会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Die singulation method and package formed thereby
    • 由此形成分片方法和封装
    • US08236611B1
    • 2012-08-07
    • US12758833
    • 2010-04-13
    • Robert C. AndersonRandy J. ShulPeggy J. ClewsMichael S. BakerMaarten P. De Boer
    • Robert C. AndersonRandy J. ShulPeggy J. ClewsMichael S. BakerMaarten P. De Boer
    • H01L21/00
    • H01L21/78
    • A method is disclosed for singulating die from a substrate having a sacrificial layer and one or more device layers, with a retainer being formed in the device layer(s) and anchored to the substrate. Deep Reactive Ion Etching (DRIE) etching of a trench through the substrate from the bottom side defines a shape for each die. A handle wafer is then attached to the bottom side of the substrate, and the sacrificial layer is etched to singulate the die and to form a frame from the retainer and the substrate. The frame and handle wafer, which retain the singulated die in place, can be attached together with a clamp or a clip and to form a package for the singulated die. One or more stops can be formed from the device layer(s) to limit a sliding motion of the singulated die.
    • 公开了一种用于从具有牺牲层和一个或多个器件层的衬底分离裸片的方法,其中保持器形成在器件层中并固定到衬底。 深层反应离子蚀刻(DRIE)从底侧蚀刻通过衬底的沟槽限定了每个管芯的形状。 然后将手柄晶片附接到基板的底侧,并且牺牲层被蚀刻以对模具进行分割并从保持器和基板形成框架。 将单个模具保持在适当位置的框架和处理晶片可以用夹子或夹子附接在一起并形成用于单个模具的封装。 可以从设备层形成一个或多个止挡件,以限制单模模具的滑动运动。