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1. 发明申请

US20070100031A1 Ultraviolet light absorbers 失效
公开(公告)号：US20070100031A1
公开(公告)日：2007-05-03
申请号：US11640808
申请日：2006-12-18
申请人： Ramanathan Ravichandran , Stephen Pastor , Deborah Judd , Joseph Babiarz , Andrew Naughton , Mervin Wood , Anthony Debellis , Rong Xiong , Robert Detlefsen , Joseph Suhadolnik
发明人： Ramanathan Ravichandran , Stephen Pastor , Deborah Judd , Joseph Babiarz , Andrew Naughton , Mervin Wood , Anthony Debellis , Rong Xiong , Robert Detlefsen , Joseph Suhadolnik
IPC分类号： C08K5/34 , C08K5/48
CPC分类号： C07D239/91 , C07D239/74 , C07D239/86 , C07D249/20 , C07D265/22 , C07D405/04
摘要： The present invention relates to novel ultraviolet light absorbers of the benzoxazinone, oxanilide, benzylidene malonate, quinazoline and benzotriazole classes. The invention also relates to polymer and photographic compositions stabilized against the deleterious effects of light induced degradation which comprise the novel ultraviolet light absorbers.

2. 发明授权

US06566507B2 Processes for the preparation of benzotriazole UV absorbers 失效
公开(公告)号：US06566507B2
公开(公告)日：2003-05-20
申请号：US09871369
申请日：2001-05-31
申请人： Mervin G. Wood , Deborah DeHessa , Joseph Suhadolnik , Andrew B. Naughton , Jerome Sanders , Jacqueline Lau , Rong Xiong , Joseph Babiarz
发明人： Mervin G. Wood , Deborah DeHessa , Joseph Suhadolnik , Andrew B. Naughton , Jerome Sanders , Jacqueline Lau , Rong Xiong , Joseph Babiarz
IPC分类号： C09B4100
CPC分类号： C07D249/20 , C07C245/08
摘要： Provided is a process for preparing 2H-benzotriazole UV absorbers containing a perfluoroalkyl moiety at the 5-position of the benzo ring, for example a trifluoromethyl group, which involves diazotizing the perfluoroalkyl substituted o-nitroaniline using concentrated sulfuric acid plus sodium nitrite or nitrosylsulfuric acid to form the corresponding monoazobenzene intermediate via the diazonium salt intermediate which is reduced to the corresponding 5-perfluoroalkyl substituted 2H-benzotriazole UV absorber compound by conventional reduction means. Also provided is a novel one-pot, multiphase reaction for the preparation of 2(2-nitrophenylazo) substituted phenols, which are precursors for 2H-benzotriazole UV absorbers.

3. 发明申请

US20050261401A1 Water compatible sterically hindered alkoxyamines and hydroxy substituted alkoxyamines 失效
公开(公告)号：US20050261401A1
公开(公告)日：2005-11-24
申请号：US11136792
申请日：2005-05-25
申请人： Mervin Wood , Robert Detlefsen , James Galbo , Wanda Martin , Paul Kondracki , Michael DiFazio , Joseph Babiarz
发明人： Mervin Wood , Robert Detlefsen , James Galbo , Wanda Martin , Paul Kondracki , Michael DiFazio , Joseph Babiarz
IPC分类号： C07D211/94 , C07D401/14 , C08K5/34 , C03C17/00 , C09D11/00
CPC分类号： C07D211/94 , C07D401/14
摘要： Sterically hindered alkoxyamine and hydroxy substituted alkoxyamine stabilizer compounds are made water compatible via certain backbones with affinity towards water. The sterically hindered amines are for example of the formula where for example E and E′ are 2-hydroxycyclohexyloxy, 2-hydroxy-2-methylpropoxy, benzyloxy, methoxy, propoxy, hexyloxy, heptyloxy, octyloxy or cyclohexyloxy, Rx is for example —NH2+CH2CH2OH Cl−, —NH3+−OAc, ═NOH, —NHCH(CH3)COO−K+, —NHCH2CH2N(CH3)2+−OAc, —NHCH2CH2SO3−K+, —NHCH(COO−K+)CH2CH2SCH3, —NHCH2COO−K+, —OCH(CH3)COO−K+, —OCH2CH2N(CH3)2+−OAc, —OCH2CH2SO3−K+, —OCH(COO−K+)CH2CH2SCH3 or —OCH2COO31K+, and where R5 comprises repeating units of —(OCH2CH2)—, —(OCH2CH2(CH3))—, —(CH2CHCOOH)—, —(CH2C(CH3)COOH)—, —(CH2CHCOOCH3)—, —(NHCH2CH2)—, —(CH2CHOH)—, —(CH2CHCONH2)— or —(CH2CH(NHCOH))—. These compounds are particularly effective in stabilizing aqueous polymer systems against the deleterious effects of oxidative, thermal and actinic radiation. The compounds are effective for example in stabilizing water borne coatings, aqueous inks, aqueous ink jet media and photocured aqueous systems.

4. 发明授权

US06605727B2 Processes for the preparation of benzotriazole UV absorbers 失效
公开(公告)号：US06605727B2
公开(公告)日：2003-08-12
申请号：US10315692
申请日：2002-12-10
申请人： Mervin G. Wood , Deborah DeHessa , Joseph Suhadolnik , Andrew B. Naughton , Jerome Sanders , Jacqueline Lau , Rong Xiong , Joseph Babiarz
发明人： Mervin G. Wood , Deborah DeHessa , Joseph Suhadolnik , Andrew B. Naughton , Jerome Sanders , Jacqueline Lau , Rong Xiong , Joseph Babiarz
IPC分类号： C07D24920
CPC分类号： C07D249/20 , C07C245/08
摘要： Provided is a process for preparing 2H-benzotriazole UV absorbers containing a perfluoroalkyl moiety at the 5-position of the benzo ring, for example a trifluoromethyl group, which involves diazotizing the perfluoroalkyl substituted o-nitroaniline using concentrated sulfuric acid plus sodium nitrite or nitrosylsulfuric acid to form the corresponding monoazobenzene intermediate via the diazonium salt intermediate which is reduced to the corresponding 5-perfluoroalkyl substituted 2H-benzotriazole UV absorber compound by conventional reduction means. Also provided is a novel one-pot, multiphase reaction for the preparation of 2(2-nitrophenylazo) substituted phenols, which are precursors for 2H-benzotriazole UV absorbers.

5. 发明授权

US06815550B2 Processes for the preparation of benzotriazole UV absorbers 失效
标题翻译：制备苯并三唑紫外线吸收剂的方法
公开(公告)号：US06815550B2
公开(公告)日：2004-11-09
申请号：US10315693
申请日：2002-12-10
申请人： Mervin G. Wood , Deborah DeHessa , Joseph Suhadolnik , Andrew B. Naughton , Jerome Sanders , Jacqueline Lau , Rong Xiong , Joseph Babiarz
发明人： Mervin G. Wood , Deborah DeHessa , Joseph Suhadolnik , Andrew B. Naughton , Jerome Sanders , Jacqueline Lau , Rong Xiong , Joseph Babiarz
IPC分类号： C07D24920
CPC分类号： C07D249/20 , C07C245/08
摘要： Provided is a process for preparing 2H-benzotriazole UV absorbers containing a perfluoroalkyl moiety at the 5-position of the benzoic ring, for example a trifluoromethyl group, which involves digitizing the perfluoroalkyl substituted o-nitroaniline using concentrated sulfuric acid plus sodium nitrite or nitrosylsulfuric acid to form the corresponding monoazobenzene intermediate via the diazonium salt intermediate which is reduced to the corresponding 5-perfluoroalkyl substituted 2H-benzotriazole UV absorber compound by conventional reduction means. Also provided is a novel one-pot, multiphase reaction for the preparation of 2(2-nitrophenylazo) substituted phenols, which are precursors for 2H-benzotriazole UV absorbers.
摘要翻译：提供了制备在苯甲酸环的5位上含有全氟烷基部分的2H-苯并三唑UV吸收剂的方法，例如三氟甲基，其涉及使用浓硫酸加亚硝酸钠或亚硝酰基硫酸将全氟烷基取代的邻硝基苯胺数字化通过重氮盐中间体形成相应的单偶氮苯中间体，其通过常规还原方法还原成相应的5-全氟烷基取代的2H-苯并三唑UV吸收剂化合物。还提供了用于制备2（2-硝基苯基偶氮）取代的酚的新颖的一锅多相反应，其是2H-苯并三唑UV吸收剂的前体。

6. 发明授权

US06353113B1 Process for the preparation of 5-perfluoroalkyl substituted benzotriazole UV absorbers 有权
标题翻译：制备5-全氟烷基取代苯并三唑UV吸收剂的方法
公开(公告)号：US06353113B1
公开(公告)日：2002-03-05
申请号：US09632217
申请日：2000-08-03
申请人： Mervin G. Wood , Deborah DeHessa , Andrew B. Naughton , Jerome Sanders , Jacqueline Lau , Rong Xiong , Joseph Babiarz
发明人： Mervin G. Wood , Deborah DeHessa , Andrew B. Naughton , Jerome Sanders , Jacqueline Lau , Rong Xiong , Joseph Babiarz
IPC分类号： C07D24920
CPC分类号： C07C245/08 , C07D249/20
摘要： A process for preparing 2H-benzotriazole UV absorbers containing a perfluoroalkyl moiety at the 5-position of the benzo ring, preferably a trifluoromethyl group, involves diazotizing the perfluoroalkyl substituted o-nitroaniline using concentrated sulfuric acid plus sodium nitrite or preferably nitrosylsulfuric acid to form the corresponding monoazobenzene intermediate via the diazonium salt intermediate which is reduced to the corresponding 5-perfluoroalkyl substituted 2H-benzotriazole UV absorber compound by conventional reduction means.
摘要翻译：制备苯并三唑UV吸收剂的方法，其在苯环的5-位，优选三氟甲基基团中含有全氟烷基部分，包括使用浓硫酸加亚硝酸钠或优选亚硝酰基硫酸使全氟烷基取代的邻硝基苯胺重氮化，形成通过重氮盐中间体相应的单偶氮苯中间体，其通过常规还原方法还原成相应的5-全氟烷基取代的2H-苯并三唑UV吸收剂化合物。

7. 发明授权

US5448826A Method of making ceramic microwave electronic package 失效
标题翻译：陶瓷微波电子封装方法
公开(公告)号：US5448826A
公开(公告)日：1995-09-12
申请号：US231492
申请日：1994-04-22
申请人： Martin Goetz , Joseph Babiarz
发明人： Martin Goetz , Joseph Babiarz
IPC分类号： H01L21/00 , H01L23/66 , H05K13/00
CPC分类号： H01L21/67121 , H01L23/66 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y10T29/49121 , Y10T29/49126 , Y10T29/49158
摘要： A ceramic microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached either by seal glass or by solder to a ceramic RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A ceramic seal ring with a second cavity corresponding to that of the RF substrate, but slightly larger, is attached to the RF substrate by seal glass which is patterned to generally match the dimensions of the seal ring. A ceramic lid is attached to the top of the seal ring by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.
摘要翻译：适用于高频微电子器件的陶瓷微电子封装包括至少部分导电的基底，其通过密封玻璃或通过焊料附着到具有形成在其中心的空腔的陶瓷RF基板，以及用于提供从内到外包装。基底可以是金属或陶瓷，其上沉积有金属层。具有对应于RF衬底的第二腔但稍大的陶瓷密封环通过被图案化以与密封环的尺寸大体匹配的密封玻璃附接到RF衬底。陶瓷盖通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到密封环的顶部，以在微电子装置安装在内部之后密封包装。

8. 发明授权

US5753972A Microelectronics package 失效
标题翻译：微电子封装
公开(公告)号：US5753972A
公开(公告)日：1998-05-19
申请号：US645729
申请日：1996-05-14
申请人： Deborah S. Wein , Paul M. Anderson , Alan W. Lindner , Martin Goetz , Joseph Babiarz
发明人： Deborah S. Wein , Paul M. Anderson , Alan W. Lindner , Martin Goetz , Joseph Babiarz
IPC分类号： H01L23/12 , H01L21/00 , H01L23/66 , H01L23/52
CPC分类号： H01L21/67121 , H01L23/66 , H01L2924/0002 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/16152 , H01L2924/1616 , H01L2924/1617 , H01L2924/167 , H01L2924/16787 , H01L2924/16788 , H01L2924/1679 , H01L2924/3011
摘要： A microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached to an RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A sealing cap is attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.
摘要翻译：适用于高频微电子器件的微电子封装包括：至少部分导电的基底，其附着到具有在其中心形成的空腔的RF衬底和用于提供从封装的内部到外部的互连的导电路径的图案。基底可以是金属或陶瓷，其上沉积有金属层。通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）将密封帽附接到RF基板上，以在微电子器件安装在内部之后密封封装。

9. 发明授权

US5736783A High frequency microelectronics package 失效
标题翻译：高频微电子封装
公开(公告)号：US5736783A
公开(公告)日：1998-04-07
申请号：US645848
申请日：1996-05-14
申请人： Deborah S. Wein , Paul M. Anderson , Alan W. Lindner , Martin Goetz , Joseph Babiarz , Timothy Going
发明人： Deborah S. Wein , Paul M. Anderson , Alan W. Lindner , Martin Goetz , Joseph Babiarz , Timothy Going
IPC分类号： H01L23/12 , H01L21/00 , H01L23/66 , H01L23/52
CPC分类号： H01L21/67121 , H01L23/66 , H01L2924/0002 , H01L2924/16152 , H01L2924/3011
摘要： A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.
摘要翻译：适用于高频微电子器件的高频微电子封装包括至少部分导电并且附接到RF衬底的基底，其中心形成有空腔。基底可以是金属或陶瓷，其上沉积有金属层。在RF基板的表面上形成用于从封装的内部向外部提供互连的导电路径的图案。这些导电图案被设计为当未覆盖时具有恒定的阻抗，而与用于覆盖导电图案的材料的介电性质无关。也就是说，由各种介电材料制成的密封盖或盖子可以通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到RF基板上，以密封包装，一旦微电子器件已经安装在里面

10. 发明授权

US06172412B2 High frequency microelectronics package 有权
标题翻译：高频微电子封装
公开(公告)号：US06172412B2
公开(公告)日：2001-01-09
申请号：US09220133
申请日：1998-12-23
申请人： Deborah S. Wein , Paul M. Anderson , Alan W. Lindner , Martin Goetz , Joseph Babiarz , Timothy Going
发明人： Deborah S. Wein , Paul M. Anderson , Alan W. Lindner , Martin Goetz , Joseph Babiarz , Timothy Going
IPC分类号： H01L2940
CPC分类号： H01L21/67121 , H01L23/66 , H01L2223/6627 , H01L2223/6633 , H01L2924/0002 , H01L2924/19032 , H01L2924/19039 , H01L2924/3011 , H01L2924/00
摘要： A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.
摘要翻译：适用于高频微电子器件的高频微电子封装包括至少部分导电并且附接到RF衬底的基底，其中心形成有空腔。基底可以是金属或陶瓷，其上沉积有金属层。在RF基板的表面上形成用于从封装的内部向外部提供互连的导电路径的图案。这些导电图案被设计为当未覆盖时具有恒定的阻抗，而与用于覆盖导电图案的材料的介电性质无关。也就是说，由各种介电材料制成的密封盖或盖子可以通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到RF基板上，以密封包装，一旦微电子器件已经安装在里面

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