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    • 3. 发明授权
    • Power amplifier with two transistors and traces forming two transformers
    • 功率放大器具有两个晶体管和迹线,形成两个变压器
    • US08130040B2
    • 2012-03-06
    • US12830898
    • 2010-07-06
    • Robert Bogdan StaszewskiSee Taur Lee
    • Robert Bogdan StaszewskiSee Taur Lee
    • H03F3/68
    • H03F3/189H03F3/211H03F3/602H03F2200/541
    • Methods to implement low cost, high efficiency, low loss power combiner with novel matching circuits are disclosed. A narrow band power combiner enables a high power and high efficiency radio frequency power amplifier to be realized using multiple low voltage CMOS transistors or micro power amplifiers. The power combiner may be printed on a package substrate and realized either using single layer substrate through edge coupling or multiple layers substrate through broadside coupling. The micro power amplifiers may be fabricated using low voltage CMOS technology and electrical connections between the outputs from the micro power amplifiers and the power combiner may be provided through stud bumps in a flip chip technology. With the tunable matching circuits, the present invention allows the narrow band power combiner to be tuned to different frequencies.
    • 公开了实现具有新型匹配电路的低成本,高效率,低损耗功率组合器的方法。 窄带功率组合器使得能够使用多个低电压CMOS晶体管或微功率放大器实现高功率和高效率的射频功率放大器。 功率组合器可以印刷在封装衬底上,并且通过边缘耦合使用单层衬底或通过宽边耦合实现多层衬底。 微功率放大器可以使用低电压CMOS技术制造,并且来自微功率放大器的输出之间的电连接和功率组合器可以通过倒装芯片技术中的凸块凸块来提供。 利用可调匹配电路,本发明允许将窄带功率组合器调谐到不同的频率。
    • 4. 发明授权
    • Calibration circuitry and delay cells in rectilinear RF power amplifier
    • 直线RF功率放大器中的校准电路和延迟单元
    • US07612612B2
    • 2009-11-03
    • US11860392
    • 2007-09-24
    • Robert Bogdan StaszewskiSee Taur Lee
    • Robert Bogdan StaszewskiSee Taur Lee
    • H03F3/68
    • H03F3/189H03F3/211H03F3/602H03F2200/541
    • Methods to implement low cost, high efficiency, low loss power combiner with novel matching circuits are disclosed. A narrow band power combiner enables a high power and high efficiency radio frequency power amplifier to be realized using multiple low voltage CMOS transistors or micro power amplifiers. The power combiner may be printed on a package substrate and realized either using single layer substrate through edge coupling or multiple layers substrate through broadside coupling. The micro power amplifiers may be fabricated using low voltage CMOS technology and electrical connections between the outputs from the micro power amplifiers and the power combiner may be provided through stud bumps in a flip chip technology. With the tunable matching circuits, the present invention allows the narrow band power combiner to be tuned to different frequencies.
    • 公开了实现具有新型匹配电路的低成本,高效率,低损耗功率组合器的方法。 窄带功率组合器使得能够使用多个低电压CMOS晶体管或微功率放大器实现高功率和高效率的射频功率放大器。 功率组合器可以印刷在封装衬底上,并且通过边缘耦合使用单层衬底或通过宽边耦合实现多层衬底。 微功率放大器可以使用低电压CMOS技术制造,并且来自微功率放大器的输出之间的电连接和功率组合器可以通过倒装芯片技术中的凸块凸块来提供。 利用可调匹配电路,本发明允许将窄带功率组合器调谐到不同的频率。
    • 5. 发明申请
    • Integrated Power Amplifier
    • 集成功率放大器
    • US20080315954A1
    • 2008-12-25
    • US11860392
    • 2007-09-24
    • Robert Bogdan StaszewskiSee Taur Lee
    • Robert Bogdan StaszewskiSee Taur Lee
    • H03F3/68
    • H03F3/189H03F3/211H03F3/602H03F2200/541
    • Methods to implement low cost, high efficiency, low loss power combiner with novel matching circuits are disclosed. A narrow band power combiner enables a high power and high efficiency radio frequency power amplifier to be realized using multiple low voltage CMOS transistors or micro power amplifiers. The power combiner may be printed on a package substrate and realized either using single layer substrate through edge coupling or multiple layers substrate through broadside coupling. The micro power amplifiers may be fabricated using low voltage CMOS technology and electrical connections between the outputs from the micro power amplifiers and the power combiner may be provided through stud bumps in a flip chip technology. With the tunable matching circuits, the present invention allows the narrow band power combiner to be tuned to different frequencies.
    • 公开了实现具有新型匹配电路的低成本,高效率,低损耗功率组合器的方法。 窄带功率组合器使得能够使用多个低电压CMOS晶体管或微功率放大器实现高功率和高效率的射频功率放大器。 功率组合器可以印刷在封装衬底上,并且通过边缘耦合使用单层衬底或通过宽边耦合实现多层衬底。 微功率放大器可以使用低电压CMOS技术制造,并且来自微功率放大器的输出之间的电连接和功率组合器可以通过倒装芯片技术中的凸块凸块来提供。 利用可调匹配电路,本发明允许将窄带功率组合器调谐到不同的频率。
    • 6. 发明授权
    • Integrated power amplifier
    • 集成功率放大器
    • US07777572B2
    • 2010-08-17
    • US12563528
    • 2009-09-21
    • Robert Bogdan StaszewskiSee Taur Lee
    • Robert Bogdan StaszewskiSee Taur Lee
    • H03F3/68
    • H03F3/189H03F3/211H03F3/602H03F2200/541
    • Methods to implement low cost, high efficiency, low loss power combiner with novel matching circuits are disclosed. A narrow band power combiner enables a high power and high efficiency radio frequency power amplifier to be realized using multiple low voltage CMOS transistors or micro power amplifiers. The power combiner may be printed on a package substrate and realized either using single layer substrate through edge coupling or multiple layers substrate through broadside coupling. The micro power amplifiers may be fabricated using low voltage CMOS technology and electrical connections between the outputs from the micro power amplifiers and the power combiner may be provided through stud bumps in a flip chip technology. With the tunable matching circuits, the present invention allows the narrow band power combiner to be tuned to different frequencies.
    • 公开了实现具有新型匹配电路的低成本,高效率,低损耗功率组合器的方法。 窄带功率组合器使得能够使用多个低电压CMOS晶体管或微功率放大器实现高功率和高效率的射频功率放大器。 功率组合器可以印刷在封装衬底上,并且通过边缘耦合使用单层衬底或通过宽边耦合实现多层衬底。 微功率放大器可以使用低电压CMOS技术制造,并且来自微功率放大器的输出之间的电连接和功率组合器可以通过倒装芯片技术中的凸块凸块来提供。 利用可调匹配电路,本发明允许将窄带功率组合器调谐到不同的频率。
    • 7. 发明申请
    • INTEGRATED POWER AMPLIFIER
    • 集成功率放大器
    • US20100007423A1
    • 2010-01-14
    • US12563528
    • 2009-09-21
    • Robert Bogdan StaszewskiSee Taur Lee
    • Robert Bogdan StaszewskiSee Taur Lee
    • H03F3/68
    • H03F3/189H03F3/211H03F3/602H03F2200/541
    • Methods to implement low cost, high efficiency, low loss power combiner with novel matching circuits are disclosed. A narrow band power combiner enables a high power and high efficiency radio frequency power amplifier to be realized using multiple low voltage CMOS transistors or micro power amplifiers. The power combiner may be printed on a package substrate and realized either using single layer substrate through edge coupling or multiple layers substrate through broadside coupling. The micro power amplifiers may be fabricated using low voltage CMOS technology and electrical connections between the outputs from the micro power amplifiers and the power combiner may be provided through stud bumps in a flip chip technology. With the tunable matching circuits, the present invention allows the narrow band power combiner to be tuned to different frequencies.
    • 公开了实现具有新型匹配电路的低成本,高效率,低损耗功率组合器的方法。 窄带功率组合器使得能够使用多个低电压CMOS晶体管或微功率放大器实现高功率和高效率的射频功率放大器。 功率组合器可以印刷在封装衬底上,并且通过边缘耦合使用单层衬底或通过宽边耦合实现多层衬底。 微功率放大器可以使用低电压CMOS技术制造,并且来自微功率放大器的输出之间的电连接和功率组合器可以通过倒装芯片技术中的凸块凸块来提供。 利用可调匹配电路,本发明允许将窄带功率组合器调谐到不同的频率。
    • 10. 发明授权
    • Driver circuit and a mixer circuit receiving a signal from the driver circuit
    • 驱动器电路和从驱动器电路接收信号的混频器电路
    • US08493136B2
    • 2013-07-23
    • US13083188
    • 2011-04-08
    • Abdellatif BellaouarSee Taur Lee
    • Abdellatif BellaouarSee Taur Lee
    • G05F1/10
    • H03F3/505H03D7/1458H03D7/1466H03D7/165H03D2200/0074
    • A driver circuit for supplying a drive signal to a mixer circuit comprising a first and second circuit branch and an operational amplifier. The first circuit branch receives an input signal and a bias signal. The second circuit branch receives the input signal. The operational amplifier has a first input connected to a junction node of the first circuit branch and a second input connected to a junction node of the second circuit branch. The operational amplifier is arranged to provide an operational amplifier output signal a second component of the second circuit branch so that a voltage at the junction node of the second circuit branch is equal to a voltage at the junction node of the first circuit branch. The voltage is dependent on the input signal and providing the drive signal.
    • 一种驱动电路,用于将驱动信号提供给包括第一和第二电路支路和运算放大器的混频器电路。 第一电路支路接收输入信号和偏置信号。 第二电路支路接收输入信号。 运算放大器具有连接到第一电路支路的结节点的第一输入端和连接到第二电路支路的结节点的第二输入端。 运算放大器被布置成提供运算放大器输出信号第二电路分支的第二分量,使得第二电路分支的结节点处的电压等于第一电路分支的结节点处的电压。 电压取决于输入信号并提供驱动信号。