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1. 发明授权

US07781328B2 Multilayer substrate 有权
标题翻译：多层基板
公开(公告)号：US07781328B2
公开(公告)日：2010-08-24
申请号：US11868898
申请日：2007-10-08
申请人： Rajiv Shah , Shaun Pendo , Edward B. Babiricki
发明人： Rajiv Shah , Shaun Pendo , Edward B. Babiricki
IPC分类号： H01L21/4763
CPC分类号： H01L21/4857 , H01L2924/0002 , H05K1/092 , H05K3/4061 , H05K3/4647 , H05K3/4667 , H05K3/467 , H05K2201/0179 , H05K2203/0278 , H01L2924/00
摘要： A multilayer substrate device formed from a base substrate and alternating metalization layers and dielectric layers. Each layer is formed without firing. Vias may extend through one of the dielectric layers such that two metalization layers surrounding the dielectric layers make contact with each other. The vias may be formed by placing pillars on top of a metalization layer, forming a dielectric layer on top of the metalization layer and surrounding the pillars, and removing the pillars. Dielectric layers may be followed by other dielectric layers and metalization layers may be followed by other metalization layers. Vias in the substrate may be filled by forming an assembly around the substrate, the assembly including printing sheets containing a conductive ink and pressure plates for applying pressure. A vacuum may be applied to remove air in the ink. Pressure may then be applied to the printing sheets through the pressure plates. The conductive ink in the printing sheets is pushed through the vias when pressure is applied by the pressure plates.
摘要翻译：由基底基板和交替的金属化层和电介质层形成的多层衬底器件。每层形成而不烧制。通孔可以延伸穿过介电层之一，使得围绕电介质层的两个金属化层彼此接触。可以通过将金属化层顶部放置柱子形成通孔，在金属化层的顶部上形成电介质层并围绕柱子，并移除支柱。电介质层之后可以是其它电介质层，金属化层之后可以是其它金属化层。可以通过在基板周围形成组件来填充基板中的通孔，该组件包括含有导电油墨的印刷纸和用于施加压力的压力板。可以施加真空以除去油墨中的空气。然后可以通过压力板将压力施加到印刷纸上。当通过压力板施加压力时，打印纸中的导电油墨被推过通孔。

2. 发明授权

US07323142B2 Sensor substrate and method of fabricating same 有权
标题翻译：传感器基板及其制造方法
公开(公告)号：US07323142B2
公开(公告)日：2008-01-29
申请号：US10038276
申请日：2002-01-02
申请人： Shaun Pendo , Rajiv Shah , Edward Chernoff
发明人： Shaun Pendo , Rajiv Shah , Edward Chernoff
IPC分类号： G01N27/06 , G01N33/66
CPC分类号： H05K3/28 , A61B5/0006 , H05K1/0306 , H05K3/4061 , H05K2201/0175 , H05K2201/0179 , H05K2201/0317 , H05K2201/09472 , H05K2203/082 , H05K2203/085 , H05K2203/1147 , H05K2203/1476 , H05K2203/1572 , H05K2203/308
摘要： A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.
摘要翻译：具有从衬底的一侧延伸到另一侧的气密密封通孔的衬底及其制造方法。通孔可以填充有导电材料，例如无油墨。由导电材料形成的导电路径有助于将基板的一侧与另一侧密封。衬底的一侧可以包括感测元件，并且衬底的另一侧可以包括感测电子器件。

3. 发明申请

US20060189044A1 High reliability multilayer circuit substrates and methods for their formation 有权
标题翻译：高可靠性多层电路基板及其形成方法
公开(公告)号：US20060189044A1
公开(公告)日：2006-08-24
申请号：US11395457
申请日：2006-03-31
申请人： Rajiv Shah , Shaun Pendo
发明人： Rajiv Shah , Shaun Pendo
IPC分类号： H01L21/8232 , H01L21/335
CPC分类号： H05K3/467 , H01L21/4857 , H01L21/4867 , H01L2924/0002 , H01L2924/19107 , H05K1/162 , H05K3/048 , H05K3/4053 , H05K3/4061 , H05K3/4664 , H05K2201/0179 , H05K2203/0278 , H05K2203/085 , H05K2203/1476 , H05K2203/308 , H01L2924/00
摘要： A multilayer circuit substrate for multi-chip modules or hybrid circuits includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by shadow mask techniques. Substrates formed in this manner enable significant increases in interconnect density and significant reduction of over-all substrate thickness.
摘要翻译：用于多芯片模块或混合电路的多层电路衬底包括电介质基底，形成在基底衬底上的导体和形成在导体和基底衬底上的真空沉积的电介质薄膜。使用由荫罩技术形成的牺牲结构对真空沉积的电介质薄膜进行图案化。以这种方式形成的基板能够显着增加互连密度并显着降低总体衬底厚度。

4. 发明授权

US11553862B2 Analyte sensor 有权
公开(公告)号：US11553862B2
公开(公告)日：2023-01-17
申请号：US16625884
申请日：2018-06-22
申请人： PERCUSENNE , Rajiv Shah , Bradley Liang , Katherine Wolfe , Ellen Messer , Shaun Pendo
发明人： Rajiv Shah , Bradley Liang , Katherine Wolfe , Ellen Messer , Shaun Pendo
IPC分类号： A61B5/1455 , A61B5/1486 , A61B5/00 , G01N33/50 , C12Q1/00
摘要： An electrode measuring the presence of an analyte is described as one embodiment. The electrode includes a working conductor with an electrode reactive surface and a first reactive chemistry that is responsive to the analyte. The electrode further includes a first transport material that enables flux of the first analyte to the first reactive chemistry and a second transport material that supplies a reactant to the first reactive chemistry. Wherein the first reactive chemistry does not contact the electrode reactive surface while at least partially shadowing a portion of the electrode reactive surface.

5. 发明授权

US07138330B2 High reliability multilayer circuit substrates and methods for their formation 有权
公开(公告)号：US07138330B2
公开(公告)日：2006-11-21
申请号：US10671996
申请日：2003-09-26
申请人： Rajiv Shah , Shaun Pendo
发明人： Rajiv Shah , Shaun Pendo
IPC分类号： H01L21/4763
CPC分类号： H05K3/467 , H01L21/4857 , H01L21/4867 , H01L2924/0002 , H01L2924/19107 , H05K1/162 , H05K3/048 , H05K3/4053 , H05K3/4061 , H05K3/4664 , H05K2201/0179 , H05K2203/0278 , H05K2203/085 , H05K2203/1476 , H05K2203/308 , H01L2924/00
摘要： A multilayer circuit substrate for multi-chip modules or hybrid circuits includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by shadow mask techniques. Substrates formed in this manner enable significant increases in interconnect density and significant reduction of over-all substrate thickness.

6. 发明申请

US20050161826A1 Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures 有权
标题翻译：多层电路器件和使用电镀牺牲结构的制造方法
公开(公告)号：US20050161826A1
公开(公告)日：2005-07-28
申请号：US11086936
申请日：2005-03-22
申请人： Rajiv Shah , Shaun Pendo
发明人： Rajiv Shah , Shaun Pendo
IPC分类号： H01L21/48 , H05K1/16 , H05K3/04 , H05K3/40 , H05K3/46 , H01L23/053
CPC分类号： H05K1/162 , H01L21/4857 , H01L21/4867 , H01L2224/48227 , H01L2224/49171 , H01L2924/19105 , H05K3/048 , H05K3/06 , H05K3/4053 , H05K3/4061 , H05K3/4664 , H05K3/467 , H05K2201/0179 , H05K2203/0278 , H05K2203/085 , H05K2203/1476 , H05K2203/308 , H01L2924/00
摘要： A multilayer circuit includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by electroplating techniques. Substrates formed in this manner enable significant increases in circuit pattern miniaturization, circuit pattern reliability, interconnect density and significant reduction of over-all substrate thickness.
摘要翻译：多层电路包括介电基底基板，形成在基底基板上的导体和形成在导体和基底基板上的真空沉积的电介质薄膜。使用通过电镀技术形成的牺牲结构对真空沉积的电介质薄膜进行图案化。以这种方式形成的衬底使得电路图案的小型化，电路图案可靠性，互连密度显着增加，并且显着降低了全部衬底厚度。

7. 发明授权

US07577470B2 Long term analyte sensor array 有权
标题翻译：长期分析物传感器阵列
公开(公告)号：US07577470B2
公开(公告)日：2009-08-18
申请号：US10989038
申请日：2004-11-15
申请人： Rajiv Shah , Rebecca K. Gottlieb , Eric A. Grovender , Shaun Pendo , Paul Citron , William P. Van Antwerp
发明人： Rajiv Shah , Rebecca K. Gottlieb , Eric A. Grovender , Shaun Pendo , Paul Citron , William P. Van Antwerp
IPC分类号： A61B5/00
CPC分类号： A61B5/14865 , A61B5/14532 , A61B5/412 , G01N33/5438
摘要： A long term analyte sensor for measuring at least one analyte in the body of a user and which includes a housing, a plurality of analyte contacting sensor elements and at least one structure for relaying information away from the sensor. This plurality of analyte contacting sensor elements are typically disposed in an array. The analyte sensor further includes at least one sensor protection membrane that is controllable in a manner such that sensor elements may be activated (e.g. exposed to the external environment) at different times so as to extend the useful life of the sensor. In illustrative analyte sensors, the analyte is glucose.
摘要翻译：一种用于测量使用者身体中的至少一种分析物的长期分析物传感器，其包括壳体，多个分析物接触传感器元件和用于将信息远离传感器中继的至少一个结构。该多个分析物接触传感器元件通常以阵列方式设置。分析物传感器还包括至少一个传感器保护膜，该传感器保护膜可以以不同时间使传感器元件被激活（例如暴露于外部环境）的方式被控制，以便延长传感器的使用寿命。在说明性的分析物传感器中，分析物是葡萄糖。

8. 发明授权

US07514038B2 Sensor substrate and method of fabricating same 有权
标题翻译：传感器基板及其制造方法
公开(公告)号：US07514038B2
公开(公告)日：2009-04-07
申请号：US10861976
申请日：2004-06-04
申请人： Shaun Pendo , Rajiv Shah , Edward Chernoff
发明人： Shaun Pendo , Rajiv Shah , Edward Chernoff
IPC分类号： G01N21/00 , H05K3/40 , H05K1/03
CPC分类号： H05K3/28 , A61B5/0006 , H05K1/0306 , H05K3/4061 , H05K2201/0175 , H05K2201/0179 , H05K2201/0317 , H05K2201/09472 , H05K2203/082 , H05K2203/085 , H05K2203/1147 , H05K2203/1476 , H05K2203/1572 , H05K2203/308
摘要： A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.
摘要翻译：具有从衬底的一侧延伸到另一侧的气密密封通孔的衬底及其制造方法。通孔可以填充有导电材料，例如无油墨。由导电材料形成的导电路径有助于将基板的一侧与另一侧密封。衬底的一侧可以包括感测元件，并且衬底的另一侧可以包括感测电子器件。

9. 发明申请

US20050233172A1 Alumina insulation for coating implantable components and other microminiature devices 有权
标题翻译：用于涂层可植入组件和其他微型设备的氧化铝绝缘
公开(公告)号：US20050233172A1
公开(公告)日：2005-10-20
申请号：US11150547
申请日：2005-06-10
申请人： Joseph Schulman , Joseph Lucisano , Rajiv Shah , Charles Byers , Shaun Pendo
发明人： Joseph Schulman , Joseph Lucisano , Rajiv Shah , Charles Byers , Shaun Pendo
IPC分类号： A61L2/00 , A61N1/02 , B05D3/00 , B32B9/00 , C23C14/00 , C23C14/04 , G03F1/00 , G03F7/20 , H01L21/308 , H01L23/29 , H05K3/28
CPC分类号： G03F7/70641 , A61N1/02 , A61N1/375 , C23C14/042 , H01L21/308 , H01L23/291 , H01L2924/0002 , H05K3/284 , Y10T29/49144 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926 , Y10T428/265 , H01L2924/00
摘要： A protective, biocompatible coating or encapsulation material protects and insulates a component or device intended to be implanted in living tissue. The coating or encapsulation material comprises a thin layer or layers of alumina, zerconia, or other ceramic, less than 25 microns thick, e.g., 5-10 microns thick. The alumina layer(s) may be applied at relatively low temperature. Once applied, the layer provides excellent hermeticity, and prevents electrical leakage. Even though very thin, the alumina layer retains excellent insulating characteristics. In one embodiment, an alumina layer less than about 6 microns thick provides an insulative coating that exhibits less than 10 pA of leakage current over an area 75 mils by 25 mils area while soaking in a saline solution at temperatures up to 80° C. over a three month period.
摘要翻译：保护性的，生物相容的涂层或包封材料保护和绝缘想要植入生物体组织的组件或装置。涂层或包封材料包括薄层或多层氧化铝，稀土或其它小于25微米厚，例如5-10微米厚的陶瓷。氧化铝层可以在相对较低的温度下施加。一旦施加，该层提供优异的气密性，并防止漏电。即使非常薄，氧化铝层保持优异的绝缘特性。在一个实施方案中，小于约6微米厚的氧化铝层提供了一种绝缘涂层，其在75密耳25密耳面积的面积上表现出低于10pA的漏电流，同时在高达80℃的温度下浸入盐水溶液中一个三个月的时间。

10. 发明授权

US08821793B2 Sensor substrate and method of fabricating same 有权
标题翻译：传感器基板及其制造方法
公开(公告)号：US08821793B2
公开(公告)日：2014-09-02
申请号：US11924402
申请日：2007-10-25
申请人： Shaun Pendo , Rajiv Shah , Edward Chernoff
发明人： Shaun Pendo , Rajiv Shah , Edward Chernoff
IPC分类号： H05K1/14 , H05K1/18 , H05K3/28 , H05K3/40 , H05K1/03 , A61B5/00
CPC分类号： H05K3/28 , A61B5/0006 , H05K1/0306 , H05K3/4061 , H05K2201/0175 , H05K2201/0179 , H05K2201/0317 , H05K2201/09472 , H05K2203/082 , H05K2203/085 , H05K2203/1147 , H05K2203/1476 , H05K2203/1572 , H05K2203/308
摘要： A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.
摘要翻译：具有从衬底的一侧延伸到另一侧的气密密封通孔的衬底及其制造方法。通孔可以填充有导电材料，例如无油墨。由导电材料形成的导电路径有助于将基板的一侧与另一侧密封。衬底的一侧可以包括感测元件，并且衬底的另一侧可以包括感测电子器件。

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