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1. 发明公开

KR20090028192A THE ROTATING DEVICE OF TRAY OF THE TEST KIT FOR SEMICONDUCTOR PACKAGE 无效
标题翻译：用于半导体封装的测试套件的转盘旋转装置
公开(公告)号：KR20090028192A
公开(公告)日：2009-03-18
申请号：KR20070093605
申请日：2007-09-14
申请人： RTS CO LTD
发明人： SUNG KYUNG
IPC分类号： H01L21/66 , H01L21/02
摘要： A rotating device of tray of the test kit for semiconductor package is provided to easily separate the empty tray from the semiconductor package-loaded tray and to improve the efficiency of process. The rotation apparatus is installed at the guide frame(110). The movable plate(120) is moved along the guide frame. The clamp section(140) laminates the package-accepted tray and the empty tray and grips. The rotating unit(130) is installed between the clamp section and the movable plate and rotates the clamp section. The holding section(150) is installed at the lower part of clamp section bottom. The holding section separates the empty tray from the accepted tray.
摘要翻译：提供用于半导体封装的测试套件的托盘的旋转装置，以容易地将空托盘与半导体封装装载托盘分开并提高加工效率。旋转装置安装在引导框架（110）上。可移动板（120）沿着引导框架移动。夹紧部分（140）将包装接受的托盘和空的托盘叠合并夹紧。旋转单元（130）安装在夹持部和可动板之间，并使夹持部旋转。保持部（150）安装在夹持部底部的下部。保持部分将空托盘与可接受的托盘分开。

2. 发明公开

KR20090028191A THE SEMICONDUCTOR INSPECTION APPARATUS 无效
标题翻译：半导体检测装置
公开(公告)号：KR20090028191A
公开(公告)日：2009-03-18
申请号：KR20070093604
申请日：2007-09-14
申请人： RTS CO LTD
发明人： SUNG KYUNG
IPC分类号： H01L21/66
CPC分类号： G01R31/2896 , G01R31/2867
摘要： A test kit for semiconductor package is provided to determine whether each chip is defective or not when the transferring the semiconductor chip and to accurately select the normal chip and bad chip. The transport unit(200) transfers a plurality of trays(3). The rigid frame(300) is installed at the upside of the transport unit and intersects the transport unit. The sensor unit(400) is moved along the rigid frame. The sensor unit successively measures each package of the transferred tray. The sorter(600) selects each package according to the measured value of the sensor unit and receives. The selected each tray is laminated in the mounting portion(700).
摘要翻译：提供用于半导体封装的测试套件，以便在传输半导体芯片时准确选择正常芯片和坏芯片来确定每个芯片是否有故障。传送单元（200）传送多个托盘（3）。刚性框架（300）安装在运输单元的上侧并与运输单元相交。传感器单元（400）沿着刚性框架移动。传感器单元连续测量传送托盘的每个包装。分拣机（600）根据传感器单元的测量值选择每个包装并接收。所选择的每个托盘层压在安装部分（700）中。

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