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    • 7. 发明申请
    • METHOD OF BONDING
    • 结合方法
    • US20100236707A1
    • 2010-09-23
    • US12399146
    • 2007-07-09
    • Katia StuderTunja JungKurt Dietliker
    • Katia StuderTunja JungKurt Dietliker
    • B29C65/14C07C221/00
    • C08G18/3876C08G18/10C08G18/1841C08G18/2063C09J5/00C09J175/04C09J2475/00C08G18/40C08G18/6618
    • The invention relates to a first method of bonding a first substrate to a second substrate, comprising the steps of a) applying an UV-curable adhesive resin composition comprising a photolatent base to at least one transparent surface of at least one of said first and second substrates, b) bringing said first and second substrates together with said adhesive composition there between, c) exposing said adhesive composition to actinic radiation to effect curing or alternatively to a second method of bonding a first substrate to a second substrate, comprising the steps of a) applying a UV-curable adhesive resin composition comprising a photolatent base to one surface, b) exposing said adhesive composition to actinic radiation to effect curing, c) bringing said first and second substrates together with said adhesive composition there between.
    • 本发明涉及将第一衬底粘合到第二衬底的第一种方法,包括以下步骤:a)将包含光致变色基底的UV可固化粘合剂树脂组合物施加到所述第一和第二衬底中的至少一个的至少一个透明表面上 衬底,b)将所述第一和第二衬底与其间的所述粘合剂组合物一起,c)将所述粘合剂组合物暴露于光化辐射以实现固化,或者替代地将第一衬底结合到第二衬底的第二种方法,包括以下步骤: a)将包含光致变色基底的UV可固化粘合剂树脂组合物施加到一个表面上,b)将所述粘合剂组合物暴露于光化辐射以进行固化,c)将所述第一和第二基底与其间的所述粘合剂组合物一起使用。