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    • 6. 发明申请
    • HIGH-VOLTAGE SEMICONDUCTOR DEVICE WITH LATERAL SERIES CAPACITIVE STRUCTURE
    • 具有横向串联电容结构的高压半导体器件
    • US20120146140A1
    • 2012-06-14
    • US13325712
    • 2011-12-14
    • Mohamed N. DarwishRobert Kuo-Chang Yang
    • Mohamed N. DarwishRobert Kuo-Chang Yang
    • H01L29/78H01L21/336
    • H01L29/7835H01L29/0634H01L29/0692H01L29/407H01L29/66659
    • A semiconductor device includes a semiconductor substrate, a source region extending along a top surface of the semiconductor substrate, a drain region extending along the top surface of the semiconductor substrate, and a field shaping region disposed within the semiconductor substrate between the source region and the drain region. A cross-section of the semiconductor substrate extending from the source region to the drain region through the field shaping region includes an insulating region. The semiconductor device also includes an active region disposed within the semiconductor substrate between the source region and the drain region. The active region is disposed adjacent to the field shaping region in a direction perpendicular to the cross-section of the semiconductor substrate extending from the source region to the drain region through the field shaping region.
    • 半导体器件包括半导体衬底,沿着半导体衬底的顶表面延伸的源极区域,沿着半导体衬底的顶表面延伸的漏极区域和设置在源极区域和半导体衬底之间的半导体衬底内的场整形区域 漏区。 通过场整形区域从源极区域延伸到漏极区域的半导体衬底的横截面包括绝缘区域。 半导体器件还包括在源极区域和漏极区域之间设置在半导体衬底内的有源区域。 有源区域在垂直于通过场整形区域从源极区域延伸到漏极区域的半导体衬底的横截面的方向上与场整形区域相邻设置。
    • 7. 发明授权
    • DMOS transistor with floating poly-filled trench for improved performance through 3-D field shaping
    • 具有浮动多晶填充沟槽的DMOS晶体管,用于通过3-D场成形改善性能
    • US07514743B2
    • 2009-04-07
    • US11351644
    • 2006-02-09
    • Robert Kuo-Chang Yang
    • Robert Kuo-Chang Yang
    • H01L29/40
    • H01L29/7802H01L21/823487H01L29/0696H01L29/407H01L29/4238H01L29/7803H01L29/7813
    • One or more vertical DMOS transistors, such as trench FETS, are formed between opposing floating poly-filled trench portions. The opposing trench portions may include two parallel trenches, rectangular trenches, hexagonal trenches, octagonal trenches, circular trenches, or other shapes. The floating trench portions are capacitively coupled to assume a potential somewhere between the high drain voltage (below the trenches) and the body voltage (near the top of the trenches). The floating trench portions will have a potential below the drift region and deplete the drift region. The depletion regions caused by the opposing trench portions will merge under the gate with a sufficiently high drain voltage. The electric field lines in the drift region will be shaped to increase the breakdown voltage of the device.
    • 在相对的浮动多晶填充沟槽部分之间形成一个或多个垂直DMOS晶体管,例如沟槽FET。 相对的沟槽部分可以包括两个平行的沟槽,矩形沟槽,六边形沟槽,八边形沟槽,圆形沟槽或其它形状。 浮动沟槽部分电容耦合以在高漏极电压(沟槽下方)和体电压(靠近沟槽顶部)之间的某处存在电位。 浮动沟槽部分将具有位于漂移区域下方的电位并耗尽漂移区域。 由相对的沟槽部分引起的耗尽区域将在栅极下面以足够高的漏极电压合并。 漂移区域中的电场线将被成形以增加器件的击穿电压。
    • 9. 发明授权
    • Trench junction field-effect transistor
    • 沟槽结场效应晶体管
    • US08704296B2
    • 2014-04-22
    • US13408212
    • 2012-02-29
    • Robert Kuo-Chang Yang
    • Robert Kuo-Chang Yang
    • H01L29/66
    • H01L29/407H01L29/1608H01L29/20H01L29/808
    • In a general aspect, a semiconductor device can include a gate having a first trench portion disposed within a first trench of a junction field-effect transistor device, a second trench portion disposed within a second trench of the junction field-effect transistor device, and a top portion coupled to both the first trench portion and to the second trench portion. The semiconductor device can include a mesa region disposed between the first trench and the second trench, and including a single PN junction defined by an interface between a substrate dopant region having a first dopant type and a channel dopant region having a second dopant type.
    • 在一般方面,半导体器件可以包括具有设置在结型场效应晶体管器件的第一沟槽内的第一沟槽部分的第一沟槽部分,以及设置在结型场效应晶体管器件的第二沟槽内的第二沟道部分,以及 耦合到第一沟槽部分和第二沟槽部分的顶部。 半导体器件可以包括设置在第一沟槽和第二沟槽之间的台面区域,并且包括由具有第一掺杂剂类型的衬底掺杂区域和具有第二掺杂剂类型的沟道掺杂剂区域之间的界面限定的单个PN结。
    • 10. 发明授权
    • High-voltage semiconductor device with lateral series capacitive structure
    • 具有横向串联电容结构的高压半导体器件
    • US08592906B2
    • 2013-11-26
    • US13325712
    • 2011-12-14
    • Mohamed N. DarwishRobert Kuo-Chang Yang
    • Mohamed N. DarwishRobert Kuo-Chang Yang
    • H01L29/78H01L21/336
    • H01L29/7835H01L29/0634H01L29/0692H01L29/407H01L29/66659
    • A semiconductor device includes a semiconductor substrate, a source region extending along a top surface of the semiconductor substrate, a drain region extending along the top surface of the semiconductor substrate, and a field shaping region disposed within the semiconductor substrate between the source region and the drain region. A cross-section of the semiconductor substrate extending from the source region to the drain region through the field shaping region includes an insulating region. The semiconductor device also includes an active region disposed within the semiconductor substrate between the source region and the drain region. The active region is disposed adjacent to the field shaping region in a direction perpendicular to the cross-section of the semiconductor substrate extending from the source region to the drain region through the field shaping region.
    • 半导体器件包括半导体衬底,沿着半导体衬底的顶表面延伸的源极区域,沿着半导体衬底的顶表面延伸的漏极区域和设置在源极区域和半导体衬底之间的半导体衬底内的场整形区域 漏区。 通过场整形区域从源极区域延伸到漏极区域的半导体衬底的横截面包括绝缘区域。 半导体器件还包括在源极区域和漏极区域之间设置在半导体衬底内的有源区域。 有源区域在垂直于通过场整形区域从源极区域延伸到漏极区域的半导体衬底的横截面的方向上与场整形区域相邻设置。