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    • 3. 发明授权
    • Coating method using aqueous photopolymerizable compositions
    • 使用水性光聚合组合物的涂布方法
    • US6045972A
    • 2000-04-04
    • US320919
    • 1999-05-27
    • Roger Pierre-Elie SalvinMartin Roth
    • Roger Pierre-Elie SalvinMartin Roth
    • G03F7/027G03C1/73G03C5/00G03F7/028G03F7/032G03F7/038H01L21/027H05K3/06H05K3/28
    • G03F7/027G03F7/032G03F7/0388
    • The claimed invention relates to a method for coating a substrate, preferably a printed circuit board, comprising the step of applying to said substrate surface a photopolymerizable water-borne aqueous-alkaline developable coating composition. The novel composition comprises a certain film-forming, acid group-containing acrylated derivative of an epoxy resin which is sufficiently neutralized with ammonia or an amine or an inorganic base to promote the formation of the corresponding ammonium or amine or inorganic base carboxylates by a neutralization reaction; a photoinitiator; water; and, optional components; as well as one or more additional optional (meth)acrylate monomer or (meth)acrylate oligomer or a vinyl compound that can be crosslinked with light. The method produces coated substrates that are non-tacky after drying and that have good edge coverage.
    • 要求保护的发明涉及一种用于涂覆基底,优选印刷电路板的方法,其包括向所述基底表面施加可光聚合的水性水性 - 碱性可显影涂料组合物的步骤。 该新型组合物包含一定量的形成环氧树脂的含酸基的丙烯酸酯化的衍生物,其与氨或胺或无机碱充分中和,以促进通过中和形成相应的铵或胺或无机碱羧酸盐 反应; 光引发剂; 水; 和可选组件; 以及一种或多种可以与光交联的任选的(甲基)丙烯酸酯单体或(甲基)丙烯酸酯低聚物或乙烯基化合物。 该方法产生在干燥后不发粘并且具有良好的边缘覆盖的涂覆的基底。
    • 4. 发明授权
    • Aqueous acrylic photopolymerisable compositions
    • 水性丙烯酸类可光聚合组合物
    • US5942371A
    • 1999-08-24
    • US714633
    • 1996-09-13
    • Roger Pierre-Elie SalvinMartin Roth
    • Roger Pierre-Elie SalvinMartin Roth
    • G03F7/027G03C1/73G03C5/00G03F7/028G03F7/032G03F7/038H01L21/027H05K3/06H05K3/28
    • G03F7/027G03F7/032G03F7/0388
    • Photopolymerisable compositions are described which comprisea) 20 to 80% by weight of a specific film-forming, acid group-containing acrylate of higher molecular weight which is neutralised with ammonia or an amine or an inorganic base, at least 10% by weight of component a) consisting of a acrylate of higher molecular weight which is derived from a reaction product of a polymolecular epoxy resin that is advanced with a bisphenol and an ethylenically unsaturated monocarboxylic acid and after subsequent reaction with a cyclic anhydride of an organic polycarboxylic acid,b) 0.1 to 15% by weight of a photoinitiator,c) 1 to 25% by weight of optional components, andd) water, as well ase) at least one additional optional (meth)acrylate monomer or (meth)acrylate oligomer or a vinyl compound that can be crosslinked with light.The compositions contain no additional polymolecular polymer binders and which can be used as aqueous applicable photoresist compositions, preferably for coating printed circuit boards. The coatings obtained therefrom are non-tacky after drying and have good edge coverage.
    • 描述了可光聚合组合物,其包含a)20至80重量%的具有成膜性,较高分子量的含酸基团的丙烯酸酯,其被氨或胺或无机碱中和,至少10重量% 组分a)由较高分子量的丙烯酸酯组成,该丙烯酸酯衍生自与双酚和烯键式不饱和一元羧酸一起进行的多分子环氧树脂的反应产物,随后与有机多元羧酸的环状酸反应,b )0.1至15重量%的光引发剂,c)1至25重量%的任选组分,和d)水,以及e)至少一种另外的任选的(甲基)丙烯酸酯单体或(甲基)丙烯酸酯低聚物或 可与光交联的乙烯基化合物。 所述组合物不含另外的多分子聚合物粘合剂,并且其可用作水溶性光致抗蚀剂组合物,优选用于涂布印刷电路板。 由此获得的涂层在干燥后是非粘性的并且具有良好的边缘覆盖。
    • 5. 发明授权
    • Solder resist coating from photosensitive composition containing water
as solvent or dispersant
    • 含有水作为溶​​剂或分散剂的光敏组合物的抗光蚀涂层
    • US5691006A
    • 1997-11-25
    • US568092
    • 1995-12-06
    • Roger Pierre-Elie SalvinAdrian Schulthess
    • Roger Pierre-Elie SalvinAdrian Schulthess
    • C08F299/02C08F2/50C08F4/00C08F290/00C08L101/00C09D4/00C09D4/02C09D4/06G03F7/027G03F7/032G03F7/033H05K3/06H05K3/28C08J7/04C08L31/02
    • G03F7/033G03F7/027G03F7/032Y10S430/111Y10S430/148
    • There are disclosed photosensitive compositions based on water as solvent and/or dispersant for the components of said compositions, comprising 10-50% by weight of water-soluble and/or water-dispersible solid, crosslinkable film-forming polymers as binder, 4-50% by weight of water-soluble and/or water-dispersible photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, 0.1 to 10% by weight of water-soluble and/or water-dispersible photoinitiator compounds for the photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, and if the binder contains non-selfcrosslinking polymers, 2.5-40% by weight of water-soluble and/or water-dispersible crosslinking agents for the polymeric binder as thermal hardener, selected from the group consisting of epoxy resins, melamine resins and blocked polyisocyanates. Preferred compositions contain carboxyl group-containing acrylate and methacrylate polymers and copolymers as binder, the carboxyl groups of which composition are reacted with ammonia and/or amines in an amount sufficient to ensure the water-solubility of the polymers and copolymers. The novel compositions are photoimageable and are particularly suitable for use as solder resists.
    • 公开了基于水作为所述组合物组分的溶剂和/或分散剂的光敏组合物,其包含10-50重量%的水溶性和/或水分散性固体,可交联成膜聚合物作为粘合剂,4- 50重量%的水溶性和/或水分散性可光聚合丙烯酸酯和/或甲基丙烯酸酯单体和/或相应的低聚物,0.1至10重量%的可光聚合丙烯酸酯的水溶性和/或水分散性光引发剂化合物,以及 /或甲基丙烯酸酯单体和/或相应的低聚物,并且如果粘合剂含有非自交联聚合物,则将2.5-40重量%的聚合粘合剂作为热硬化剂的水溶性和/或水分散性交联剂选自组 由环氧树脂,三聚氰胺树脂和封端的多异氰酸酯组成。 优选的组合物含有含羧基的丙烯酸酯和甲基丙烯酸酯和共聚物作为粘合剂,其组合物的羧基与氨和/或胺反应,其量足以确保聚合物和共聚物的水溶性。 该新型组合物是可光成像的并且特别适合用作阻焊剂。