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    • 2. 发明授权
    • Planar thermal array
    • 平面热阵列
    • US07170059B2
    • 2007-01-30
    • US10678527
    • 2003-10-03
    • Roland A. WoodRobert E. HigashiBarrett E. Cole
    • Roland A. WoodRobert E. HigashiBarrett E. Cole
    • G01J5/00
    • H01L27/14649G01J5/20
    • A thermal sensor structure having one level for an infrared detecting pixel including the sensor associated electronics. The electronics displace a small area thereby having little effect on the fill area of the pixel relative to a level having no pixel electronics. That level has thermally isolation for the substrate through the limited structural attachment to the substrate because of the access vias to the silicon. It has additional isolation because of a pit of removed silicon from the substrate below that one level. The thermal sensor may have an array with a large number of pixels having the one level for the pixels and electronics structure.
    • 一种热传感器结构,其具有用于红外检测像素的一个级别,该像素包括与传感器相关 电子装置移动一个小区域,从而对像素的填充面积相对于没有像素电子装置的水平几乎没有影响。 由于通向硅的通路,该水平通过与衬底的有限结构连接而对衬底进行热隔离。 它具有额外的隔离,因为从低于该水平面的衬底去除硅的坑。 热传感器可以具有具有用于像素和电子结构的一个级别的大量像素的阵列。
    • 4. 发明授权
    • Multi-substrate package assembly
    • 多基板封装组合
    • US07470894B2
    • 2008-12-30
    • US11383380
    • 2006-05-15
    • Barrett E. ColeRobert E. HigashiChristopher J. ZinsSubash Krishnankutty
    • Barrett E. ColeRobert E. HigashiChristopher J. ZinsSubash Krishnankutty
    • H01J5/02
    • G01J3/02G01J3/0256G01J3/26H01L31/02162H01L31/105H01L31/109
    • A multi-substrate package assembly having a first substrate, a second substrate and a package, each with a number of bond pads. The package includes a cavity for receiving either or both of the first and second substrates, with a number of bond pads positioned along at least part of the periphery of the cavity. The first substrate and the second substrate are preferably positioned in the cavity of the package, with selected bond pads of the first substrate and second substrate electrically connected to selected bond pads of the package. In some embodiments, the bond pads of the first substrate are only connected to bond pads on one or more sides of the cavity, and the bond pads of the second substrate are only connected to bond pads on one or more of the remaining sides of the cavity. The packaging assembly of the present invention can be used in many applications, including spectrally tunable optical detectors.
    • 一种具有第一基板,第二基板和封装的多基板封装组件,每个具有多个接合焊盘。 该封装包括用于接收第一和第二基板中的一个或两个的空腔,其中多个接合焊盘沿着空腔的至少一部分周边定位。 第一基板和第二基板优选地定位在封装的空腔中,其中第一基板和第二基板的选定的接合焊盘电连接到封装的选定的接合焊盘。 在一些实施例中,第一衬底的接合焊盘仅连接到空腔的一侧或多侧上的接合焊盘,并且第二衬底的接合焊盘仅连接到第一衬底的一个或多个侧面上的接合焊盘 腔。 本发明的包装组件可用于许多应用中,包括光谱可调光学检测器。
    • 5. 发明授权
    • Nanotube sensor
    • 纳米管传感器
    • US06949931B2
    • 2005-09-27
    • US10304351
    • 2002-11-26
    • Barrett E. ColeRobert E. Higashi
    • Barrett E. ColeRobert E. Higashi
    • G01N27/00G01N27/414G01N27/62
    • G01N27/4146Y10S977/953
    • A sensor having a nanotube grown on and supported by thermal bimorph structures. The nanotube rests on a heat sink during sensing gas or a liquid and is moved from the heat sink when the nanotube is heated to desorb gas or liquid from it. The heatsink may function as a gate along with the bimorph structures as the other terminals of a transistor. Current-voltage and current-gate voltage characteristics may be obtained of the nanotube as a device like a transistor. These characteristics may provide information on a gas or liquid absorbed by the nanotube.
    • 具有生长在热双晶体结构上并由其支撑的纳米管的传感器。 在感测气体或液体期间,纳米管位于散热器上,并且当加热纳米管以从其中解吸气体或液体时,其从散热器移动。 作为晶体管的其他端子,散热器可以与双压电晶片结构一起作为栅极。 作为像晶体管的器件,可以获得电流 - 电压和电流 - 栅极电压特性。 这些特性可以提供关于纳米管吸收的气体或液体的信息。