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1. 发明授权

US09630379B2 Laminated composite made up of an electronic substrate and a layer arrangement comprising a reaction solder 有权
公开(公告)号：US09630379B2
公开(公告)日：2017-04-25
申请号：US14348747
申请日：2012-09-21
申请人： Robert Bosch GmbH
发明人： Thomas Kalich , Christiane Frueh , Franz Wetzl , Bernd Hohenberger , Rainer Holz , Andreas Fix , Michael Guyenot , Andrea Feiock , Michael Guenther , Martin Rittner
IPC分类号： B22F7/00 , B32B15/01 , B23K1/00 , B23K35/30 , B23K35/02 , H01L23/00 , B23K1/19 , B23K101/42
CPC分类号： B32B15/01 , B23K1/0006 , B23K1/0016 , B23K1/19 , B23K35/0238 , B23K35/30 , B23K2101/42 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/2908 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29139 , H01L2224/29147 , H01L2224/29155 , H01L2224/29209 , H01L2224/29211 , H01L2224/29213 , H01L2224/29218 , H01L2224/29239 , H01L2224/29247 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/83191 , H01L2224/83192 , H01L2224/8382 , H01L2924/01327 , H01L2924/12042 , H01L2924/15747 , H01L2924/15787 , Y10T428/12063 , Y10T428/12222 , H01L2924/00
摘要： Laminated composite (10) comprising at least one electronic substrate (11) and an arrangement of layers (20, 30) made up of at least a first layer (20) of a first metal and/or a first metal alloy and of a second layer (30) of a second metal and/or a second metal alloy adjacent to this first layer (20), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (20, 30), a region with at least one intermetallic phase (40) is formed between the first layer and the second layer, wherein the first layer (20) or the second layer (30) is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melting temperature of the AgX, CuX or NiX alloy is greater than the melting temperature of the basic solder. The invention also relates to a method for forming a laminated composite (10) and to a circuit arrangement containing a laminated composite (10) according to the invention.

2. 发明申请

US20140248505A1 LAMINATED COMPOSITE MADE UP OF AN ELECTRONIC SUBSTRATE AND A LAYER ARRANGEMENT COMPRISING A REACTION SOLDER 有权
标题翻译：电子基板的层叠复合材料和包含反应焊料的层布置
公开(公告)号：US20140248505A1
公开(公告)日：2014-09-04
申请号：US14348747
申请日：2012-09-21
申请人： Robert Bosch GmbH
发明人： Thomas Kalich , Christiane Frueh , Franz Wetzl , Bernd Hohenberger , Rainer Holz , Andreas Fix , Michael Guyenot , Andrea Feiock , Michael Guenther , Martin Rittner
IPC分类号： B32B15/01 , B23K1/00
CPC分类号： B32B15/01 , B23K1/0006 , B23K1/0016 , B23K1/19 , B23K35/0238 , B23K35/30 , B23K2101/42 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/2908 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29139 , H01L2224/29147 , H01L2224/29155 , H01L2224/29209 , H01L2224/29211 , H01L2224/29213 , H01L2224/29218 , H01L2224/29239 , H01L2224/29247 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/83191 , H01L2224/83192 , H01L2224/8382 , H01L2924/01327 , H01L2924/12042 , H01L2924/15747 , H01L2924/15787 , Y10T428/12063 , Y10T428/12222 , H01L2924/00
摘要： Laminated composite (10) comprising at least one electronic substrate (11) and an arrangement of layers (20, 30) made up of at least a first layer (20) of a first metal and/or a first metal alloy and of a second layer (30) of a second metal and/or a second metal alloy adjacent to this first layer (20), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (20, 30), a region with at least one intermetallic phase (40) is formed between the first layer and the second layer, wherein the first layer (20) or the second layer (30) is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melting temperature of the AgX, CuX or NiX alloy is greater than the melting temperature of the basic solder. The invention also relates to a method for forming a laminated composite (10) and to a circuit arrangement containing a laminated composite (10) according to the invention.
摘要翻译：包括至少一个电子基板（11）和由至少第一金属和/或第一金属合金的第一层（20）和第二金属合金构成的层（20,30）的布置的层压复合材料（10）与第一层（20）相邻的第二金属和/或第二金属合金的层（30），其中第一和第二层的熔化温度不同，并且其中在层的布置（ 20,30），在第一层和第二层之间形成具有至少一个金属间相（40）的区域，其中第一层（20）或第二层（30）由反应焊料形成，反应焊料由碱性焊料与AgX，CuX或NiX合金的混合物，其中AgX，CuX或NiX合金的组分X选自B，Mg，Al，Si，Ca，Se，Ti，V， Cr，Mn，Fe，Co，Ni，Cu，Zn，Ga，Ge，Y，Zr，Nb，Mo，Ag，In，Sn，Sb，Ba，Hf，Ta，W，Au，Bi，La，Ce， Pr，Nd，Gd，Dy，Sm，Er，Tb，Eu，Ho，Tm，Yb等 Lu，其中AgX，CuX或NiX合金的熔融温度大于碱性焊料的熔融温度。本发明还涉及层压复合材料（10）的形成方法和包含根据本发明的叠层复合材料（10）的电路装置。

3. 发明授权

US09871025B2 Commutation cell 有权
公开(公告)号：US09871025B2
公开(公告)日：2018-01-16
申请号：US15308287
申请日：2015-04-21
申请人： Robert Bosch GmbH
发明人： Walter Daves , Knut Alexander Kasper , Martin Rittner , Silvia Duernsteiner , Michael Guenther
IPC分类号： H01L25/16 , H01L23/498 , H01L23/00 , H03K17/567
CPC分类号： H01L25/16 , H01L23/49833 , H01L23/49838 , H01L24/33 , H01L24/83 , H01L2224/29139 , H01L2224/32225 , H01L2224/33181 , H01L2224/8384 , H01L2924/0002 , H03K17/567 , H01L2924/00
摘要： A commutation cell having at least one electrical capacitor, at least one controllable semiconductor switch and at least one semiconductor which is connected in series with the controllable semiconductor switch. The commutation cell has three circuit substrates situated in parallel with one another. The controllable semiconductor switch is connected in series with the semiconductor via a circuit substrate situated partially between the controllable semiconductor switch and the semiconductor, and the two remaining circuit substrates being connected to one another in an electrically conductive manner via a subassembly made up of the controllable semiconductor switch, the semiconductor and the circuit substrate situated partially between the controllable semiconductor switch and the semiconductor, the electrical capacitor being switched between the two remaining circuit substrates, separately from the subassembly.

4. 发明申请

US20150123263A1 TWO-STEP METHOD FOR JOINING A SEMICONDUCTOR TO A SUBSTRATE WITH CONNECTING MATERIAL BASED ON SILVER 审中-公开
标题翻译：将半导体接合到具有基于银的连接材料的基板的两步法
公开(公告)号：US20150123263A1
公开(公告)日：2015-05-07
申请号：US14400121
申请日：2013-04-02
申请人： Robert Bosch GmbH
发明人： Christiane Frueh , Michael Guenther , Thomas Herboth
IPC分类号： H01L23/00
CPC分类号： H01L24/83 , H01L24/27 , H01L24/29 , H01L24/32 , H01L2224/2731 , H01L2224/2732 , H01L2224/27442 , H01L2224/27505 , H01L2224/27901 , H01L2224/29082 , H01L2224/29083 , H01L2224/29339 , H01L2224/32225 , H01L2224/75315 , H01L2224/831 , H01L2224/83192 , H01L2224/83203 , H01L2224/83208 , H01L2224/8384 , H01L2924/01047 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/15747 , H01L2924/201 , H01L2924/20101 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/00
摘要： The invention relates to a method for joining a semiconductor (20) to a substrate (10), comprising the following steps: •applying a first paste layer (1) of a sintering paste to the substrate; •heating and compressing the first paste layer to form a first sintered layer; •applying a second paste layer (2) of a sintering paste to the first sintered layer and arranging a semiconductor (20) on the second paste layer; •heating and compressing the second paste layer (2) to form a second sintered layer. The invention further relates to a semiconductor component produced by means of the method.
摘要翻译：本发明涉及将半导体（20）接合到基板（10）的方法，包括以下步骤：将烧结糊的第一糊剂层（1）施加到基底上; 加热和压缩第一浆料层以形成第一烧结层; 将烧结膏的第二浆料层（2）施加到所述第一烧结层并将半导体（20）布置在所述第二糊料层上; 加热和压缩第二浆料层（2）以形成第二烧结层。本发明还涉及通过该方法制造的半导体部件。

5. 发明申请

US20170069608A1 COMMUTATION CELL 有权
标题翻译：通讯电话
公开(公告)号：US20170069608A1
公开(公告)日：2017-03-09
申请号：US15308287
申请日：2015-04-21
申请人： Robert Bosch GmbH
发明人： Walter Daves , Knut Alexander Kasper , Martin Rittner , Silvia Duernsteiner , Michael Guenther
IPC分类号： H01L25/16 , H01L23/00 , H03K17/567 , H01L23/498
CPC分类号： H01L25/16 , H01L23/49833 , H01L23/49838 , H01L24/33 , H01L24/83 , H01L2224/29139 , H01L2224/32225 , H01L2224/33181 , H01L2224/8384 , H01L2924/0002 , H03K17/567 , H01L2924/00
摘要： A commutation cell having at least one electrical capacitor, at least one controllable semiconductor switch and at least one semiconductor which is connected in series with the controllable semiconductor switch. The commutation cell has three circuit substrates situated in parallel with one another. The controllable semiconductor switch is connected in series with the semiconductor via a circuit substrate situated partially between the controllable semiconductor switch and the semiconductor, and the two remaining circuit substrates being connected to one another in an electrically conductive manner via a subassembly made up of the controllable semiconductor switch, the semiconductor and the circuit substrate situated partially between the controllable semiconductor switch and the semiconductor, the electrical capacitor being switched between the two remaining circuit substrates, separately from the subassembly.
摘要翻译：一种具有至少一个电容器，至少一个可控半导体开关和至少一个与可控半导体开关串联连接的半导体的换向单元。换向单元具有彼此平行设置的三个电路基板。可控半导体开关经由部分位于可控半导体开关和半导体之间的电路基板与半导体串联连接，并且剩余的两个电路基板通过由可控制的半导体组件构成的子组件以导电方式彼此连接半导体开关，半导体和电路基板部分地位于可控半导体开关和半导体之间，电容器在两个剩余的电路基板之间与子组件分开切换。

6. 发明授权

US09502634B2 Piezoelectric component and method for producing a piezoelectric component 有权
标题翻译：压电元件及其制造方法
公开(公告)号：US09502634B2
公开(公告)日：2016-11-22
申请号：US14151961
申请日：2014-01-10
申请人： Robert Bosch GmbH
发明人： Reinhold Melcher , Michael Guenther
IPC分类号： H01L41/047 , H01L41/293 , H01L41/113 , H01L41/313
CPC分类号： H01L41/0477 , H01L41/0472 , H01L41/0475 , H01L41/1132 , H01L41/293 , H01L41/313 , Y10T29/42
摘要： An electrically conductive contact layer (4) is provided with a joining material (9) during a method for producing a piezoelectric component (1), in particular a piezoelectric sensor (1). To this end, the electrically conductive contact layer (4) can be dipped into a paste that serves to form the joining material (9). The contact layer (4) provided with the joining material (9) is subsequently disposed between a first piezoceramic layer (2) and a second piezoceramic layer (3). The contact layer (4) is then inserted via the joining material (9) between the first piezoceramic layer (2) and the second piezoceramic layer (3), wherein a pressure is applied to the first piezocermaic layer (2) against the second piezoceramic layer (3).
摘要翻译：在压电元件（1）的制造方法，特别是压电传感器（1）的制造方法中，导电接触层（4）具有接合材料（9）。为此，可以将导电接触层（4）浸入用于形成接合材料（9）的糊料中。设置有接合材料（9）的接触层（4）随后设置在第一压电陶瓷层（2）和第二压电陶瓷层（3）之间。然后，接触层（4）经由第一压电陶瓷层（2）和第二压电陶瓷层（3）之间的接合材料（9）插入，其中压力相对于第二压电陶瓷层施加到第一压电陶瓷层（2）层（3）。

7. 发明申请

US20150306669A1 METHOD FOR CONNECTING AT LEAST TWO COMPONENTS USING A SINTERING PROCESS 审中-公开
标题翻译：使用烧结过程连接至少两个组件的方法
公开(公告)号：US20150306669A1
公开(公告)日：2015-10-29
申请号：US14650331
申请日：2013-10-09
申请人： ROBERT BOSCH GMBH
发明人： Michael Guenther , Andrea Feiock
IPC分类号： B22F7/06 , B22F1/00 , B22F7/00
CPC分类号： B22F7/062 , B22F1/0059 , B22F1/0062 , B22F7/008 , B22F7/064 , B22F7/08 , B23K35/0244 , B23K35/025 , H01L24/29 , H01L24/83 , H01L2224/29006 , H01L2224/2929 , H01L2224/29299 , H01L2224/29399 , H01L2224/32013 , H01L2224/8384 , H01L2924/12044 , H01L2924/00
摘要： The invention relates to a method for connecting at least two components (18, 20) using a sintering process. The aim of the invention is to improve the sintering process. This is achieved in that the method has the following method steps: a) providing a starting material (10) of a sintering compound (22), comprising particles (12) which can be sintered and have at least one metal or at least one metal compound and comprising at least one polymeric, polymerizable, and/or monomeric organic compound (14), wherein the polymeric, polymerizable, and/or monomeric compound (14) has a flow temperature which is higher than or equal to the room temperature and lower than the sintering temperature, and the polymeric, polymerizable, and/or monomeric organic compound (14) further has a desorption temperature which is higher than the flow temperature and lower than or equal to the sintering temperature; b) arranging the starting material (10) between two components (18, 20) to be connected; c) heating the starting material (10) to a temperature (T1) which is higher than or equal to the flow temperature of the polymeric, polymerizable, and/or monomeric organic compound (14) and lower than the desorption temperature of the polymeric, polymerizable, and/or monomeric organic compound (14) for a period of time (t1); and d) heating the starting material (10) to a temperature (T2) which is higher than or equal to the sintering temperature of the particles (12) which can be sintered, optionally under the influence of a sintering pressure, for a period of time (t2), thereby forming a sintering compound (22).
摘要翻译：本发明涉及一种使用烧结工艺连接至少两个部件（18,20）的方法。本发明的目的是改善烧结过程。这是通过以下方法实现的：a）提供烧结化合物（22）的起始材料（10），其包含可以烧结并具有至少一种金属或至少一种金属的颗粒（12）化合物并且包含至少一种聚合物，可聚合和/或单体有机化合物（14），其中聚合物，可聚合和/或单体化合物（14）具有高于或等于室温的流动温度和较低聚合的，可聚合的和/或单体的有机化合物（14）还具有高于流动温度并低于或等于烧结温度的解吸温度; b）将起始材料（10）布置在待连接的两个部件（18,20）之间; c）将起始原料（10）加热到高于或等于聚合物，可聚合和/或单体有机化合物（14）的流动温度的温度（T1），并且低于聚合物的可解吸温度，可聚合和/或单体有机化合物（14）一段时间（t1）; 和d）任选地在烧结压力的影响下，将起始材料（10）加热到高于或等于可烧结的颗粒（12）的烧结温度的温度（T2），持续一段时间时间（t2），由此形成烧结化合物（22）。

8. 发明申请

US20140234649A1 LAYERED COMPOSITE OF A SUBSTRATE FILM AND OF A LAYER ASSEMBLY COMPRISING A SINTERABLE LAYER MADE OF AT LEAST ONE METAL POWDER AND A SOLDER LAYER 审中-公开
标题翻译：基底膜的层状复合物和包含至少一个金属粉末和焊料层的可烧结层的层组件
公开(公告)号：US20140234649A1
公开(公告)日：2014-08-21
申请号：US14348408
申请日：2012-09-21
申请人： Robert Bosch GmbH
发明人： Thomas Kalich , Frank Wetzl , Bernd Hohenberger , Rainer Holz , Christiane Frueh , Andreas Fix , Michael Guyenot , Andrea Feiock , Martin Rittner , Michael Guenther
IPC分类号： B23K35/02 , B32B15/06 , B23K1/00 , B32B15/16
CPC分类号： B23K35/0238 , B23K1/0008 , B23K1/0016 , B32B15/06 , B32B15/16 , B32B2264/105 , C23C26/00 , C23C28/021 , C23C28/023 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/27003 , H01L2224/271 , H01L2224/27334 , H01L2224/27505 , H01L2224/278 , H01L2224/27848 , H01L2224/29082 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29139 , H01L2224/29147 , H01L2224/29209 , H01L2224/29211 , H01L2224/29213 , H01L2224/29218 , H01L2224/29239 , H01L2224/29247 , H01L2224/293 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29395 , H01L2224/32503 , H01L2224/83191 , H01L2224/83193 , H01L2224/832 , H01L2224/83203 , H01L2224/83815 , H01L2224/8382 , H01L2224/8384 , H01L2924/01327 , H01L2924/07811 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H05K3/3478 , H05K2203/0405 , H05K2203/1131 , Y10T428/12049 , Y10T428/12063 , H01L2924/00013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/01083 , H01L2924/01028 , H01L2924/0103 , H01L2924/01049 , H01L2924/01013 , H01L2924/01031 , H01L2924/0132 , H01L2924/00
摘要： The invention relates to a layered composite (10), in particular for connecting electronic components as joining partners, comprising at least one substrate film (11) and a layer assembly (12) applied to the substrate film. The layer assembly comprises at least one sinterable layer (13), which is applied to the substrate film (11) and which contains at least one metal powder, and a solder layer (14) applied to the sinterable layer (13). The invention further relates to a method for forming a layered composite, to a circuit assembly containing a layered composite (10) according to the invention, and to the use of a layered composite (10) in a joining method for electronic components.
摘要翻译：本发明涉及一种分层复合材料（10），特别是用于连接作为接合伙伴的电子部件，包括至少一个基底膜（11）和施加到基底膜上的层组件（12）。层组件包括施加到基底膜（11）并且包含至少一种金属粉末的至少一个可烧结层（13）和施加到可烧结层（13）的焊料层（14）。本发明还涉及一种用于形成层状复合材料的方法，包括根据本发明的层状复合材料（10）的电路组件，以及在电子部件的接合方法中使用层状复合材料（10）。

9. 发明申请

US20140191620A1 PIEZOELECTRIC COMPONENT AND METHOD FOR PRODUCING A PIEZOELECTRIC COMPONENT 有权
标题翻译：压电元件和制造压电元件的方法
公开(公告)号：US20140191620A1
公开(公告)日：2014-07-10
申请号：US14151961
申请日：2014-01-10
申请人： Robert Bosch GmbH
发明人： Reinhold Melcher , Michael Guenther
IPC分类号： H01L41/047 , H01L41/293
CPC分类号： H01L41/0477 , H01L41/0472 , H01L41/0475 , H01L41/1132 , H01L41/293 , H01L41/313 , Y10T29/42
摘要： An electrically conductive contact layer (4) is provided with a joining material (9) during a method for producing a piezoelectric component (1), in particular a piezoelectric sensor (1). To this end, the electrically conductive contact layer (4) can be dipped into a paste that serves to form the joining material (9). The contact layer (4) provided with the joining material (9) is subsequently disposed between a first piezoceramic layer (2) and a second piezoceramic layer (3). The contact layer (4) is then inserted via the joining material (9) between the first piezoceramic layer (2) and the second piezoceramic layer (3), wherein a pressure is applied to the first piezocermaic layer (2) against the second piezoceramic layer (3).
摘要翻译：在压电元件（1）的制造方法，特别是压电传感器（1）的制造方法中，导电接触层（4）具有接合材料（9）。为此，可以将导电接触层（4）浸入用于形成接合材料（9）的糊料中。设置有接合材料（9）的接触层（4）随后设置在第一压电陶瓷层（2）和第二压电陶瓷层（3）之间。然后，接触层（4）经由第一压电陶瓷层（2）和第二压电陶瓷层（3）之间的接合材料（9）插入，其中压力相对于第二压电陶瓷层施加到第一压电陶瓷层（2）层（3）。

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