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1. 发明公开

EP3008553A2 KEYBOARD BACKLIGHTING WITH DEPOSITED LIGHT-GENERATING SOURCES 有权转让
标题翻译：键盘背光灯沉积生产源
公开(公告)号：EP3008553A2
公开(公告)日：2016-04-20
申请号：EP14811725.2
申请日：2014-06-11
申请人： Rohinni, Inc. , Peterson, Cody G. , Huska, Andy , Christie, Kasey , Adams, Clint
发明人： PETERSON, Cody , HUSKA, Andy , CHRISTIE, Kasey , ADAMS, Clint
IPC分类号： G06F3/02 , F21V8/00
CPC分类号： H01H13/83 , G02B6/0068 , G02B6/0073 , G06F1/1662 , G06F3/0202 , H01H3/125 , H01H11/00 , H01H13/88 , H01H2219/016 , H01H2219/037 , H01H2219/044 , H01H2219/048 , H01H2219/056 , H01H2219/062 , H01H2229/002 , Y10T29/49105
摘要： Techniques and devices provide backlighting for keys of a keyboard or keypad.

2. 发明申请

WO2014201187A2 KEYBOARD BACKLIGHTING WITH DEPOSITED LIGHT-GENERATING SOURCES 审中-公开
标题翻译：键盘背光，具有沉积的光生成源
公开(公告)号：WO2014201187A2
公开(公告)日：2014-12-18
申请号：PCT/US2014/042018
申请日：2014-06-11
申请人： ROHINNI, INC. , PETERSON, Cody , HUSKA, Andy , CHRISTIE, Kasey , ADAMS, Clint
发明人： PETERSON, Cody , HUSKA, Andy , CHRISTIE, Kasey , ADAMS, Clint
IPC分类号： G06F3/02
CPC分类号： H01H13/83 , G02B6/0068 , G02B6/0073 , G06F1/1662 , G06F3/0202 , H01H3/125 , H01H11/00 , H01H13/88 , H01H2219/016 , H01H2219/037 , H01H2219/044 , H01H2219/048 , H01H2219/056 , H01H2219/062 , H01H2229/002 , Y10T29/49105
摘要： Techniques and devices provide backlighting for keys of a keyboard or keypad.
摘要翻译：技术和设备为键盘或键盘的键提供背光。

3. 发明申请

WO2015188172A2 MANUFACTURE OF CIRCUIT ASSEMBLY WITH UNPACKAGED SEMICONDUCTOR DEVICES 审中-公开
标题翻译：电路组件与未封装的半导体器件的制造
公开(公告)号：WO2015188172A2
公开(公告)日：2015-12-10
申请号：PCT/US2015/034596
申请日：2015-06-06
申请人： ROHINNI, LLC , HUSKA, Andrew , PETERSON, Cody , CHRISTIE, Kasey , ADAMS, Clint , OZIAS, Orin
发明人： HUSKA, Andrew , PETERSON, Cody , CHRISTIE, Kasey , ADAMS, Clint , OZIAS, Orin
CPC分类号： H01L21/50 , H01L21/561 , H01L21/6835 , H01L21/6836 , H01L23/3121 , H01L24/24 , H01L24/76 , H01L24/82 , H01L25/03 , H01L2221/68327 , H01L2221/68354
摘要： Described herein are techniques related to the efficient and effective manufacture electronic products (e.g., mobile devices, computers, etc.) that incorporate circuitry with semiconductor devices. As described herein, a new manufacturing approach incorporates unpackaged semiconductor devices (i.e., dies) into the circuitry of electronic products during manufacturing. This is done using a direct carrier-to-circuit die transfer approach. In addition, the dies and/or their related circuitry are packaged in-place (i.e., "in-situ packaging"). This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要翻译：这里描述的是涉及具有半导体器件的电路的有效和有效的制造电子产品（例如，移动设备，计算机等）的技术。如本文所述，新的制造方法在制造期间将未封装的半导体器件（即，裸片）合并到电子产品的电路中。这是使用直接的载波到电路模转移方法完成的。此外，将模具和/或其相关电路封装就地（即，“原位包装”）。提交本摘要的理解是，它不会用于解释或限制权利要求的范围或含义。

4. 发明公开

EP3152781A2 MANUFACTURE OF CIRCUIT ASSEMBLY WITH UNPACKAGED SEMICONDUCTOR DEVICES 审中-公开
标题翻译： HERSTELLUNG EINER SCHALTUNGSANORDNUNG MITGEHÄUSELOSENHALBLEITERBAUELEMENTEN
公开(公告)号：EP3152781A2
公开(公告)日：2017-04-12
申请号：EP15803526.1
申请日：2015-06-06
申请人： Rohinni, LLC , Huska, Andrew P. , Peterson, Cody G. , Christie, Kasey , Adams, Clinton , Ozias, Orin
发明人： HUSKA, Andrew , PETERSON, Cody , CHRISTIE, Kasey , ADAMS, Clint , OZIAS, Orin
IPC分类号： H01L21/50 , H01L25/03
CPC分类号： H01L21/50 , H01L21/561 , H01L21/6835 , H01L21/6836 , H01L23/3121 , H01L24/24 , H01L24/76 , H01L24/82 , H01L25/03 , H01L2221/68327 , H01L2221/68354
摘要： An apparatus includes a carrier-to-circuit transfer mechanism that is configured to obtain one or more unpackaged semiconductor devices on a carrier substratum and directly transfer the one or more unpackaged semiconductor devices from the carrier substratum to a circuit assembly. The apparatus further includes an in-situ packager that is configured to in-situ package the one or more transferred devices by interconnecting each semiconductor device of the one or more transferred devices to conductive links of the circuit assembly and applying a coating material to the one or more transferred devices.
摘要翻译：这里描述了与集成有半导体器件的电路的有效和有效的制造电子产品（例如，移动设备，计算机等）相关的技术。如本文所述，新的制造方法在制造期间将未封装的半导体器件（即，裸片）合并到电子产品的电路中。这是使用直接的载波到电路模转移方法完成的。此外，将模具和/或其相关电路封装就地（即，“原位包装”）。提交本摘要的理解是，它不会用于解释或限制权利要求的范围或含义。

5. 发明申请

WO2011093928A1 CUSHIONING AND SHOCK ABSORBING MIDSOLE 审中-公开
标题翻译：冲击和冲击吸收中心
公开(公告)号：WO2011093928A1
公开(公告)日：2011-08-04
申请号：PCT/US2010/050366
申请日：2010-09-27
申请人： BROWN SHOE COMPANY, INC. , HANEBRINK, Brian , PETERSON, Cody
发明人： HANEBRINK, Brian , PETERSON, Cody
IPC分类号： A43B13/18
CPC分类号： A43B13/127 , A43B7/144 , A43B21/265
摘要： A midsole adapted for attachment to a shoe having multiple layers of varying materials each having a different hardness level. More particularly, the present midsole includes a top, middle and bottom layer wherein all three layers of material have a different hardness range and wherein at least one of the layers is made from thermoplastic rubber (TPR). In one embodiment, the thermoplastic rubber (TPR) layer lies between the top and bottom layers and in another embodiment, the thermoplastic rubber (TPR) layer is the bottom layer. The thermoplastic rubber (TPR) layer may also have a length shorter than the other two layers forming the midsole.
摘要翻译：适合于连接到具有多层变化材料的鞋的中底，每层具有不同的硬度水平。更具体地，本发明的中底包括顶层，中层和底层，其中所有三层材料具有不同的硬度范围，并且其中至少一层由热塑性橡胶（TPR）制成。在一个实施方案中，热塑性橡胶（TPR）层位于顶层和底层之间，在另一个实施方案中，热塑性橡胶（TPR）层为底层。热塑性橡胶（TPR）层也可以具有比形成中底的其它两层短的长度。

6. 发明申请

WO2012166857A1 FOOTWEAR PROMOTING NATURAL MOTION 审中-公开
标题翻译：足球促进自然运动
公开(公告)号：WO2012166857A1
公开(公告)日：2012-12-06
申请号：PCT/US2012/040110
申请日：2012-05-31
申请人： BROWN SHOE COMPANY, INC. , VATTES, David, L. , PETERSON, Cody , SWEGLE, Jonathan
发明人： VATTES, David, L. , PETERSON, Cody , SWEGLE, Jonathan
IPC分类号： A43B7/14
CPC分类号： A43B7/144 , A43B7/141 , A43B7/142 , A43B13/38 , A43B13/41 , A43B23/22
摘要： A shoe is designed to enable unhindered natural foot motion between the foot and the ground. The shoe is constructed with a cupped heel, a contoured arch, a radiused forepart and neutral heel/forefoot position to create a foot bed that anatomically cradles a wearer's foot. A soft, flexible strobel stitched insole is added, which utilizes encapsulated high resiliency foam. The outsole is sculpted to have rounded natural edges and an anatomically correct flex location toward the forefoot of the shoe where softer, more flexible materials are used. The outsole is further designed with harder, protective materials strategically placed in high ground-contact areas to deliver protection and support. An optional midfoot support element may be positioned between the insole and outsole to control torsional stiffness. Upper materials are selected to minimize restriction of movement and promote breathability.
摘要翻译：鞋子设计成能够在脚和地面之间实现无阻碍的自然脚运动。鞋子采用杯形脚跟，轮廓拱形，圆角前端和中性脚跟/前脚掌位置，以形成解剖上支撑佩戴者脚部的足部床。添加了柔软灵活的缝合鞋垫，其使用封装的高弹性泡沫。外底被雕刻成具有圆形的天然边缘和解剖学上正确的弯曲位置朝向鞋前脚掌，其中使用更柔软，更柔性的材料。外底进一步设计有更坚固的保护材料，战略性地放置在高地面接触区域，以提供保护和支持。可选的中足支撑元件可以位于鞋垫和外底之间以控制扭转刚度。选择上部材料以最小化运动的限制并促进透气性。

7. 发明申请

WO2016154061A1 METHOD FOR TRANSFER OF SEMICONDUCTOR DEVICES 审中-公开
标题翻译：半导体器件传输方法
公开(公告)号：WO2016154061A1
公开(公告)日：2016-09-29
申请号：PCT/US2016/023280
申请日：2016-03-18
申请人： ROHINNI, INC.
发明人： HUSKA, Andrew , CHRISTIE, Kasey , PETERSON, Cody , OZIAS, Orin , ADAMS, Clinton , KUPCOW, Sean
IPC分类号： H01L21/50 , H01L21/67 , H05K3/00
CPC分类号： H01L25/0753 , G02F1/133603 , G02F1/133605 , G02F1/133606 , G02F2001/133612 , H01L21/4853 , H01L21/67132 , H01L21/67144 , H01L21/67196 , H01L21/67265 , H01L21/67715 , H01L21/67778 , H01L21/681 , H01L21/6836 , H01L21/68742 , H01L22/12 , H01L22/20 , H01L23/53242 , H01L23/544 , H01L24/83 , H01L24/89 , H01L33/62 , H01L2221/68322 , H01L2221/68327 , H01L2221/68354 , H01L2221/68363 , H01L2221/68381 , H01L2223/54413 , H01L2223/54426 , H01L2223/54433 , H01L2223/54486 , H01L2224/83224 , H01L2924/12041 , H01L2924/405 , H01L2933/0066
摘要： A method of transferring semiconductor devices to a product substrate includes positioning a surface of the product substrate to face a first surface of a semiconductor wafer having the semiconductor devices thereon, and actuating a transfer mechanism to cause the transfer mechanism to engage a second surface of the semiconductor wafer. The second surface of the semiconductor wafer is opposite the first surface of the semiconductor wafer. Actuating the transfer mechanism includes causing a pin to thrust against a position on the second surface of the semiconductor wafer corresponding to a position of a particular semiconductor device located on the first surface of the semiconductor wafer, and retracting the pin to a rest position. The method further includes detaching the particular semiconductor device from the second surface of the semiconductor wafer, and attaching a particular semiconductor device to the product substrate.
摘要翻译：将半导体器件转移到产品基板的方法包括将产品基板的表面定位在其上具有半导体器件的半导体晶片的第一表面上，并且致动传送机构以使传送机构接合第二表面半导体晶片。半导体晶片的第二表面与半导体晶片的第一表面相对。驱动转印机构包括使销钉推到半导体晶片的第二表面上的位置上，该位置对应于位于半导体晶片的第一表面上的特定半导体器件的位置，并将销收回静止位置。该方法还包括从半导体晶片的第二表面分离特定半导体器件，并将特定的半导体器件附接到产品基板。

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