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1. 发明授权

US4690962A Composition, coated article and method of coating 失效
标题翻译：组合物，涂层制品和涂层方法
公开(公告)号：US4690962A
公开(公告)日：1987-09-01
申请号：US835083
申请日：1986-04-07
申请人： Roger J. Clark , James Economy , Mary A. Flandera , John R. Susko , Robin A. Wheater
发明人： Roger J. Clark , James Economy , Mary A. Flandera , John R. Susko , Robin A. Wheater
IPC分类号： G03F7/025 , H01L21/312 , H01L23/14 , H01L23/498 , C08K5/34 , C08K5/00 , C08L49/00
CPC分类号： G03F7/025 , H01L21/312 , H01L23/145 , H01L23/49894 , H01L2924/0002
摘要： An electronic circuit having an electrically conductive pattern formed on a substrate and having on at least one surface of the substrate a film obtained from a soluble polymerizable oligomer of the formula: ##STR1## wherein D is ##STR2## wherein M is --C.tbd.C--, --C.tbd.C--C.tbd.C, --O--, ##STR3## wherein R is an alkyl or aromatic group; wherein Ar is an aromatic group; wherein x is an integer greater than two but less than 30, z is either zero or an integer, and y is an integer wtih the sum of y and z equal to x; and wherein n is an integer from 1 to 10. The substrate is coated by applying the above composition to the substrate and then hardening the composition by further polymerization. Preferred compositions contain the above described oligomer and certain plasticizers and/or toughening agents.
摘要翻译：一种电子电路，其具有形成在基板上的导电图案，并且在所述基板的至少一个表面上具有由下式的可溶性可聚合低聚物获得的膜：其中D是图像，其中M 其中R是烷基或芳族基团;其中R是烷基或芳基; 其中Ar是芳基; 其中x是大于2但小于30的整数，z是零或整数，y是y和z之和等于x的整数; 并且其中n是1至10的整数。通过将上述组合物施加到基材上然后通过进一步聚合硬化组合物来涂覆基材。优选的组合物含有上述低聚物和某些增塑剂和/或增韧剂。

2. 发明授权

US4592944A Method for providing a top seal coating on a substrate containing an electrically conductive pattern and coated article 失效
标题翻译：在包含导电图案和涂覆制品的基材上提供顶部密封涂层的方法
公开(公告)号：US4592944A
公开(公告)日：1986-06-03
申请号：US628980
申请日：1984-07-12
申请人： Roger J. Clark , James Economy , Mary A. Flandera , John R. Susko , Wheater, Robin A.
发明人： Roger J. Clark , James Economy , Mary A. Flandera , John R. Susko , Wheater, Robin A.
IPC分类号： G03F7/025 , H01L21/312 , H01L23/14 , H01L23/498 , B05D5/12
CPC分类号： H01L21/312 , G03F7/025 , H01L23/145 , H01L23/49894 , H01L2924/0002 , Y10S428/901 , Y10T428/24802 , Y10T428/24926
摘要： An electronic circuit having an electrically conductive pattern formed on a substrate and having on at least one surface of the substrate a film obtained from a soluble polymerizable oligomer of the formula: ##STR1## wherein M is --C.tbd.C--, --C.tbd.C--C.tbd.C, --O--, ##STR2## wherein R is an alkyl or aromatic group; wherein Ar is an aromatic group; wherein X is an integer greater than two but less than 30, z is either zero or an integer, and y is an integer with the sum of y and z equal to x; and wherein n is an integer from 1 to 10. The substrate is coated by applying the above composition to the substrate and then hardening the composition by further polymerization. Preferred compositions contain the above described oligomer and certain plasticizers and/or toughening agents.
摘要翻译：一种具有导电图形的电子电路，其形成在基板上，并且在所述基板的至少一个表面上具有由下式的可溶性可聚合低聚物获得的膜：其中M是-C 其中R是烷基或芳族基团;其中R是烷基或芳基; 其中Ar是芳基; 其中X是大于2但小于30的整数，z是零或整数，y是y和z之和等于x的整数; 并且其中n是1至10的整数。通过将上述组合物施加到基材上然后通过进一步聚合硬化组合物来涂覆基材。优选的组合物含有上述低聚物和某些增塑剂和/或增韧剂。

3. 发明授权

US4818812A Sealant for integrated circuit modules, polyester suitable therefor and preparation of polyester 失效
标题翻译：用于集成电路模块的密封胶，适用于其的聚酯和聚酯的制备
公开(公告)号：US4818812A
公开(公告)日：1989-04-04
申请号：US525387
申请日：1983-08-22
申请人： James Economy , John R. Susko , Willi Volksen , Robin A. Wheater
发明人： James Economy , John R. Susko , Willi Volksen , Robin A. Wheater
IPC分类号： C08G63/00 , C08G63/60 , C09J167/00 , C09K3/10 , H01B3/42 , H01L23/10 , H01L23/29 , H01L23/31 , C08G63/02
CPC分类号： H01L23/10 , C08G63/60 , H01B3/421 , H01L23/293 , H01L23/3142 , H01L2924/0002 , H01L2924/01079
摘要： Integrated circuit module wherein the cap is sealed to the substrate with a liquid crystalline polyester melt containing about 25 to about 100 mole percent of recurring Units I and O to about 75 mole percent of recurring Units II wherein ##STR1## wherein each R and R.sub.2 is arylene or cycloalkylene or alkylene or alkylidene.
摘要翻译：集成电路模块，其中所述盖子与液晶聚酯熔体密封，所述液晶聚酯熔体含有约25至约100摩尔％的重复单元I和O至约75摩尔％的重复单元II，其中其中每个R和R 2是亚芳基或亚环烷基或亚烷基或亚烷基。

4. 发明授权

US4410647A Epoxy composition and sealing of integrated circuit modules therewith 失效
标题翻译：集成电路模块的环氧组成和密封
公开(公告)号：US4410647A
公开(公告)日：1983-10-18
申请号：US210917
申请日：1980-11-28
申请人： John R. Susko , Robin A. Wheater
发明人： John R. Susko , Robin A. Wheater
IPC分类号： C08L65/00 , C08G59/00 , C08G59/42 , C08G67/04 , C08K3/00 , C08L63/00 , C09J163/00 , H01B3/40 , H01L23/10 , H01L23/29 , H01L23/31 , C08K3/34 , C08K5/45
CPC分类号： H01L23/10 , C08G59/42 , C08G59/4223 , C08G67/04 , C09J163/00 , H01B3/40 , H01L2224/16225 , H01L2924/01079
摘要： A composition containing an epoxy polymer, 4,4'(2-acetoxy-1,3 glyceryl)bis anhydro trimellitate; a polyanhydride; and a solid filler; method of preparation, and the sealing of integrated circuit modules therewith are provided.
摘要翻译：含有环氧聚合物4,4'（2-乙酰氧基-1,3-甘油基）双偏苯三酸酯的组合物; 聚酐和固体填料; 提供了制备方法以及集成电路模块的密封。

5. 发明授权

US5908235A Ballast fixture for fluorescent lighting 失效
标题翻译：镇流器用于荧光灯
公开(公告)号：US5908235A
公开(公告)日：1999-06-01
申请号：US846195
申请日：1997-04-28
申请人： James R. Petrozello , Fletcher W. Chapin , David W. Dranchak , Robert M. Murcko , Scott W. Knauss , Robert H. Katyl , John R. Susko
发明人： James R. Petrozello , Fletcher W. Chapin , David W. Dranchak , Robert M. Murcko , Scott W. Knauss , Robert H. Katyl , John R. Susko
IPC分类号： H05B41/02 , F21V21/00
CPC分类号： H05B41/02
摘要： The present invention features an integrated, electronic fluorescent ballast fixture which includes an electronic ballast packaged with a set of fluorescent lamp connectors into an integral fixture. The fixture has a circuit board that selectably supports up to four fluorescent lamps. The housing of the fixture id configured to receive a number of lamp connectors. The connectors are electrically, connected to the circuit board use wire and poke-in type connectors. When used with conventional, straight fluorescent lamps, a second set of sockets at the far end of the lamps are also connected to the circuit board using wires received in poke-in connector on the circuit board. The integrated ballast package also works with U-shaped lamps. The housing of the fixture is shaped to accommodate projecting electronic ballast components attached to the circuit board. The transformers and transistors of the circuit board may be thermally sinked, so that their heat is carried to the housing by thermally conductive means. The housing consists of two halves that are assembled together with snap-in action latches, making the fixture quickly and easily fabricated. The ballast fixture can be used with a wide variety of light fixtures because of its modularity, affording a high degree of universality.
摘要翻译：本发明的特征在于一种集成的电子荧光灯镇流器，其包括一个电子镇流器，该电子镇流器与一组荧光灯连接器一体化成一体的夹具。该灯具具有可选择地支撑多达四个荧光灯的电路板。固定装置的外壳被配置为接收多个灯连接器。连接器电气连接到电路板上，使用导线和插入式连接器。当与常规的直的荧光灯一起使用时，在灯的远端处的第二组插座也使用接在电路板上的插入式连接器中的导线连接到电路板。集成的镇流器封装也可与U形灯一起使用。固定装置的壳体被成形为容纳连接到电路板的突出的电子镇流器部件。电路板的变压器和晶体管可以被散热，使得它们的热量通过导热装置被传送到壳体。外壳由两个半部组成，与卡入动作闩锁组装在一起，使夹具快速轻松地制作。镇流器夹具可以与各种灯具一起使用，因为它的模块化，提供了高度的普遍性。

6. 发明授权

US4830706A Method of making sloped vias 失效
标题翻译：制作倾斜通孔的方法
公开(公告)号：US4830706A
公开(公告)日：1989-05-16
申请号：US915462
申请日：1986-10-06
申请人： Ronald S. Horwath , John R. Susko , Robin A. Susko
发明人： Ronald S. Horwath , John R. Susko , Robin A. Susko
IPC分类号： H01L21/302 , H01L21/3065 , H01L21/311 , H01L21/48 , H01L21/768 , H01L23/522
CPC分类号： H01L21/4803 , H01L21/31138
摘要： Sloped vias are formed in a resinous layer made from a material which is curable in stages, which can be coated on a substrate prior to partial curing, which adheres to the substrate and which shrinks upon full curing by a process which includes first using a dry, directional etch to form straight walled vias in a partially cured layer of the material coated on the substrate and then fully curing the layer. The straight walled vias are changed to sloped vias during final cure when adhesive contact between the substrate and the layer of resinous material inhibits shrinking of the side of the resinous layer which contacts the substrate, while the unsupported side of the layer is free to shrink. Such sloped vias are observed to improve the integrity of conductive coatings placed in the vias by reducing cracking, peeling and flaking thereof. Sloped vias with conductive coatings are useful in the construction of computer components.
摘要翻译：倾斜通孔形成在由可分阶段固化的材料制成的树脂层中，其可以在部分固化之前涂覆在基底上，该部分固化粘附到基底上，并且通过包括首先使用干燥的方法完全固化的收缩定向蚀刻以在涂覆在基材上的材料的部分固化层中形成直壁通孔，然后完全固化该层。当基材和树脂材料层之间的粘合剂接触抑制与基材接触的树脂层的侧面的收缩，同时层的无支撑侧自由收缩时，在最终固化期间将直壁通孔改变为倾斜的通孔。观察到这样的倾斜通孔，通过减少开裂，剥离和剥落来改善放置在通孔中的导电涂层的完整性。带导电涂层的斜槽可用于计算机部件的构造。

7. 发明授权

US4687539A End point detection and control of laser induced dry chemical etching 失效
标题翻译：激光诱导干化学蚀刻的终点检测和控制
公开(公告)号：US4687539A
公开(公告)日：1987-08-18
申请号：US924519
申请日：1986-10-29
申请人： Francis C. Burns , Russell W. Dreyfus , John R. Susko
发明人： Francis C. Burns , Russell W. Dreyfus , John R. Susko
IPC分类号： H01L21/302 , C23F1/12 , C23F4/02 , H01L21/3065 , C23F1/02 , B44C1/22 , C03C15/00 , C03C25/06
CPC分类号： C23F4/02
摘要： An end point detection technique indicates when a pulsed excimer laser, operating on a chromium clad copper substrate in the presence of chlorine gas, has etched through the chromium layer. The excimer laser vaporizes successive layers of the chromium chloride reaction product, which form on the region being etched, until, when all of the chromium has been removed from the region, a copper chloride reaction product layer forms on the region and is vaporized. A dye laser directs a probe beam into a zone spaced above the region being etched and is pulsed about 12 microseconds after each pulse of the excimer laser to allow time for the vaporized reaction products to reach the zone. The probe beam has a first wavelength of 433.3 nm. which induces the vaporized copper chloride in the zone to fluoresce at a second wavelength of 441.2 nm. A narrow band photodetector detects the fluoresced 441.2 nm. wavelength light to indicate that the end point has been reached, and the detection of the end point is used to terminate the pulsing of the excimer laser to end the etching process.

8. 发明授权

US4238528A Polyimide coating process and material 失效
标题翻译：聚酰亚胺涂层工艺和材料
公开(公告)号：US4238528A
公开(公告)日：1980-12-09
申请号：US81298
申请日：1979-10-02
申请人： Raymond W. Angelo , Richard M. Poliak , John R. Susko
发明人： Raymond W. Angelo , Richard M. Poliak , John R. Susko
IPC分类号： H01B3/30 , H01L21/312 , H01L21/56 , H01L23/29 , H01L23/31 , H05K3/28
CPC分类号： H05K3/284 , H01B3/306 , H01L21/312 , H01L21/56 , H01L23/293 , H01L23/3157 , H01L2224/16 , H01L2924/00013 , H01L2924/01012 , H05K2201/09872 , H05K2201/10977 , Y10T29/49146 , Y10T29/49171
摘要： A protective layer composition, suitable for protecting metal electrodes on components and other microelectronic circuitry, comprises an organic thermoplastic polymeric material, an organic solvent or solvents, and a non-ionic fluorocarbon surfactant as a wetting/leveling/flow control agent. A typical formulation comprises an aromatic polymer which cures to form a polyamide-imide polymer, an organic solvent or a mixture of orangic solvents and a non-ionic fluorocarbon surfactant.
摘要翻译：适用于保护组件和其他微电子电路上的金属电极的保护层组合物包括有机热塑性聚合材料，有机溶剂或溶剂以及作为润湿/流平/流动控制剂的非离子氟碳表面活性剂。一种典型的制剂包括固化形成聚酰胺 - 酰亚胺聚合物，有机溶剂或者奥氏体溶剂和非离子氟碳表面活性剂的混合物的芳族聚合物。

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