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    • 2. 发明申请
    • Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems
    • 冷却系统和方法采用多个专用冷却剂调节单元来冷却多个电子子系统
    • US20050122685A1
    • 2005-06-09
    • US10726347
    • 2003-12-03
    • Richard ChuMichael EllsworthRoger SchmidtRobert SimonsRandy Zoodsma
    • Richard ChuMichael EllsworthRoger SchmidtRobert SimonsRandy Zoodsma
    • G06F1/20H01L23/473H05K7/20
    • H05K7/2079
    • A cooling system is provided employing multiple coolant conditioning units (CCUs). Each CCU, which is coupled to a different, associated electronics rack of multiple electronics racks to be cooled, includes a heat exchanger, a first cooling loop with a control valve, and a second cooling loop. The first cooling loop receives chilled facility coolant from a source and passes at least a portion thereof via the control valve through the heat exchanger. The second cooling loop provides cooled system coolant to the associated electronics rack, and expels heat in the heat exchanger from the electronics rack to the chilled facility coolant in the first cooling loop. The control valve allows regulation of the facility coolant flow through the heat exchanger, thereby allowing independent control of temperature of the system coolant in the second cooling loop. Various CCU and associated component redundancies of the cooling system are also provided.
    • 提供采用多个冷却剂调节单元(CCU)的冷却系统。 耦合到要冷却的多个电子机架的不同相关电子机架的每个CCU包括热交换器,具有控制阀的第一冷却回路和第二冷却回路。 第一冷却回路从源接收冷却设备冷却剂,并且经由控制阀将其至少一部分通过热交换器。 第二冷却回路将冷却的系统冷却剂提供给相关联的电子机架,并将热交换器中的热量从电子机架排出到第一冷却回路中的冷却设备冷却剂。 控制阀允许调节通过热交换器的设备冷却剂流,从而允许独立地控制第二冷却回路中的系统冷却剂的温度。 还提供了冷却系统的各种CCU和相关部件冗余。
    • 4. 发明申请
    • Hybrid heat sink with recirculating fluid and interleaving fins
    • 具有循环流体和交错散热片的混合散热器
    • US20070125524A1
    • 2007-06-07
    • US11296556
    • 2005-12-07
    • Randy Zoodsma
    • Randy Zoodsma
    • H05K7/20
    • H01L23/473H01L23/467H01L2924/0002H01L2924/00
    • A method and incorporated hybrid air and liquid cooled heat sink that is provided for cooling electronic components. The heat sink comprises a finned structure having fins positioned for air to pass easily through them. The finned structure is flanked by a heat source plate on one side (closer to direction of heat flowing from electronic components) and a second plate on its opposing side such that both of the plates are in thermal communication with fin tips and fin base of the finned structure. The heat source plate itself is composed of two complementary halves with fins on each half. When brought together, the two halves form a unitary, fluid sealed plate while allowing passage of fluids through it by allowing the fins on each half to create and interleaving structure. A fluid re-circulator is also disposed at least partially in the plates for circulating fluids though the plates and the finned structure such that both fin tips and fin base are cooled.
    • 一种用于冷却电子部件的方法和并入的混合式空气和液体冷却散热器。 散热器包括翅片结构,其翅片被定位成使空气容易地通过它们。 翅片结构的侧面是一侧的热源板(更靠近从电子部件流动的热量的方向)和在其相对侧上的第二板,使得两个板与翅片尖端和翅片底座热连通 翅片结构。 热源板本身由两个互补的半部组成,每半部具有翅片。 当组合在一起时,两个半部分形成一体的流体密封的板,同时允许流体通过它通过允许每一半的翅片产生和交错结构。 流体再循环器还至少部分地设置在板中,用于通过板和翅片结构循环流体,使得翅片翅片和翅片底座都被冷却。
    • 6. 发明申请
    • Hybrid heat sink performance enhancement using recirculating fluid
    • 使用循环流体的混合散热器性能提升
    • US20070125519A1
    • 2007-06-07
    • US11296557
    • 2005-12-07
    • Randy Zoodsma
    • Randy Zoodsma
    • H05K7/20
    • H05K7/20781
    • A method and incorporated heat sink that is cooled both thorough air flow and liquid circulation is provided. The heat sink is disposed close to electronic components and used for their cooling. It comprises a finned structure positioned such that air can easily pass though it; a heat source plate disposed thermally in direction of heat flow to one side of the finned structure such that the heat source plate is in thermal communication with the finned structure fin base and fin tips, and a second plate also disposed at an opposing end of the finned structure in thermal communication both with finned structure fin base and fin tips. The heat sink also includes fluid re-circulator disposed at least partially in the plates for circulating fluids though the plates and around said finned structure such that both fin tips and fin base is cooled.
    • 提供了一种方法并结合了散热器,其被冷却,同时彻底的气流和液体循环。 散热器靠近电子元件放置并用于冷却。 它包括一个翅片结构,使空气容易通过; 热源板,其热传导方向在所述翅片结构的一侧上热传导,使得所述热源板与所述翅片翅片底座和翅片尖端热连通;以及第二板,其还设置在所述鳍片结构的相对端 热连接的翅片结构,带翅片结构翅片底座和翅片尖端。 散热器还包括至少部分地设置在板中的流体再循环器,用于通过板循环流体并围绕所述翅片结构,使得翅片翅片和翅片底座都被冷却。