate with the aforementioned polishing system.
摘要翻译：本发明的化学机械抛光系统包括抛光组分，液体载体和聚醚胺。本发明的方法包括用前述抛光系统对衬底进行化学机械抛光。

4. 发明授权

US07585340B2 Polishing composition containing polyether amine 有权
标题翻译：含聚醚胺的抛光组合物
公开(公告)号：US07585340B2
公开(公告)日：2009-09-08
申请号：US11412369
申请日：2006-04-27
申请人： Jeffrey M. Dysard , Paul M. Feeney , Sriram P. Anjur , Timothy P. Johns , Yun-Biao Xin , Li Wang
发明人： Jeffrey M. Dysard , Paul M. Feeney , Sriram P. Anjur , Timothy P. Johns , Yun-Biao Xin , Li Wang
IPC分类号： C09K3/14 , B24B7/19 , B24D11/00
CPC分类号： C09K3/1463 , B24B37/044 , C09G1/02 , H01L21/3212
摘要： The inventive chemical-mechanical polishing system comprises a polishing component, a liquid carrier, and a polyether amine. The inventive method comprises chemically-mechanically polishing a substrate with the aforementioned polishing system.
摘要翻译：本发明的化学机械抛光系统包括抛光组分，液体载体和聚醚胺。本发明的方法包括用前述抛光系统对衬底进行化学机械抛光。

5. 发明授权

US06685540B2 Polishing pad comprising particles with a solid core and polymeric shell 失效
标题翻译：抛光垫包括具有固体芯和聚合物壳的颗粒
公开(公告)号：US06685540B2
公开(公告)日：2004-02-03
申请号：US09995025
申请日：2001-11-27
申请人： Isaac K. Cherian , Sriram P. Anjur , Steven K. Grumbine
发明人： Isaac K. Cherian , Sriram P. Anjur , Steven K. Grumbine
IPC分类号： B24B100
CPC分类号： B24B37/24 , B24D3/32
摘要： The invention provides a polishing pad comprising composite particles that comprise a solid core encapsulated by a polymeric shell material, wherein the solid core comprises a material that differs from the polymeric shell material, as well as a method of polishing a substrate with such a polishing pad.
摘要翻译：本发明提供了一种包括复合颗粒的抛光垫，其包括由聚合物壳材料包封的固体芯，其中所述固体芯包括与所述聚合物壳材料不同的材料，以及用这种抛光垫抛光基材的方法。

6. 发明申请

US20090289033A1 Polishing composition containing polyether amine 有权
公开(公告)号：US20090289033A1
公开(公告)日：2009-11-26
申请号：US12462067
申请日：2009-07-29
申请人： Jeffrey M. Dysard , Paul M. Feeney , Sriram P. Anjur , Timothy P. Johns , Yun-Biao Xin , Li Wang
发明人： Jeffrey M. Dysard , Paul M. Feeney , Sriram P. Anjur , Timothy P. Johns , Yun-Biao Xin , Li Wang
IPC分类号： B44C1/22
CPC分类号： C09K3/1463 , B24B37/044 , C09G1/02 , H01L21/3212
摘要： The inventive chemical-mechanical polishing system comprises a polishing component, a liquid carrier, and a polyether amine. The inventive method comprises chemically-mechanically polishing a substrate with the aforementioned polishing system.

7. 发明授权

US07438795B2 Electrochemical-mechanical polishing system 失效
标题翻译：电化学机械抛光系统
公开(公告)号：US07438795B2
公开(公告)日：2008-10-21
申请号：US10865027
申请日：2004-06-10
申请人： Ian W. Wylie , Sriram P. Anjur
发明人： Ian W. Wylie , Sriram P. Anjur
IPC分类号： C25F17/00 , C25D17/00 , C25D5/00 , B24B7/22 , B24B37/04 , B24B53/07 , B24B1/00
CPC分类号： B24B37/26 , Y10T428/24273 , Y10T428/24355 , Y10T428/24628 , Y10T428/24917
摘要： Provided is a polishing apparatus and polishing pad, intended for polishing a substrate, and designed for improved flow and distribution of a polishing composition to the area of interaction between the pad and substrate. In one aspect, a polishing pad is provided having first and second pluralities of unidirectional pores configured to communicate polishing composition between the top and bottom surfaces of the pad. A cyclic flow of composition is established to continuously renew composition to the area of interaction between the pad and the substrate. In another aspect, a polishing apparatus is provided having a polishing composition transfer region between a polishing pad and a platen. Pores disposed through the pad communicate composition from the transfer region to the top surface. To facilitate directing the composition into the pores, the apparatus includes a plurality of protrusions protruding into the transfer region that are aligned with the pores.
摘要翻译：提供了用于抛光基底的抛光装置和抛光垫，并且被设计用于改善抛光组合物与垫和基底之间的相互作用区域的流动和分布。在一个方面，提供了具有第一和第二多个单向孔的抛光垫，其被构造成在衬垫的顶表面和底表面之间连通抛光组合物。建立循环流动的组合物以将组合物连续地更新到衬垫和衬底之间的相互作用区域。另一方面，提供一种抛光装置，其具有在抛光垫和压板之间的抛光组合物转印区域。通过衬垫布置的孔将组合物从转印区域传递到顶表面。为了便于将组合物引导到孔中，该装置包括突出到与孔对准的转移区域中的多个突起。

8. 发明授权

US6117000A Polishing pad for a semiconductor substrate 失效
标题翻译：半导体衬底抛光垫
公开(公告)号：US6117000A
公开(公告)日：2000-09-12
申请号：US113248
申请日：1998-07-10
申请人： Sriram P. Anjur , William C. Downing
发明人： Sriram P. Anjur , William C. Downing
IPC分类号： B24B37/24 , B24B37/26 , B24D3/32 , B24D11/00 , B24D13/14 , C09K3/14 , H01L21/304
CPC分类号： B24B37/24 , B24B37/26 , B24D11/00 , B24D3/32
摘要： A polishing pad for polishing a semiconductor wafer which includes an open-celled, porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capillary passage. The pad includes a bottom surface that is mechanically buffed to improve the adhesion of an adhesive to the pad bottom surface.
摘要翻译：一种用于抛光半导体晶片的抛光垫，其包括具有合成树脂烧结颗粒的开孔多孔基材。多孔基材是均匀，连续且曲折的互连网络的毛细管通道。该垫包括机械抛光以提高粘合剂与垫底表面的粘合性的底表面。

9. 发明授权

US5342336A Absorbent structure for masking and distributing a liquid 失效
标题翻译：用于掩蔽和分配液体的吸收结构
公开(公告)号：US5342336A
公开(公告)日：1994-08-30
申请号：US852848
申请日：1992-03-16
申请人： Randy E. Meirowitz , Sriram P. Anjur , Robert J. Phelan , Kim T. Tang
发明人： Randy E. Meirowitz , Sriram P. Anjur , Robert J. Phelan , Kim T. Tang
IPC分类号： A61F13/15
CPC分类号： A61F13/53717 , A61F13/51121 , A61F13/512 , A61F13/513 , A61F13/538 , A61F2013/15406 , A61F2013/15422 , A61F2013/15447 , A61F2013/53016 , A61F2013/530255 , A61F2013/530481 , A61F2013/53445 , A61F2013/53721
摘要： A structure for absorbing and transporting a liquid. The structure includes a masking layer having from 0 to about 90 weight percent shaped fibers and a distribution layer having from 100 to about 10 weight percent shaped fibers.
摘要翻译：用于吸收和输送液体的结构。该结构包括具有0至约90重量％成形纤维的掩模层和具有100至约10重量％成形纤维的分布层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式