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1. 发明授权

US06220942B1 CMP platen with patterned surface 有权
公开(公告)号：US06220942B1
公开(公告)日：2001-04-24
申请号：US09285508
申请日：1999-04-02
申请人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Sidney Huey , Fred C. Redeker
发明人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Sidney Huey , Fred C. Redeker
IPC分类号： B24B704
CPC分类号： B24B37/16
摘要： A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.

2. 发明授权

US06592438B2 CMP platen with patterned surface 有权
标题翻译：带有图案表面的CMP压板
公开(公告)号：US06592438B2
公开(公告)日：2003-07-15
申请号：US09759556
申请日：2001-01-12
申请人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Sidney Huey , Fred C. Redeker
发明人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Sidney Huey , Fred C. Redeker
IPC分类号： B24B700
CPC分类号： B24B37/26 , B24B37/16 , Y10S451/921
摘要： A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.
摘要翻译：提供了具有一个以上抛光站的化学机械抛光系统。抛光站包括安装到压板上表面的压板和衬垫。将压板的上表面图案化以限定凸起区域和凹陷区域。凸起区域为衬垫提供刚性的安装表面，并且凹陷区域在衬垫与衬底接触时向衬垫提供期望程度的柔性和顺应性。

3. 发明授权

US06217426B1 CMP polishing pad 失效
公开(公告)号：US06217426B1
公开(公告)日：2001-04-17
申请号：US09287575
申请日：1999-04-06
申请人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Steven Zuniga , Hung Chen
发明人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Steven Zuniga , Hung Chen
IPC分类号： B24B100
CPC分类号： B24B37/26 , B24B37/16 , Y10S451/921
摘要： A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.

4. 发明授权

US06575825B2 CMP polishing pad 有权
标题翻译： CMP抛光垫
公开(公告)号：US06575825B2
公开(公告)日：2003-06-10
申请号：US09759858
申请日：2001-01-12
申请人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Steven Zuniga , Hung Chen
发明人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Steven Zuniga , Hung Chen
IPC分类号： B24D1102
CPC分类号： B24B37/26 , B24B37/16 , Y10S451/921
摘要： A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.
摘要翻译：提供了一种用于化学机械抛光系统的抛光垫。衬垫安装到可旋转的压板上并且包括抛光表面和偏转表面，当与衬底接触时，该抛光表面和偏转表面提供期望的刚度和顺应性。偏转表面可以包括延伸穿过垫的一个或多个通道，其通向大气。在一个实施例中，偏转区域限定凸起区域和凹陷区域。凸起区域为压板提供安装表面，而凹陷区域允许焊盘的顺应性。在另一个实施例中，偏转区域包括限定多个倾斜突起的多个通道。通道可以不相交，使得倾斜突起是设置在垫上的细长部分。或者，通道可以相交，使得倾斜的突起彼此隔离并且以间隔的关系设置在垫上。

5. 发明授权

US06220941B1 Method of post CMP defect stability improvement 有权
公开(公告)号：US06220941B1
公开(公告)日：2001-04-24
申请号：US09164860
申请日：1998-10-01
申请人： Boris Fishkin , Charles C. Garretson , Peter McKeever , Thomas H. Osterheld , Gopalakrishna B. Prabhu , Doyle E. Bennett , Benjamin A. Bonner , Sidney Huey
发明人： Boris Fishkin , Charles C. Garretson , Peter McKeever , Thomas H. Osterheld , Gopalakrishna B. Prabhu , Doyle E. Bennett , Benjamin A. Bonner , Sidney Huey
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B37/04 , B24B57/02
摘要： The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces, such as a polishing pad surface and a substrate surface, by delivering a spray of one or more rinse agents to the surface and, preferably, causing the rinse agent to flow across the surface from a central region to an outer region where unwanted debris and material is collected.

6. 发明申请

US20120028548A1 RETAINING RING WITH SHAPED PROFILE 有权
标题翻译：具有形状轮廓的保持环
公开(公告)号：US20120028548A1
公开(公告)日：2012-02-02
申请号：US13269488
申请日：2011-10-07
申请人： Gopalakrishna B. Prabhu , Yin Yuan , Jeonghoon Oh , Gregory E. Menk
发明人： Gopalakrishna B. Prabhu , Yin Yuan , Jeonghoon Oh , Gregory E. Menk
IPC分类号： B24B1/00 , B24B41/06
CPC分类号： B24B37/32 , H01L21/68721 , Y10T292/205
摘要： Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.
摘要翻译：描述具有弯曲表面的保持环。当在抛光过程中使用保持环时，弯曲表面可防止固定的研磨抛光垫损坏。弯曲表面位于环的底表面上，例如沿着形成在环的底部的通道的外径和/或沿着通道的侧壁。

7. 发明授权

US07553214B2 Polishing article with integrated window stripe 失效
标题翻译：具有集成窗口条纹的抛光物品
公开(公告)号：US07553214B2
公开(公告)日：2009-06-30
申请号：US11707548
申请日：2007-02-15
申请人： Gregory E. Menk , Peter McReynolds , Erik S. Rondum , Anand N. Iyer , Gopalakrishna B. Prabhu , Garlen C. Leung
发明人： Gregory E. Menk , Peter McReynolds , Erik S. Rondum , Anand N. Iyer , Gopalakrishna B. Prabhu , Garlen C. Leung
IPC分类号： B24B49/12 , B24D11/00
CPC分类号： B24B21/06 , B24B21/04 , B24B21/12 , B24B37/12 , B24B37/205 , B24B37/26 , B24D11/001
摘要： A method is described. The method includes contacting a non-solid material to a non-linear edge of a sheet of polishing material, and causing the non-solid material to solidify to form a window that contacts the non-linear edge of the polishing material.
摘要翻译：描述了一种方法。该方法包括使非固体材料与抛光材料片的非线性边缘接触，并使非固体材料固化以形成接触抛光材料的非线性边缘的窗口。

8. 发明授权

US07429210B2 Materials for chemical mechanical polishing 有权
标题翻译：化学机械抛光材料
公开(公告)号：US07429210B2
公开(公告)日：2008-09-30
申请号：US11626014
申请日：2007-01-23
申请人： Benjamin A. Bonner , Peter McReynolds , Gregory E. Menk , Anand N. Iyer , Gopalakrishna B. Prabhu , Erik S. Rondum , Robert L. Jackson , Garlen Leung
发明人： Benjamin A. Bonner , Peter McReynolds , Gregory E. Menk , Anand N. Iyer , Gopalakrishna B. Prabhu , Erik S. Rondum , Robert L. Jackson , Garlen Leung
IPC分类号： B24D11/00
CPC分类号： B24D11/00 , B24B7/228 , B24D2203/00
摘要： A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.
摘要翻译：公开了一种用于制造用于化学机械抛光工艺的抛光制品的抛光制品和方法。抛光制品具有由在抛光材料中或通过抛光材料形成的凹槽分开的多个抛光材料砖，并且可以粘合地结合到基膜上。抛光制品可以包括在抛光材料中形成的各种多边形瓦片和椭圆形形状，其允许增强的浆料保持性并且容易地从研磨材料供给辊滚动到卷筒纸型压板组件中的卷取辊上。抛光制品还可以包括适于最小化抛光制品的不适于抛光的区域中的分层应力的上载体薄膜。还公开了用于制造抛光制品和替换供应辊的各种实施例的方法和装置。

9. 发明申请

US20120053721A1 FEEDBACK CONTROL OF A CHEMICAL MECHANICAL POLISHING DEVICE PROVIDING MANIPULATION OF REMOVAL RATE PROFILES 有权
标题翻译：提供拆卸速率配置文件的化学机械抛光装置的反馈控制
公开(公告)号：US20120053721A1
公开(公告)日：2012-03-01
申请号：US13292029
申请日：2011-11-08
申请人： Arulkumar P. Shanmugasundram , Alexander T. Schwarm , Gopalakrishna B. Prabhu
发明人： Arulkumar P. Shanmugasundram , Alexander T. Schwarm , Gopalakrishna B. Prabhu
IPC分类号： G05B13/04
CPC分类号： B24B37/013 , B24B37/042 , B24B49/03 , B24B49/04 , B24B49/18 , G05B19/00 , G05B19/19 , G05B19/41865 , G05B2219/32053 , G05B2219/32065 , G05B2219/45031 , H01L21/31053 , H01L21/67253 , H01L21/67276 , H01L22/20 , H01L2924/0002 , Y02P90/20 , Y02P90/22 , H01L2924/00
摘要： A method of controlling surface non-uniformity of a wafer in a polishing operation includes (a) providing a model for a wafer polishing that defines a plurality of regions on a wafer and identifies a wafer material removal rate in a polishing step of a polishing process for each of the regions, wherein the polishing process comprises a plurality of polishing steps, (b) polishing a wafer using a first polishing recipe based upon an incoming wafer thickness profile, (c) determining a wafer thickness profile for the post-polished wafer of step (b), and (d) calculating an updated polishing recipe based upon the wafer thickness profile of step (c) and the model of step (a) to maintain a target wafer thickness profile. The model can information about the tool state to improve the model quality. The method can be used to provide feedback to a plurality of platen stations.
摘要翻译：在抛光操作中控制晶片的表面不均匀性的方法包括：（a）提供在晶片上限定多个区域的晶片抛光模型，并且识别在抛光过程的抛光步骤中的晶片材料去除速率对于每个区域，其中所述抛光工艺包括多个抛光步骤，（b）基于进入的晶片厚度轮廓使用第一抛光配方抛光晶片，（c）确定后抛光晶片的晶片厚度分布的步骤（b）的模型，和（d）基于步骤（c）的晶片厚度分布和步骤（a）的模型来计算更新的抛光配方，以维持目标晶片厚度轮廓。该模型可以提供关于工具状态的信息，以提高模型质量。该方法可以用于向多个压板站提供反馈。

10. 发明授权

US07841925B2 Polishing article with integrated window stripe 有权
标题翻译：具有集成窗口条纹的抛光物品
公开(公告)号：US07841925B2
公开(公告)日：2010-11-30
申请号：US12488437
申请日：2009-06-19
申请人： Gregory E. Menk , Peter McReynolds , Erik S. Rondum , Anand N. Iyer , Gopalakrishna B. Prabhu , Garlen C. Leung
发明人： Gregory E. Menk , Peter McReynolds , Erik S. Rondum , Anand N. Iyer , Gopalakrishna B. Prabhu , Garlen C. Leung
IPC分类号： B24B49/12
CPC分类号： B24B21/06 , B24B21/04 , B24B21/12 , B24B37/12 , B24B37/205 , B24B37/26 , B24D11/001
摘要： A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality of recesses extending parallel to the polishing surface and disposed in an alternating pattern along the first axis.
摘要翻译：抛光制品包括在抛光层中具有抛光表面和固体透光窗的抛光层，该窗具有沿平行于研磨表面的第一轴延伸的第一非线性边缘，第一非线性边缘包括多个突起和与所述抛光表面平行延伸并沿所述第一轴线交替设置的多个凹槽。

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