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1. 外观设计

USD682518S1 Shoe sole 有权
公开(公告)号：USD682518S1
公开(公告)日：2013-05-21
申请号：US29402548
申请日：2011-09-23
申请人： Ricardo Vestuti , Kevin Leary , Mike Andrews , William McInnis
设计人： Ricardo Vestuti , Kevin Leary , Mike Andrews , William McInnis

2. 外观设计

USD619343S1 Shoe sole 有权
公开(公告)号：USD619343S1
公开(公告)日：2010-07-13
申请号：US29339457
申请日：2009-06-30
申请人： Ricardo Vestuti , Kevin Leary , Mike Andrews , William McInnis
设计人： Ricardo Vestuti , Kevin Leary , Mike Andrews , William McInnis

3. 外观设计

USD597287S1 Shoe sole 有权
公开(公告)号：USD597287S1
公开(公告)日：2009-08-04
申请号：US29325242
申请日：2008-09-26
申请人： Ricardo Vestuti , Kevin Leary , Mike Andrews , William McInnis
设计人： Ricardo Vestuti , Kevin Leary , Mike Andrews , William McInnis

4. 外观设计

USD648517S1 Portion of a shoe sole 有权
公开(公告)号：USD648517S1
公开(公告)日：2011-11-15
申请号：US29364048
申请日：2010-06-17
申请人： Ricardo Vestuti , Kevin Leary , Mike Andrews , William McInnis
设计人： Ricardo Vestuti , Kevin Leary , Mike Andrews , William McInnis

5. 发明授权

US07797856B2 Lightweight sole for article of footwear 有权
标题翻译：轻便鞋底为鞋类物品
公开(公告)号：US07797856B2
公开(公告)日：2010-09-21
申请号：US11733676
申请日：2007-04-10
申请人： Mike Andrews , Paul Litchfield , Jorgen Romer , Ricardo Vestuti
发明人： Mike Andrews , Paul Litchfield , Jorgen Romer , Ricardo Vestuti
IPC分类号： A43B13/18
CPC分类号： A43B13/12 , A43B13/14 , A43B13/186 , A43B13/188
摘要： A sole for an article of footwear comprising a midsole having a plurality of polygonal-shaped openings, or cavities, therein. In alternative embodiments, the sole includes reinforcement elements such as a plate disposed along at least a portion of one of the surfaces of the midsole. The plate includes at least one polygonal-shaped extension adapted to fit within at least a portion of at least one of the polygonal-shaped openings within the midsole. Additionally, a polyurethane film is disposed on at least a portion of the bottom surface of the midsole. The shoe also includes an outsole disposed on at least a portion of a bottom surface of the polyurethane film, wherein the outsole comprises a plurality of polygonal-shaped openings aligned with the polygonal-shaped openings of the midsole.
摘要翻译：一种用于鞋类物品的鞋底，包括在其中具有多个多边形开口或中空的中底。在替代实施例中，鞋底包括加强元件，例如沿着中底的一个表面的至少一部分设置的板。板包括至少一个多边形的延伸部，其适于装配在中底内的至少一个多边形开口的至少一部分内。此外，在中底的底面的至少一部分上设置聚氨酯膜。鞋还包括设置在聚氨酯膜的底表面的至少一部分上的外底，其中外底包括与中底的多边形开口对准的多个多边形开口。

6. 发明申请

US20080250673A1 Lightweight Sole for Article of Footwear 有权
标题翻译：鞋类物品的轻便鞋底
公开(公告)号：US20080250673A1
公开(公告)日：2008-10-16
申请号：US11733676
申请日：2007-04-10
申请人： Mike Andrews , Paul Litchfield , Jorgen Romer , Ricardo Vestuti
发明人： Mike Andrews , Paul Litchfield , Jorgen Romer , Ricardo Vestuti
IPC分类号： A43B13/12 , A43B13/00
CPC分类号： A43B13/12 , A43B13/14 , A43B13/186 , A43B13/188
摘要： A sole for an article of footwear comprising a midsole having a plurality of polygonal-shaped openings, or cavities, therein. In alternative embodiments, the sole includes reinforcement elements such as a plate disposed along at least a portion of one of the surfaces of the midsole. The plate includes at least one polygonal-shaped extension adapted to fit within at least a portion of at least one of the polygonal-shaped openings within the midsole. Additionally, a polyurethane film is disposed on at least a portion of the bottom surface of the midsole. The shoe also includes an outsole disposed on at least a portion of a bottom surface of the polyurethane film, wherein the outsole comprises a plurality of polygonal-shaped openings aligned with the polygonal-shaped openings of the midsole.
摘要翻译：一种用于鞋类物品的鞋底，包括在其中具有多个多边形开口或中空的中底。在替代实施例中，鞋底包括加强元件，例如沿着中底的一个表面的至少一部分设置的板。板包括至少一个多边形的延伸部，其适于装配在中底内的至少一个多边形开口的至少一部分内。此外，在中底的底面的至少一部分上设置聚氨酯膜。鞋还包括设置在聚氨酯膜的底表面的至少一部分上的外底，其中外底包括与中底的多边形开口对准的多个多边形开口。

7. 发明授权

US07495461B2 Wafer probe 失效
公开(公告)号：US07495461B2
公开(公告)日：2009-02-24
申请号：US11975176
申请日：2007-10-18
申请人： Leonard Hayden , John Martin , Mike Andrews
发明人： Leonard Hayden , John Martin , Mike Andrews
IPC分类号： G01R1/073 , H01R43/00
CPC分类号： G01R1/06772 , G01R1/07342 , Y10T29/49121 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208
摘要： The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.

8. 发明申请

US20080074129A1 Probe for combined signals 失效
公开(公告)号：US20080074129A1
公开(公告)日：2008-03-27
申请号：US11901626
申请日：2007-09-18
申请人： Leonard Hayden , Scott Rumbaugh , Mike Andrews
发明人： Leonard Hayden , Scott Rumbaugh , Mike Andrews
IPC分类号： G01R1/067 , G01R31/02
CPC分类号： G01R1/06766 , G01R1/06738 , G01R1/06772
摘要： A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.

9. 发明申请

US20080042677A1 Wafer probe 失效
公开(公告)号：US20080042677A1
公开(公告)日：2008-02-21
申请号：US11975175
申请日：2007-10-18
申请人： Leonard Hayden , John Martin , Mike Andrews
发明人： Leonard Hayden , John Martin , Mike Andrews
IPC分类号： G01R31/26
CPC分类号： G01R1/06772 , G01R1/07342 , Y10T29/49121 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208
摘要： The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.

10. 发明申请

US20080042672A1 Probe for testing a device under test 失效
标题翻译：探测用于测试被测设备
公开(公告)号：US20080042672A1
公开(公告)日：2008-02-21
申请号：US11975476
申请日：2007-10-19
申请人： K. Gleason , Tim Lesher , Mike Andrews , John Martin
发明人： K. Gleason , Tim Lesher , Mike Andrews , John Martin
IPC分类号： G01R1/067
CPC分类号： G01R1/07342 , G01R1/06738 , G01R1/06772
摘要： A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
摘要翻译：用于测量高频集成电路或其他微电子器件的电气特性的探针测量系统。

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