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1. 发明申请

US20090178930A1 ELECTROPLATING DEVICE AND METHOD 审中-公开
标题翻译：电镀设备和方法
公开(公告)号：US20090178930A1
公开(公告)日：2009-07-16
申请号：US12297330
申请日：2007-04-05
申请人： Rene Lochtman , Jürgen Kaczun , Norbert Schneider , Jürgen Pfister , Gert Pohl , Norbert Wagner
发明人： Rene Lochtman , Jürgen Kaczun , Norbert Schneider , Jürgen Pfister , Gert Pohl , Norbert Wagner
IPC分类号： C25D5/00 , C25D17/00
CPC分类号： C25D17/12 , C25D7/0657 , C25D17/005 , C25D17/06 , C25D17/28
摘要： The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks (2, 4, 10) mounted on a respective shaft (1, 5, 14) so that they can rotate, the disks (2, 4, 10) engaging in one another. The invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device according to the invention. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.
摘要翻译：本发明涉及一种用于至少一个导电基底或非导电基底上的结构化或全表面导电表面的电解涂层的装置，其包括至少一个浴，一个阳极和一个阴极，该浴含有电解质含有至少一种金属盐的溶液，金属离子沉积在基材的导电表面上以形成金属层，同时使阴极与待涂覆的基底表面接触，并且将基底输送通过浴，其中阴极包括安装在相应的轴（1,5,14）上的至少两个盘（2,4,10），使得它们可以旋转，盘（2,4,10）彼此接合。本发明还涉及一种在根据本发明的装置中进行的至少一种基底的电解涂覆的方法。最后，本发明还涉及根据本发明的装置在不导电支撑件上的导电结构的电解涂层的用途。

2. 发明申请

US20090301891A1 DEVICE AND METHOD FOR ELECTROPLATING 审中-公开
标题翻译：电镀设备和方法
公开(公告)号：US20090301891A1
公开(公告)日：2009-12-10
申请号：US12515289
申请日：2007-11-26
申请人： Rene Locktman , Jürgen Kaczun , Norbert Wagner , Jürgen Pfister , Gert Pohl
发明人： Rene Locktman , Jürgen Kaczun , Norbert Wagner , Jürgen Pfister , Gert Pohl
IPC分类号： C25D5/02 , C25D17/00 , C25D5/00
CPC分类号： C25D7/0614 , C25D17/28 , H05K3/241 , H05K2203/0143 , H05K2203/1509
摘要： The invention relates to a device for the electrolytic coating of a structured or full-surface base layer (9) on a surface of a substrate (7), which comprises at least one electrolyte bath (3) having at least one rotatably mounted roller (2) connectable as a cathode, which contacts the base layer (9) during the electrolytic coating, the base layer (9) being covered by an electrolyte solution (5) contained in the electrolyte bath (3) and being moved relative to the at least one roller (2) during the coating. The at least one roller (2) connectable as a cathode is connected cathodically during the contact with the base layer (9) and is connected neutrally or anodically as soon as there is no contact with the base layer (9). The invention furthermore relates to a method for the electrolytic coating of a structured or full-surface base layer (9) on a surface of a substrate (7), the base layer (9) being surrounded by an electrolyte solution (5) and being contacted by at least one roller (2) connectable as a cathode. The roller (2) connectable as a cathode is connected cathodically when it contacts the base layer (9) and is connected neutrally or anodically as soon as there is no contact with the base layer (9).
摘要翻译：本发明涉及一种用于在衬底（7）的表面上的结构化或全表面基层（9）的电解涂层的装置，其包括至少一个具有至少一个可旋转地安装的辊的电解质浴（3） 2）可在电解涂层期间与基底层（9）连接的阴极，基底层（9）被包含在电解液浴槽（3）中的电解质溶液（5）所覆盖，并相对于电极涂层期间至少有一个辊（2）。可连接为阴极的至少一个辊（2）在与基底层（9）的接触期间被阴极连接，并且一旦与基底层（9）不接触就被中性或阳极连接。本发明还涉及一种用于在基板（7）的表面上电解涂覆结构化或全表面基层（9）的方法，所述基层（9）由电解质溶液（5）包围，并且是由可连接为阴极的至少一个辊（2）接触。可连接为阴极的辊（2）当其接触基底层（9）时被阴极连接，并且在与基底层（9）不接触时中性或阳极连接。

3. 发明申请

US20090101511A1 ELECTROPLATING DEVICE AND METHOD 审中-公开
标题翻译：电镀设备和方法
公开(公告)号：US20090101511A1
公开(公告)日：2009-04-23
申请号：US12297864
申请日：2007-04-17
申请人： Rene Lochtman , Juergen Kaczun , Norbert Schneider , Juergen Pfister , Gert Pohl , Norbert Wagner
发明人： Rene Lochtman , Juergen Kaczun , Norbert Schneider , Juergen Pfister , Gert Pohl , Norbert Wagner
IPC分类号： C25D17/28 , C25D5/00
CPC分类号： C25D17/14 , C25D5/06 , C25D5/54 , C25D7/0621 , C25D17/005 , C25D17/12 , H05K3/241
摘要： The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate (8) or a structured or full-surface electrically conductive surface on a nonconductive substrate (8), which comprises at least one bath, one anode and one cathode (1), the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the surface to be coated of the substrate and the substrate is transported through the bath. The cathode comprises at least one band (2) having at least one electrically conductive section (12), which is guided around at least two rotatable shafts (3). The invention furthermore relates to a method for the electrolytic coating of at least substrate, which is carried out in a device according to the invention, the band resting on the substrate for the coating and being circulated with a circulation speed which corresponds to the speed with which the substrate is guided through the bath. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.
摘要翻译：本发明涉及一种用于至少一个导电基板（8）或非导电基板（8）上的结构化或全表面导电表面的电解涂层的装置，其包括至少一个槽，一个阳极和一个阴极（1），所述浴含有含有至少一种金属盐的电解质溶液，金属离子沉积在基板的导电表面上以形成金属层，同时使阴极与待涂覆的表面接触衬底和衬底被输送通过浴。阴极包括至少一个具有至少一个导电部分（12）的带（2），该导电部分围绕至少两个可旋转的轴（3）被引导。本发明还涉及至少一种基材的电解涂覆方法，该方法是在根据本发明的装置中进行的，该带在基材上被放置并涂覆并循环，循环速度对应于与衬底被引导通过浴。最后，本发明还涉及根据本发明的装置在不导电支撑件上的导电结构的电解涂层的用途。

4. 发明授权

US5071508A Method of and arrangement for etching an etch material consisting at least partly of metal 失效
标题翻译：用于蚀刻金属至少部分的蚀刻材料的方法和装配
公开(公告)号：US5071508A
公开(公告)日：1991-12-10
申请号：US584125
申请日：1990-10-03
申请人： Alfred Scheithauer , Wolfgang Alberth , Gert Pohl , Herbert Ziegler
发明人： Alfred Scheithauer , Wolfgang Alberth , Gert Pohl , Herbert Ziegler
IPC分类号： C23F1/08 , H01B13/00 , H05K3/06
CPC分类号： H05K3/068 , C23F1/08
摘要： The invention concerns a method of etching an etch material consisting at least partly of metal and an arrangement for implementing that method.According to the invention, the etchant is applied through jet assemblies arranged perpendicularly to each other on the top and the bottom side of the etch material. During the passage of the etch material, the spray pressure at the jet assemblies or the jets may be set to constant values and/or be individually controlled as a function of the quantity of metal to be etched off the top and the bottom side. The invention is particularly suitable for etching circuit boards, whose conductors on the top and the bottom side are arranged perpendicularly to each other.

5. 发明授权

US5002627A Spray etching apparatus with automatic individually controllable etching jets 失效
标题翻译：喷涂蚀刻装置，具有自动单独控制的蚀刻喷嘴
公开(公告)号：US5002627A
公开(公告)日：1991-03-26
申请号：US390127
申请日：1989-08-07
申请人： Alfred Scheithauer , Wolfgang Alberth , Gert Pohl , Herbert Ziegler
发明人： Alfred Scheithauer , Wolfgang Alberth , Gert Pohl , Herbert Ziegler
IPC分类号： C23F1/08 , H01B13/00 , H05K3/06
CPC分类号： H05K3/068 , C23F1/08
摘要： The invention concerns a method of etching an etch material consisting at least partly of metal and an arrangement for implementing that method. According to the invention, the etchant is applied through jet assemblies arranged perpendicularly to each other on the top and the bottom side of the etch material. During the passage of the etch material, the spray pressure at the jet assemblies or the jets may be set to constant values and/or by individually controlled as a function of the quantity of metal to be etched off the top and the bottom side. The invention is particularly suitable for etching circuit boards, whose conductors on the top and the bottom side are arranged perpendicularly to each other.
摘要翻译：本发明涉及一种蚀刻蚀刻材料的方法，该蚀刻材料至少部分地由金属构成，并且用于实现该方法。根据本发明，通过在蚀刻材料的顶部和底部上彼此垂直布置的喷射组件施加蚀刻剂。在蚀刻材料通过期间，喷射组件或射流处的喷射压力可以被设定为恒定值和/或通过单独控制作为从顶侧和底侧蚀刻的金属的量的函数。本发明特别适用于蚀刻电路板，它们的顶部和底部的导体彼此垂直布置。

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