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    • 2. 发明授权
    • Excimer laser ablation process control of multilaminate materials
    • 准分子激光烧蚀过程控制多层材料
    • US06369354B1
    • 2002-04-09
    • US09616582
    • 2000-07-14
    • Russell D. Beste
    • Russell D. Beste
    • B23K2638
    • B23K26/382B23K26/40B23K2103/16B23K2103/42B23K2103/50H05K3/0032
    • A method of ablating holes in a material, using a laminated material which includes first and second layers. The first and second layers have different coefficients of thermal expansion. The first layer has a hole within it surrounding a target region of the second layer in the laminated material. Thus, the target region is not laminated to the second layer but is surrounded entirely by laminated regions wherein the first layer is laminated to the second layer. A laser source producing energy of a wavelength and a power level that can ablate material from the first layer is directed toward the target region after and/or during changing the temperature of the laminated material so as to place the target region under tension, thereafter ablation of the target region produces the desired holes.
    • 使用包括第一层和第二层的层压材料来消除材料中的孔的方法。 第一层和第二层具有不同的热膨胀系数。 第一层在其周围具有围绕层压材料中的第二层的目标区域的孔。 因此,目标区域不层叠到第二层,而是被第一层层叠到第二层的层叠区域完全包围。 在层叠材料的温度变化之后和/或改变层叠材料的温度之间,产生能够从第一层吸收材料的波长能量和功率水平的激光源朝向目标区域,以使靶区域处于张力状态,然后消融 的目标区域产生所需的孔。