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1. 发明授权

US09209625B2 Method and system to co-optimize utilization of demand response and energy storage resources 有权
标题翻译：共同优化需求响应和能源储存资源利用的方法和系统
公开(公告)号：US09209625B2
公开(公告)日：2015-12-08
申请号：US13451851
申请日：2012-04-20
申请人： Rajesh Tyagi , Rayette Ann Fisher , Jason Wayne Black
发明人： Rajesh Tyagi , Rayette Ann Fisher , Jason Wayne Black
IPC分类号： G05D17/00 , H02J3/28 , H02J3/00
CPC分类号： H02J3/28 , H02J3/008 , Y04S50/10
摘要： Method and system to provide co-optimized utilization of demand response and energy storage resources in an electrical grid system. The system may include a module to evaluate a marginal savings relative to a dispatch cost, if a demand response event is performed. The system may further include a module to evaluate a marginal savings relative to the dispatch cost, if an energy storage event is performed, and a controller including circuitry may be configured to determine a control strategy to perform a dispatch including a demand response event and/or an energy storage event, based at least in part on the respective marginal savings of the demand response event and/or the energy storage event, which may be selected to co-optimize an integrated utilization of the demand response and energy storage resources to meet a given objective.
摘要翻译：提供电网系统中需求响应和能量储存资源共同优化利用的方法和系统。如果执行需求响应事件，系统可以包括用于评估相对于调度成本的边际储蓄的模块。如果执行能量存储事件，则系统可以进一步包括用于评估相对于调度成本的边际节约的模块，并且包括电路的控制器可以被配置为确定执行调度的控制策略，包括需求响应事件和/ 或能量存储事件，其至少部分地基于需求响应事件和/或能量存储事件的相应的边际节约，其可以被选择以共同优化需求响应和能量存储资源的综合利用以满足给定的目标。

2. 发明申请

US20130282193A1 METHOD AND SYSTEM TO CO-OPTIMIZE UTILIZATION OF DEMAND RESPONSE AND ENERGY STORAGE RESOURCES 有权
标题翻译：共同优化应用需求和能源储存资源利用的方法与系统
公开(公告)号：US20130282193A1
公开(公告)日：2013-10-24
申请号：US13451851
申请日：2012-04-20
申请人： Rajesh Tyagi , Rayette Ann Fisher , Jason Wayne Black
发明人： Rajesh Tyagi , Rayette Ann Fisher , Jason Wayne Black
IPC分类号： G06F1/26
CPC分类号： H02J3/28 , H02J3/008 , Y04S50/10
摘要： Method and system to provide co-optimized utilization of demand response and energy storage resources in an electrical grid system. The system may include a module to evaluate a marginal savings relative to a dispatch cost, if a demand response event is performed. The system may further include a module to evaluate a marginal savings relative to the dispatch cost, if an energy storage event is performed, and a controller including circuitry may be configured to determine a control strategy to perform a dispatch including a demand response event and/or an energy storage event, based at least in part on the respective marginal savings of the demand response event and/or the energy storage event, which may be selected to co-optimize an integrated utilization of the demand response and energy storage resources to meet a given objective.
摘要翻译：提供电网系统中需求响应和能量储存资源共同优化利用的方法和系统。如果执行需求响应事件，系统可以包括用于评估相对于调度成本的边际储蓄的模块。如果执行能量存储事件，则系统可以进一步包括用于评估相对于调度成本的边际节约的模块，并且包括电路的控制器可以被配置为确定执行调度的控制策略，所述调度包括需求响应事件和/ 或能量存储事件，其至少部分地基于需求响应事件和/或能量存储事件的相应的边际节约，其可以被选择以共同优化需求响应和能量存储资源的综合利用以满足给定的目标。

3. 发明申请

US20110071397A1 LARGE AREA MODULAR SENSOR ARRAY ASSEMBLY AND METHOD FOR MAKING THE SAME 有权
标题翻译：大区域模块化传感器阵列组件及其制造方法
公开(公告)号：US20110071397A1
公开(公告)日：2011-03-24
申请号：US12714239
申请日：2010-02-26
申请人： Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Shubhra Bansal , Albert Taesung Byun
发明人： Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Shubhra Bansal , Albert Taesung Byun
IPC分类号： A61B8/00 , B23K31/02
CPC分类号： B23K1/0016 , B06B1/0629
摘要： A modular and tileable sensor array with routing in the interposer carrying the signals from the sensors to the integrated circuits. In one embodiment a large area modular sensor array assembly includes one or more tileable modules coupled together. The tileable modules have a plurality of transducer cells forming a sensor, an interposer coupled on a first side to the plurality of transducer cells by a plurality, one or more integrated circuits coupled to a second side of the interposer, wherein the interposer is configured to form the connection of at least some of the transducer cells to the integrated circuits, and one or more input/output connectors coupled to the interposer and providing an external interface.
摘要翻译：一种模块化且可分散的传感器阵列，其具有在插入器中的路由，其将来自传感器的信号传送到集成电路。在一个实施例中，大面积模块化传感器阵列组件包括耦合在一起的一个或多个可瓦片模块。可拼接模块具有形成传感器的多个换能器单元，通过耦合到中介层的第二侧的多个一个或多个集成电路在第一侧耦合到多个换能器单元的插入件，其中插入件配置成形成至少一些传感器单元与集成电路的连接，以及耦合到插入器并提供外部接口的一个或多个输入/输出连接器。

4. 发明申请

US20080296708A1 Integrated sensor arrays and method for making and using such arrays 审中-公开
标题翻译：集成传感器阵列和制造和使用这种阵列的方法
公开(公告)号：US20080296708A1
公开(公告)日：2008-12-04
申请号：US11809165
申请日：2007-05-31
申请人： Robert Gideon Wodnicki , Wei-Cheng Tian , Kevin Matthew Durocher , Charles Gerard Woychik , Rayette Ann Fisher , Stacey Joy Kennerly , Lowell Scott Smith , Douglas Glenn Wildes
发明人： Robert Gideon Wodnicki , Wei-Cheng Tian , Kevin Matthew Durocher , Charles Gerard Woychik , Rayette Ann Fisher , Stacey Joy Kennerly , Lowell Scott Smith , Douglas Glenn Wildes
IPC分类号： H01L21/50 , H01L23/00
CPC分类号： G01N29/2406 , B06B1/0292 , G01N2291/106 , H01L2224/04105 , H01L2224/24 , H01L2224/73267 , H01L2224/82
摘要： The present invention relates to a method for making an integrated sensor comprising providing a sensor array fabricated on a top surface of a bulk silicon wafer having a top surface and a bottom surface, and comprising a plurality of sensors fabricated on the top surface of the bulk silicon wafer. The method further comprises coupling an SOI wafer to the top surface of the bulk silicon wafer, thinning the back surface of the bulk silicon wafer, coupling a plurality of integrated circuit die to the back surface of the bulk silicon wafer, and removing the SOI wafer from the top surface of the bulk silicon wafer.
摘要翻译：本发明涉及一种用于制造集成传感器的方法，其包括提供制造在具有顶表面和底表面的体硅晶片的顶表面上的传感器阵列，并且包括在本体的顶表面上制造的多个传感器硅晶片。该方法还包括将SOI晶片耦合到体硅晶片的顶表面，使体硅晶片的背表面变薄，将多个集成电路管芯耦合到体硅晶片的背面，以及去除SOI晶片从体硅晶片的顶表面。

5. 发明申请

US20080242979A1 Combined X-ray detector and ultrasound imager 审中-公开
标题翻译：组合X射线探测器和超声波成像仪
公开(公告)号：US20080242979A1
公开(公告)日：2008-10-02
申请号：US11731327
申请日：2007-03-30
申请人： Rayette Ann Fisher , Kai Erik Thomenius , Charles Steven Korman
发明人： Rayette Ann Fisher , Kai Erik Thomenius , Charles Steven Korman
IPC分类号： A61B6/00
CPC分类号： A61B6/4233 , A61B5/0091 , A61B5/0536 , A61B6/4417 , A61B6/4488 , A61B6/502 , A61B6/5247 , A61B8/0825 , A61B8/4416
摘要： An imaging system is disclosed that includes a first imaging panel and a second imaging panel disposed about an imaging volume. The imaging panels may be configured to image the entire imaging volume and may include panels using any form of acoustic or electromagnetic energy such as ultrasound panels, optical panels, electrical impedance panels, field emitter/x-ray detector panels, or a combination thereof. In one embodiment, a first group of sensors are included in a 2D matrix of sensors configured to transmit ultrasound through the imaging volume to a second group of sensors included in a second 2D matrix of sensors and vice versa. In a second embodiment the system may further include a second imaging system having a transmitter, a receiver, or both, disposed adjacent the first imaging panel, the second imaging panel, or both. A third embodiment may include at least one additional imaging panel.
摘要翻译：公开了一种成像系统，其包括围绕成像体积设置的第一成像面板和第二成像面板。成像面板可以被配置成对整个成像体积进行成像，并且可以包括使用任何形式的声学或电磁能量的面板，例如超声波面板，光学面板，电阻抗面板，场发射器/ X射线检测器面板或其组合。在一个实施例中，第一组传感器被包括在传感器的2D矩阵中，所述传感器被配置为将成像体积的超声波传输到包含在第二2D传感器矩阵中的第二组传感器，反之亦然。在第二实施例中，系统还可以包括具有邻近第一成像面板，第二成像面板或两者设置的发射器，接收器或两者的第二成像系统。第三实施例可以包括至少一个附加成像面板。

6. 发明授权

US07353056B2 Optimized switching configurations for reconfigurable arrays of sensor elements 失效
标题翻译：用于可重构阵列传感器元件的优化开关配置
公开(公告)号：US07353056B2
公开(公告)日：2008-04-01
申请号：US10978175
申请日：2004-10-29
申请人： Christopher Robert Hazard , Robert Gideon Wodnicki , Rayette Ann Fisher , Kai E. Thomenius , Lowell Scott Smith , David Martin Mills
发明人： Christopher Robert Hazard , Robert Gideon Wodnicki , Rayette Ann Fisher , Kai E. Thomenius , Lowell Scott Smith , David Martin Mills
IPC分类号： A61B5/05 , A61B8/00
CPC分类号： G10K11/34 , A61B2562/028 , B06B1/0292 , G01S7/52046 , G01S15/8925
摘要： The reconfigurable ultrasound array disclosed herein is one that allows groups of subelements to be connected together dynamically so that the shape of the resulting element can be made to match the shape of the wave front. This can lead to improved performance and/or reduced channel count. Reconfigurability can be achieved using a switching network. A methodology and an algorithm are disclosed that allows the performance of this switching network to be improved by properly choosing the configuration of the switching network.
摘要翻译：本文公开的可重构超声波阵列是允许一组子元件动态地连接在一起的结构，使得所得元件的形状可以与波前的形状相匹配。这可以导致改进的性能和/或减少的通道数。可以使用交换网络实现可重构性。公开了一种通过适当选择交换网络的配置来改善该交换网络的性能的方法和算法。

7. 发明授权

US5889373A Fluorescent lamp ballast with current feedback using a dual-function magnetic device 失效
标题翻译：使用双功能磁性装置的电流反馈的荧光灯镇流器
公开(公告)号：US5889373A
公开(公告)日：1999-03-30
申请号：US774544
申请日：1996-12-30
申请人： Rayette Ann Fisher , David Joseph Kachmarik , William Newell Schultz , Robert James Thomas
发明人： Rayette Ann Fisher , David Joseph Kachmarik , William Newell Schultz , Robert James Thomas
IPC分类号： H05B41/282 , H05B37/02
CPC分类号： H05B41/2827 , Y02B20/185
摘要： A fluorescent lamp ballast utilizes a single a transformer for providing both tank inductance and current mode feedback to the ballast driver circuitry. The transformer has an "EE" core with inductor windings on the center legs and gate windings on one of the outer legs. The center leg is gapped to avoid magnetic core saturation and to adjust inductance to a desired value. Coupling can be adjusted further by gapping one or the other of the outer legs.
摘要翻译：荧光灯镇流器利用单个变压器将镇流器电感和电流模式反馈提供给镇流器驱动器电路。变压器具有一个“EE”磁芯，其中一个外部支脚上的中心支脚和栅极绕组具有电感绕组。中心腿被间隙以避免磁芯饱和，并将电感调整到所需的值。可以通过间隔一个或另一个外腿来进一步调整联接。

8. 发明授权

US08345508B2 Large area modular sensor array assembly and method for making the same 有权
标题翻译：大面积模块化传感器阵列组件及其制作方法
公开(公告)号：US08345508B2
公开(公告)日：2013-01-01
申请号：US12714239
申请日：2010-02-26
申请人： Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Shubhra Bansal , Albert Taesung Byun
发明人： Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Shubhra Bansal , Albert Taesung Byun
IPC分类号： G03B42/06
CPC分类号： B23K1/0016 , B06B1/0629
摘要： A modular and tileable sensor array with routing in the interposer carrying the signals from the sensors to the integrated circuits. In one embodiment a large area modular sensor array assembly includes one or more tileable modules coupled together. The tileable modules have a plurality of transducer cells forming a sensor, an interposer coupled on a first side to the plurality of transducer cells by a plurality, one or more integrated circuits coupled to a second side of the interposer, wherein the interposer is configured to form the connection of at least some of the transducer cells to the integrated circuits, and one or more input/output connectors coupled to the interposer and providing an external interface.
摘要翻译：一种模块化且可分散的传感器阵列，其具有在插入器中的路由，其将来自传感器的信号传送到集成电路。在一个实施例中，大面积模块化传感器阵列组件包括耦合在一起的一个或多个可瓦片模块。可拼接模块具有形成传感器的多个换能器单元，通过耦合到中介层的第二侧的多个一个或多个集成电路在第一侧耦合到多个换能器单元的插入件，其中插入件配置成形成至少一些传感器单元与集成电路的连接，以及耦合到插入器并提供外部接口的一个或多个输入/输出连接器。

9. 发明授权

US07687976B2 Ultrasound imaging system 有权
标题翻译：超声成像系统
公开(公告)号：US07687976B2
公开(公告)日：2010-03-30
申请号：US11669235
申请日：2007-01-31
申请人： Bruno Hans Haider , Kjell Kristoffersen , Rayette Ann Fisher , Thomas Halvorsrod , Robert Wodnicki
发明人： Bruno Hans Haider , Kjell Kristoffersen , Rayette Ann Fisher , Thomas Halvorsrod , Robert Wodnicki
IPC分类号： H01L41/09 , G01N24/00 , A61B8/14
CPC分类号： A61B8/00 , A61B1/0005 , B06B1/0622 , G01S7/5208 , G01S15/8925 , G01S15/8927 , G03B42/06
摘要： An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.
摘要翻译：超声成像系统（100）。示例性系统（100）包括形成在子阵列（140）中的多个换能器元件（136）和多个子阵列电路单元（160'），每个电路单元（160'）连接到子阵列换能器元件（136）。每个单元（160'）中的电路包括多个集成电路（330,340,350），其中至少第一（340）个集成电路以堆叠配置形成在第二（330）集成电路上。在示例图中，第一集成电路（340）包括沿着其表面（342）的第一多个第一接合焊盘（345），并且第二集成电路（330）包括沿着第一多个第二接合焊盘其具有在成对的第一和第二接合焊盘之间延伸的接合线（344），以在它们之间提供输入/输出信号连接。

10. 发明申请

US20080134793A1 Modular sensor assembly and methods of fabricating the same 有权
标题翻译：模块化传感器组件及其制造方法
公开(公告)号：US20080134793A1
公开(公告)日：2008-06-12
申请号：US11636822
申请日：2006-12-11
申请人： Charles Gerard Woychik , Rayette Ann Fisher , David Martin Mills , Scott Cogan , David Richard Esler , Robert Gideon Wodnicki , Jeffrey Scott Erlbaum
发明人： Charles Gerard Woychik , Rayette Ann Fisher , David Martin Mills , Scott Cogan , David Richard Esler , Robert Gideon Wodnicki , Jeffrey Scott Erlbaum
IPC分类号： G01D5/12 , G01H11/00 , G01H11/08 , G01N29/22 , G01R3/00
CPC分类号： G01D11/245 , B06B1/0292 , B06B1/0629 , G01N29/2437 , G01N2291/106 , H01L2224/05001 , H01L2224/05009 , H01L2224/0557 , H01L2224/05571 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/16145 , H01L2224/48091 , H01L2224/73257 , H01L2924/00014 , H01L2924/01322 , Y10T29/49004 , Y10T29/49007 , H01L2924/00 , H01L2224/05099
摘要： A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.
摘要翻译：提供了模块化传感器组件和制造模块化传感器组件的方法。模块化传感器组件包括以堆叠配置耦合到电子阵列的传感器阵列。传感器阵列包括多个传感器模块，每个传感器模块包括多个传感器子阵列。电子阵列包括多个集成电路模块，每个集成电路模块包括多个集成电路芯片。传感器模块可以通过倒装芯片技术耦合到电子模块。

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