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1. 发明授权

US5985090A Polishing cloth and polishing apparatus having such polishing cloth 失效
标题翻译：具有抛光布的抛光布和抛光装置
公开(公告)号：US5985090A
公开(公告)日：1999-11-16
申请号：US650144
申请日：1996-05-17
申请人： Ritsuo Kikuta , Fujio Aoyama , Koji Kato , Tamami Takahashi
发明人： Ritsuo Kikuta , Fujio Aoyama , Koji Kato , Tamami Takahashi
IPC分类号： B24B37/20 , B24B37/24 , B24B41/047 , B24D7/14 , B24D13/14 , H01L21/304 , C23F1/02 , B44C1/22
CPC分类号： B24B37/24 , B24B37/26
摘要： A polishing cloth mounted on a turntable of a polishing apparatus and a polishing apparatus having such a polishing cloth for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing cloth comprises a first elastic region contacting the surface of the workpiece and having a certain elastic modulus, and a second elastic region contacting the surface of the workpiece and having an elastic modulus different from the first elastic region. The second elastic region is surrounded by the first elastic region and has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the second elastic region is held in contact with the workpiece. The position of the second elastic region is determined on the basis of an area in which the second elastic region acts on the workpiece.
摘要翻译：一种安装在抛光装置的转盘上的抛光布和具有用于将诸如半导体晶片的工件抛光到平面镜面的抛光布的抛光装置。抛光布包括与工件的表面接触并具有一定弹性模量的第一弹性区域和与工件的表面接触并具有与第一弹性区域不同的弹性模量的第二弹性区域。第二弹性区域被第一弹性区域围绕，并且当第二弹性区域保持与工件接触时，在转台的径向上具有比工件的直径更小的尺寸。第二弹性区域的位置基于第二弹性区域作用在工件上的面积来确定。

2. 发明授权

US5651725A Apparatus and method for polishing workpiece 失效
标题翻译：抛光工件的设备和方法
公开(公告)号：US5651725A
公开(公告)日：1997-07-29
申请号：US628990
申请日：1996-04-10
申请人： Ritsuo Kikuta , You Ishii , Tamami Takahashi
发明人： Ritsuo Kikuta , You Ishii , Tamami Takahashi
IPC分类号： B24B37/20 , B24B37/24 , B24B53/00 , B24B53/007 , B24B53/017 , H01L21/304 , B24B1/00 , B24B7/19 , B24B7/30
CPC分类号： B24B53/017 , B24B53/00
摘要： An apparatus and method for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The workpiece is held by a top ring, and a surface of the workpiece is polished by pressing the workpiece against an abrasive cloth mounted on a turntable while applying an abrasive solution onto the abrasive cloth. While the workpiece is being polished, a surface of the abrasive cloth is dressed while applying a dressing liquid onto the abrasive cloth. A polishing operation and a dressing operation are performed in such a state that the abrasive solution and the dressing liquid do not interfere with each other.
摘要翻译：用于将诸如半导体晶片的工件抛光到平面镜面的装置和方法。工件由顶环保持，并且通过将安装在转盘上的研磨布压在研磨布上而将工件压在研磨布上的同时将工件的表面抛光。在抛光工件的同时，将研磨布的表面修整，同时将修整液施加到研磨布上。在研磨液和敷料液不会相互干扰的状态下进行研磨操作和修整操作。

3. 发明授权

US5716264A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5716264A
公开(公告)日：1998-02-10
申请号：US683424
申请日：1996-07-18
申请人： Norio Kimura , Ritsuo Kikuta , You Ishii , Masayoshi Hirose
发明人： Norio Kimura , Ritsuo Kikuta , You Ishii , Masayoshi Hirose
IPC分类号： B24B37/00 , B24B53/007 , B24B21/18
CPC分类号： B24B53/017
摘要： A polishing apparatus is employed to polish an object to be polished by urging the surface of the object to be polished against the surface of a polishing cloth and causing a relative movement therebetween, while supplying a polishing liquid into an area between the object to be polished and the polishing cloth. A plurality of nozzles spray respective fluid jets to strike against the surface of the cloth. The plurality of nozzles include more than one type of nozzle which vary flow velocity, flow rate, angle of spray, and cross-sectional configuration of a jet. The plurality of nozzles have axes positioned at a location at different distances from the rotation axis of the polishing cloth.
摘要翻译：抛光装置用于通过将待抛光物体的表面推压在抛光布的表面上并在其之间相对移动，同时将抛光液体提供到待抛光对象之间的区域中来抛光待抛光物体和抛光布。多个喷嘴喷射相应的流体射流以抵靠布的表面。多个喷嘴包括不止一种类型的喷嘴，其改变流速，流速，喷射角度和射流的横截面构造。多个喷嘴具有位于与抛光布的旋转轴线不同的距离处的轴线。

4. 发明授权

US06942541B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06942541B2
公开(公告)日：2005-09-13
申请号：US09922776
申请日：2001-08-07
申请人： Tetsuji Togawa , Kunihiko Sakurai , Ritsuo Kikuta
发明人： Tetsuji Togawa , Kunihiko Sakurai , Ritsuo Kikuta
IPC分类号： H01L21/304 , B24B37/04 , B24B51/00 , B24B53/007 , B24B7/22
CPC分类号： B24B37/345 , B24B37/04 , B24B51/00 , B24B53/017
摘要： A polishing apparatus polishes a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a storage cassette for storing workpieces to be polished, at least two polishing units each having at least a turntable with a polishing cloth mounted thereon and a top ring for supporting a workpiece and pressing the workpiece against the polishing cloth, and a cleaning unit for cleaning a workpiece which has been polished by either one of the polishing units in such a state that the workpiece is removed from the top ring. The polishing apparatus further includes a transfer robot for transferring a workpiece between two of the storage cassette, the polishing units and the cleaning unit.
摘要翻译：抛光装置将诸如半导体晶片的工件抛光成平面镜面。抛光装置包括用于存储要被抛光的工件的存储盒，至少两个抛光单元，每个抛光单元至少具有安装在其上的抛光布的转台和用于支撑工件并将工件压靠抛光布的顶环，以及清洁单元，用于在工件从顶环移除的状态下清洁由任一个抛光单元抛光的工件。抛光装置还包括用于在两个存储盒，抛光单元和清洁单元之间传送工件的传送机器人。

5. 发明授权

US4943214A Two-shaft type rotary machine having a tip circle diameter to shaft diameter within a certain range 失效
标题翻译：双轴式旋转机械，其直径与轴径在一定范围内
公开(公告)号：US4943214A
公开(公告)日：1990-07-24
申请号：US449420
申请日：1989-12-15
申请人： Yoshihiro Niimura , Ritsuo Kikuta , Katsuaki Usui
发明人： Yoshihiro Niimura , Ritsuo Kikuta , Katsuaki Usui
IPC分类号： F04C18/18 , F01C1/08 , F01C1/12
CPC分类号： F01C1/126 , F01C1/084 , F04C18/126 , F04C2220/10
摘要： A two-shaft rotary machine for use in a vacuum pump system includes rotors having a specific profile whereby any vibration and noise generated by the machine is minimized and its efficiency is increased. The number of lobes of each rotor is three or more. The tip and root portions of each rotor are defined by circular arcs, respectively, which are made smoothly continuous with each other through an involute curve. The ratio of the diameter of the tip circle to the diameter of the root circle is selected to fall within a range which is given by a specific expression.

6. 发明授权

US06283822B1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06283822B1
公开(公告)日：2001-09-04
申请号：US09132482
申请日：1998-08-11
申请人： Tetsuji Togawa , Kunihiko Sakurai , Ritsuo Kikuta
发明人： Tetsuji Togawa , Kunihiko Sakurai , Ritsuo Kikuta
IPC分类号： B24B722
CPC分类号： B24B37/345 , B24B37/04 , B24B51/00 , B24B53/017
摘要： A polishing apparatus polishes a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a storage cassette for storing workpieces to be polished, at least two polishing units each having at least a turntable with a polishing cloth mounted thereon and a top ring for supporting a workpiece and pressing the workpiece against the polishing cloth, and a cleaning unit for cleaning a workpiece which has been polished by either one of the polishing units in such a state that the workpiece is removed from the top ring. The polishing apparatus further includes a transfer robot for transferring a workpiece between two of the storage cassette, the polishing units and the cleaning unit.
摘要翻译：抛光装置将诸如半导体晶片的工件抛光成平面镜面。抛光装置包括用于存储要被抛光的工件的存储盒，至少两个抛光单元，每个抛光单元至少具有安装在其上的抛光布的转台和用于支撑工件并将工件压靠抛光布的顶环，以及清洁单元，用于在工件从顶环移除的状态下清洁由任一个抛光单元抛光的工件。抛光装置还包括用于在两个存储盒，抛光单元和清洁单元之间传送工件的传送机器人。

7. 发明授权

US5830045A Polishing apparatus 失效
公开(公告)号：US5830045A
公开(公告)日：1998-11-03
申请号：US697167
申请日：1996-08-20
申请人： Tetsuji Togawa , Kunihiko Sakurai , Ritsuo Kikuta
发明人： Tetsuji Togawa , Kunihiko Sakurai , Ritsuo Kikuta
IPC分类号： H01L21/304 , B24B37/04 , B24B51/00 , B24B53/007 , B24B7/22
CPC分类号： B24B37/345 , B24B37/04 , B24B51/00 , B24B53/017
摘要： A polishing apparatus polishes a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a storage cassette for storing workpieces to be polished, at least two polishing units each having at least a turntable with a polishing cloth mounted thereon and a top ring for supporting a workpiece and pressing the workpiece against the polishing cloth, and a cleaning unit for cleaning a workpiece which has been polished by either one of the polishing units in such a state that the workpiece is removed from the top ring. The polishing apparatus further includes a transfer robot for transferring a workpiece between two of the storage cassette, the polishing units and the cleaning unit.

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