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    • 9. 发明授权
    • Method for registration of shadow masked thin-film patterns
    • 掩膜薄膜图案的配准方法
    • US4746548A
    • 1988-05-24
    • US790695
    • 1985-10-23
    • Robert A. BoudreauRobert J. Wilkie
    • Robert A. BoudreauRobert J. Wilkie
    • G09F9/00C23C14/04C23C16/04H01L21/68
    • C23C14/042C23C16/042H01L21/682
    • A method of aligning thin-film structure patterns on a substrate formed with the use of an apertured mask in a vacuum deposition system. The present method includes the steps of positioning a mask holder assembly within a deposition chamber, the mask holder assembly having the apertured mask as part thereof and having means for engaging a substrate carrier; positioning a substrate carrier within the deposition chamber spaced from the mask holder assembly, the carrier having the substrate supported therein and having means for aligning the apertured mask with the substrate; engaging the mask holder assembly with the substrate carrier such that they are in operative contact; positioning a magnet in the deposition chamber adjacent the side of the substrate carrier opposite the mask holder assembly such that the apertured mask is held in operative contact with the substrate; vacuum-depositing a thin-film structure material through the apertured mask; and removing the magnet from the substrate carrier and disengaging the mask holder assembly from the substrate carrier, thereby resulting in the formation of the thin-film structures on the substrate.
    • 在真空沉积系统中使用孔径掩模形成的衬底上的薄膜结构图案对准的方法。 本方法包括以下步骤:将掩模保持器组件定位在沉积室内,掩模保持器组件具有孔径掩模作为其一部分并具有用于接合衬底载体的装置; 将衬底载体定位在所述沉积室内与所述掩模保持器组件间隔开的位置,所述载体具有支撑在其中的衬底,并且具有用于使所述带孔掩模与所述衬底对准的装置; 使掩模支架组件与基板载体接合,使得它们处于操作接触状态; 将磁体定位在邻近基板载体与掩模保持器组件相对的一侧的沉积室中,使得有孔掩模保持与基板有效接触; 通过多孔掩模真空沉积薄膜结构材料; 以及从基板载体上移除磁体并使掩模支架组件与基板载体脱开,由此导致在基板上形成薄膜结构。