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1. 发明申请

WO2003032377A1 VERFAHREN ZUR VERBINDUNG EINER SILIZIUMPLATTE MIT EINER WEITEREN PLATTE 审中-公开
标题翻译：方法用于连接硅板另一块板
公开(公告)号：WO2003032377A1
公开(公告)日：2003-04-17
申请号：PCT/DE2002/003282
申请日：2002-09-05
申请人： ROBERT BOSCH GMBH , REICHENBACH, Frank , FISCHER, Frank , HAUSNER, Ralf , HAAG, Frieder , GRAF, Eckhard , LUTZ, Markus
发明人： REICHENBACH, Frank , FISCHER, Frank , HAUSNER, Ralf , HAAG, Frieder , GRAF, Eckhard , LUTZ, Markus
IPC分类号： H01L21/20
CPC分类号： B29C65/1635 , B29C65/1612 , B29C65/1683 , B29C65/608 , B29C66/1122 , B29C66/12421 , B29C66/472 , B29C66/53461 , B29C66/71 , B29C66/712 , B29C66/7392 , B29K2083/00 , B29L2031/756 , B81C1/00269 , B81C1/00357 , B81C2201/019 , B81C2203/019 , H01L21/2007 , H01L21/76251 , H01L24/83 , H01L2224/80224 , H01L2224/80365 , H01L2224/80379 , H01L2224/804 , H01L2224/80488 , H01L2224/83224 , H01L2224/834 , H01L2224/83424 , H01L2224/83447 , H01L2224/83466 , H01L2224/83471 , H01L2224/83487 , H01L2224/8349 , H01L2224/83801 , H01L2924/01029 , H01L2924/09701 , H01L2924/12042 , H01L2924/01014 , H01L2924/00014 , H01L2924/00
摘要： Es wird ein Verfahren zur Verbindung einer Siliziumplatte (1) mit einer weiteren Platte (2) vorgeschlagen, wobei durch die Siliziumplatte (1) hindurch ein Laserstrahl auf die weitere Platte (2) gerichtet wird. Die Wellenlänge des Laserstrahles ist dabei so ausgewählt, dass nur eine vernachlässigbar geringe Energiemenge in der Siliziumplatte (1) absorbiert wird. Durch die Energie des Laserstrahles wird ein stark absorbierendes Material aufgeschmolzen, welches dann eine Verbindung zwischen der Siliziumplatte (1) und der weiteren Platte (2) herstellt.
摘要翻译：建议用另一种板（2）接合的硅板（1），通过硅板（1），通过该激光束到另一个板（2）被引导的方法。被选择的激光束的波长，使得在硅板（1）的能量只有可忽略的量被吸收。通过激光束的能量的高吸收性材料被熔化，然后建立硅板（1）和所述另外的板（2）之间的连接。

2. 发明申请

WO2004070338A1 MIKROMECHANISCHES BAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG 审中-公开
标题翻译：微机械部件与方法研究
公开(公告)号：WO2004070338A1
公开(公告)日：2004-08-19
申请号：PCT/DE2003/003151
申请日：2003-09-23
申请人： ROBERT BOSCH GMBH , LUTZ, Markus , FISCHER, Frank
发明人： LUTZ, Markus , FISCHER, Frank
IPC分类号： G01L9/00
CPC分类号： G01L9/0042 , B81B3/0081 , B81B2201/0264 , B81B2201/032 , B81B2203/0127 , B81B2203/0384 , B81C2201/0108
摘要： Auf einem Substrat (1) ist eine Epitaxieschicht (3, 5) mit nebeneinander aufgewachsenem mono- und polykristallinen Silizium abgeschieden, wobei durch Ätzung ein Bereich (5, 6) als vertikal auslenkbare polykristalline Membran, insbesondere für einen Drucksensor, freigelegt ist. Die Poly/Mono Übergangsbereiche zu beiden Seiten der Membran weisen jeweils ein schräges Profil auf, derart, dass sich das monokristalline Silizium in Form eines Überhangs (6) oberhalb des polykristallinen Siliziums in den Membran-Bereich (5, 6) hinein erstreckt. Im Überhang (6) sind Piezoelemente (10) implantiert.
摘要翻译：在基板（1）是外延层（3，5）与相邻的生长单晶硅和多晶硅沉积，通过蚀刻的区域（5,6），其为垂直偏转的多晶膜，特别是用于一个压力传感器被暴露。在隔膜两侧的聚/单声道过渡区域各自具有倾斜轮廓，使得在膜区域中的多晶硅上方的突出端（6）的形式的单晶硅（5,6）延伸。在突出端（6）的压电元件（10）被注入。

3. 发明申请

WO2007143058A3 METHODS FOR TRAPPING CHARGE IN A MICROELECTROMECHANICAL SYSTEM AND MICROELECTROMECHANICAL SYSTEM EMPLOYING SAME 审中-公开
公开(公告)号：WO2007143058A3
公开(公告)日：2007-12-13
申请号：PCT/US2007/012878
申请日：2007-05-31
申请人： ROBERT BOSCH GMBH , LUTZ, Markus , PARTRIDGE, Aaron , STARK, Brian, H.
发明人： LUTZ, Markus , PARTRIDGE, Aaron , STARK, Brian, H.
IPC分类号： H01L21/00
摘要： Many inventions are disclosed. Some aspects are directed to MEMS, and/or methods for use with and/or for fabricating MEMS, that supply, store, and/or trap charge on a mechanical structure disposed in a chamber. Various structures may be disposed in the chamber and employed in supplying, storing and/or trapping charge on the mechanical structure. In some aspects, a breakable link, a thermionic electron source and/or a movable mechanical structure are employed. The breakable link may comprise a fuse. In one embodiment, the movable mechanical structure is driven to resonate. In some aspects, the electrical charge enables a transducer to convert vibrational energy to electrical energy, which may be used to power circuit(s), device(s) and/or other purpose(s). In some aspects, the electrical charge is employed in changing the resonant frequency of a mechanical structure and/or generating an electrostatic force, which may be repulsive.

4. 发明申请

WO2007046869A2 IN-PLANE MECHANICALLY COUPLED MICROELECTROMECHANICAL TUNING FORK RESONATORS 审中-公开
标题翻译：平面机械耦合微电子机械调谐器谐振器
公开(公告)号：WO2007046869A2
公开(公告)日：2007-04-26
申请号：PCT/US2006/019531
申请日：2006-05-19
申请人： ROBERT BOSCH GMBH , THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY , PAN, Zhiyu , CHANDLER, Rob, Norris , LUTZ, Markus , PARTRIDGE, Aaron , MATERNA, Volker , YAMA, Gary , FREY, Wilhelm
发明人： PAN, Zhiyu , CHANDLER, Rob, Norris , LUTZ, Markus , PARTRIDGE, Aaron , MATERNA, Volker , YAMA, Gary , FREY, Wilhelm
CPC分类号： H03H9/505 , H03H9/0023 , H03H9/02338 , H03H9/2468 , H03H2009/02496
摘要： There are many inventions described and illustrated herein, as well as many aspects and embodiments of those inventions. In one aspect, the present invention is directed to a resonator architecture including a plurality of in-plane vibration microelectromechanical resonators (for example, 2 or 4 resonators) that are mechanically coupled to provide, for example, a differential signal output. In one embodiment, the present invention includes four commonly shaped microelectromechanical tuning fork resonators (for example, tuning fork resonators having two or more rectangular-shaped or square-shaped tines). Each resonator is mechanically coupled to another resonator of the architecture. For example, each resonator of the architecture is mechanically coupled to another one of the resonators on one side or a corner of one of the sides. In this way, all of the resonators, when induced, vibrate at the same frequency.
摘要翻译：这里描述和示出了许多发明，以及这些发明的许多方面和实施例。在一个方面，本发明涉及一种包括机械耦合以提供例如差分信号输出的多个平面内振动微机电谐振器（例如，2或4个谐振器）的谐振器结构。在一个实施例中，本发明包括四个通常形状的微机电音叉谐振器（例如，具有两个或更多个矩形或正方形形状的叉的音叉谐振器）。每个谐振器机械耦合到该架构的另一谐振器。例如，该架构的每个谐振器在其中一个侧面的一侧或拐角上机械耦合到另一个谐振器。以这种方式，所有谐振器在被感应时以相同的频率振动。

5. 发明申请

WO2007005132A1 MEMS RESONATOR ARRAY STRUCTURE AND METHOD OF OPERATING AND USING SAME 审中-公开
标题翻译： MEMS谐振器阵列结构及其操作和使用方法
公开(公告)号：WO2007005132A1
公开(公告)日：2007-01-11
申请号：PCT/US2006/019628
申请日：2006-05-19
申请人： ROBERT BOSCH GMBH , LUTZ, Markus , PARTRIDGE, Aaron , PAN, Zhiyu
发明人： LUTZ, Markus , PARTRIDGE, Aaron , PAN, Zhiyu
IPC分类号： H03H9/02 , H03H9/24 , H03H9/46 , H03H9/50
CPC分类号： H03H9/2405 , H03H3/0076 , H03H9/02338 , H03H9/02448 , H03H9/2431 , H03H9/462 , H03H9/505 , H03H2009/02354 , H03H2009/0244 , H03H2009/02496 , H03H2009/02503 , H03H2009/02511 , H03H2009/02527
摘要： Mechanically coupled MEMS resonators 102 a, b, c, d are arranged in an N x M array. Each resonator includes straight elongated beam sections 106 a, b, c, d. Each elongated beam section is connected to another elongated beam section at a distal end via a curved sections 108 a, b, c, d thereby forming a geometric shape (e.g., rounded square). Each resonator is mechanically coupled to at least one other adjacent resonator of the array via a resonator coupling section 104, which may be disposed between elongated beam sections of adjacent resonators. The resonators, oscillate at the same frequency in a combined elongating (or breathing) mode and bending mode. The resonators of the array may include nodal points 114 (i.e., portions of the resonator that are stationary, during oscillation of the resonator) in the curved sections. The nodal points are preferable locations to anchor the resonators.
摘要翻译：机械耦合MEMS谐振器102a，b，c，d以N×M阵列排列。每个谐振器包括直的细长梁段106a，b，c，d。每个细长梁部分经由弯曲部分108a，b，c，d连接到远端处的另一个细长梁部分，从而形成几何形状（例如，圆角正方形）。每个谐振器经由谐振器耦合部分104机械地耦合到阵列的至少一个其它相邻的谐振器，谐振器耦合部分104可以设置在相邻谐振器的细长的波束部分之间。谐振器以组合的延长（或呼吸）模式和弯曲模式以相同的频率振荡。阵列的谐振器可以包括在弯曲部分中的节点114（即谐振器的在谐振器的振荡期间是静止的部分）。节点是锚定谐振器的优选位置。

6. 发明申请

WO2005045885A2 ANTI-STICTION TECHNIQUE FOR THIN FILM AND WAFER-BONDED ENCAPSULATED MICROELECTROMECHANICAL SYSTEMS 审中-公开
标题翻译：薄膜和波纹粘合微电子系统的防伪技术
公开(公告)号：WO2005045885A2
公开(公告)日：2005-05-19
申请号：PCT/US2004/018892
申请日：2004-06-15
申请人： ROBERT BOSCH GMBH , LUTZ, Markus , PARTRIDGE, Aaron
发明人： LUTZ, Markus , PARTRIDGE, Aaron
IPC分类号： H01L
CPC分类号： B81C1/0096 , B81B3/0005 , B82Y10/00 , B82Y30/00
摘要： There are many inventions described and illustrated herein. In one aspect, present invention is directed to a thin film or wafer encapsulated MEMS, and technique of fabricating or manufacturing a thin film or wafer encapsulated MEMS employing the antistiction techniques of the present invention. In one embodiment, after encapsulation of the MEMS, an anti-stiction channel is formed thereby providing "access" to the chamber containing some or all of the active members or electrodes of the mechanical structures of the MEMS. Thereafter, an anti-stiction fluid (for example, gas or gas-vapor) is introduced into the chamber via the anti-stiction channel. The anti-stiction fluid may deposit on one, some or all of the active members or electrodes of the mechanical structures thereby providing an anti-stiction layer (for example, a monolayer coating or self-assembled monolayer) and/or out-gassing molecules on such members or electrodes. After introduction and/or application of the anti-stiction fluid, the anti-stiction channel may be sealed, capped, plugged and/or closed to define and control the mechanical damping environment within the chamber. In this regard, sealing, capping and/or closing the chamber establishes the environment within the chamber containing and/or housing the mechanical structures. This environment provides the predetermined, desired and/or selected mechanical damping of the mechanical structure as well as suitable hermeticity. The parameters (for example, pressure) of the final encapsulated fluid (for example, a gas or a gas vapor) in which the mechanical structures are to operate may be controlled, selected and/or designed to provide a desired and/or predetermined operating environment.
摘要翻译：这里描述和说明了许多发明。一方面，本发明涉及薄膜或晶片封装的MEMS，以及使用本发明的抗静电技术制造或制造薄膜或晶片封装的MEMS的技术。在一个实施例中，在MEMS的封装之后，形成抗静电通道，从而提供“接入”室，其包含MEMS的机械结构的一些或全部有源部件或电极。此后，抗静电液体（例如，气体或气体 - 蒸气）经由抗静电通道被引入腔室。抗静电液体可以沉积在机械结构的一个，一些或所有活性部件或电极上，从而提供抗静电层（例如，单层涂层或自组装单层）和/或排气分子在这些构件或电极上。在引入和/或施加抗静电流体之后，防静电通道可被密封，封盖，堵塞和/或关闭以限定和控制室内的机械阻尼环境。在这方面，腔室的密封，封盖和/或闭合在室内建立包含和/或容纳机械结构的环境。该环境提供机械结构的预定的，期望的和/或选择的机械阻尼以及合适的气密性。可以控制，选择和/或设计机械结构将要运行的最终封装流体（例如，气体或气体蒸气）的参数（例如压力），以提供期望的和/或预定的操作环境。

7. 发明申请

WO2002066929A1 DREHRATENSENSOR 审中-公开
标题翻译：旋转速率传感器
公开(公告)号：WO2002066929A1
公开(公告)日：2002-08-29
申请号：PCT/DE2002/000524
申请日：2002-02-14
申请人： ROBERT BOSCH GMBH , WILLIG, Rainer , THOMAE, Andreas , KUHLMANN, Burkhard , HAUER, Joerg , GOMEZ, Udo-Martin , GOETZ, Siegbert , DOERING, Christian , FEHRENBACH, Michael , BAUER, Wolfram , BISCHOF, Udo , NEUL, Reinhard , FUNK, Karsten , LUTZ, Markus , WUCHER, Gerhard , FRANZ, Jochen
发明人： WILLIG, Rainer , THOMAE, Andreas , KUHLMANN, Burkhard , HAUER, Joerg , GOMEZ, Udo-Martin , GOETZ, Siegbert , DOERING, Christian , FEHRENBACH, Michael , BAUER, Wolfram , BISCHOF, Udo , NEUL, Reinhard , FUNK, Karsten , LUTZ, Markus , WUCHER, Gerhard , FRANZ, Jochen
IPC分类号： G01C19/56
CPC分类号： G01C19/5747
摘要： Es wird ein Drehratensensor mit einem ersten und einem zweiten Coriolis-Elemente (100, 200) vorgeschlagen, die nebeneinander über einer Oberfläche (1) eines Substrats angeordnet sind. Die Coriolis-Elemente (100, 200) werden zu Schwingungen parallel zu einer ersten Achse Y angeregt. Durch eine Coriolis-Kraft werden die Coriolis-Elemente (100, 200) in einer zweiten Achse X, die senkrecht zu der ersten Achse Y ist, ausgelenkt. Die Schwingungen des ersten und zweiten Coriolis-Elementes (100, 200) erfolgen gegenphasig zueinander auf Bahnen, die ohne die Wirkung einer Coriolis-Kraft zwei zueinander parallele Geraden sind.
摘要翻译：还提出了具有第一和第二科里奥利元件被并排地布置在衬底上的一个表面（1）（100，200）的偏航率传感器。科里奥利元件（100，200）被激励振动平行于第一轴线Y. 由科里奥利力，科里奥利元件（100，200）在第二轴线X垂直于所述第一轴线Y偏转第一和第二科里奥利元件（100，200）的振动发生在相反的相位彼此上纤维网，其是两个相互平行的直线的情况下的科里奥利力的作用。

8. 发明申请

WO2002066928A1 DREHRATENSENSOR 审中-公开
标题翻译：旋转速率传感器
公开(公告)号：WO2002066928A1
公开(公告)日：2002-08-29
申请号：PCT/DE2002/000499
申请日：2002-02-13
申请人： ROBERT BOSCH GMBH , WILLIG, Rainer , THOMAE, Andreas , KUHLMANN, Burhard , HAUER, Joerg , GOMEZ, Udo-Martin , GOETZ, Siegbert , DOERING, Christian , FEHRENBACH, Michael , BAUER, Wolfram , BISCHOF, Udo , NEUL, Reinhard , FUNK, Karsten , LUTZ, Markus , WUCHER, Gerhard , FRANZ, Jochen
发明人： WILLIG, Rainer , THOMAE, Andreas , KUHLMANN, Burhard , HAUER, Joerg , GOMEZ, Udo-Martin , GOETZ, Siegbert , DOERING, Christian , FEHRENBACH, Michael , BAUER, Wolfram , BISCHOF, Udo , NEUL, Reinhard , FUNK, Karsten , LUTZ, Markus , WUCHER, Gerhard , FRANZ, Jochen
IPC分类号： G01C19/56
CPC分类号： G01C19/5747
摘要： Es wird ein Drehratensensor mit einem ersten und einem zweiten Coriolis-Elemente (100, 200) vorgeschlagen, die nebeneinander über eine Oberfläche (1) eines Substrats angeordnet sind. Die Coriolis-Elemente (100, 200) werden zu Schwingungen parallel zu einer ersten Achse angeregt. Durch eine Coriolis-Kraft werden die Coriolis-Elemente (100, 200) in einer zweiten Achse, die senkrecht zu der ersten Achse ist, ausgelenkt. Das erste und zweite Coriolis-Element (100,200) sind durch eine Feder (52) gekoppelt, die in der ersten und in der zweiten Achse weich ausgebildet ist. Es werden so die Frequenzen der Schwingungen in den beiden Achse für die gleich- und gegenphasige Schwingung unterschiedlich ausgestaltet.
摘要翻译：还提出了具有第一和第二科里奥利元件被并排地布置在衬底上的一个表面（1）（100，200）的偏航率传感器。科里奥利元件（100，200）被激励振动平行于第一轴线。由科里奥利力，科里奥利元件（100，200）中的第二轴垂直于所述第一轴线偏转。第一和第二科里奥利元件（100,200）是由被设计为在所述第一柔性弹簧（52）和在所述第二轴联接。有那么不同的设计在这两个轴的DC和反相位振荡，振荡的频率。

9. 发明申请

WO2006124303A1 MICROELECTROMECHANICAL RESONATOR STRUCTURE, AND METHOD OF DESIGNING, OPERATING AND USING SAME 审中-公开
标题翻译：微电子谐振器结构及其设计，操作和使用方法
公开(公告)号：WO2006124303A1
公开(公告)日：2006-11-23
申请号：PCT/US2006/017070
申请日：2006-05-03
申请人： ROBERT BOSCH GMBH , PARTRIDGE, Aaron , LUTZ, Markus
发明人： PARTRIDGE, Aaron , LUTZ, Markus
IPC分类号： H03H9/24 , H03H9/02
CPC分类号： H03H9/2431 , H03H9/02259 , H03H9/02338 , H03H9/02448 , H03H9/2405 , H03H2009/02354 , H03H2009/02496 , H03H2009/02503 , H03H2009/02511 , H03H2009/02527
摘要： A micromechanical resonator structure including a plurality of straight or substantially straight beam sections that are connected by curved or rounded sections. Each elongated beam section is connected to another elongated beam section at a distal end via the curved or rounded sections thereby forming a geometric shape having at least two elongated beam sections that are interconnected via curved or rounded sections (for example, a rounded triangle shape, rounded square or rectangle shape). The structure includes one or more nodal points or areas (i.e., portions of the resonator structure that are stationary, experience little movement, and/or are substantially stationary during oscillation of the resonator structure) in one or more portions or areas of the curved sections of the structure. The nodal points are suitable and/or preferable locations to anchor the resonator structure to the substrate. In operation, the resonator structure oscillates in a combined elongating (or breathing) mode and bending mode; that is, the beam sections (which oscillate or vibrate at the same frequency) exhibit an elongating-like (or breathing-like) motion and a bending-like motion.
摘要翻译：微机械谐振器结构包括通过弯曲或圆形部分连接的多个直的或基本上直的梁部分。每个细长梁部分经由弯曲或圆形部分在远端处连接到另一个细长梁部分，从而形成具有至少两个细长梁部分的几何形状，所述细长梁部分经由弯曲或圆形部分（例如，圆形三角形形状，圆形正方形或矩形）。该结构包括在弯曲部分的一个或多个部分或区域中的一个或多个节点或区域（即，谐振器结构的静止的部分，经历少量运动和/或在谐振器结构的振荡期间基本静止）的结构。节点是合适的和/或优选的位置，以将谐振器结构锚固到衬底。在操作中，谐振器结构以组合延长（或呼吸）模式和弯曲模式振荡; 也就是说，波束部分（以相同的频率振荡或振动）表现出伸长状（或呼吸状）运动和弯曲状运动。

10. 发明申请

WO2005081702A2 INTEGRATED GETTER AREA FOR WAFER LEVEL ENCAPSULATED MICROELECTROMECHANICAL SYSTEMS 审中-公开
标题翻译：用于水平放电的微电子系统的集成度
公开(公告)号：WO2005081702A2
公开(公告)日：2005-09-09
申请号：PCT/US2004/034658
申请日：2004-10-20
申请人： ROBERT BOSCH GMBH , LUTZ, Markus , PARTRIDGE, Aaron
发明人： LUTZ, Markus , PARTRIDGE, Aaron
IPC分类号： B81C1/00 , H01L21/00 , H01L29/84
CPC分类号： B81B7/0038 , B81C1/00269 , B81C1/00285 , H01L2224/48091 , H01L2924/00014
摘要： There are many inventions described and illustrated herein. In one aspect, present invention is directed to a thin film encapsulated MEMS, and technique of fabricating or manufacturing a thin film encapsulated MEMS including an integrated getter area arid/or an increased chamber volume, which causes little to no increase in overall dimension(s) from the perspective of the mechanical structure and chamber. The integrated getter area is disposed within the chamber and is capable of (i) "capturing" impurities, atoms and/or molecules that are out-gassed from surrounding materials and/or (ii) reducing and/or minimizing the adverse impact of such impurities, atoms and/or molecules (for example, reducing the probability of adding mass to a resonator which would thereby change the resonator's frequency). In this way, the thin film wafer level packaged MEMS of the present invention includes a relatively stable, controlled pressure environment within the chamber to provide, for example, a more stable predetermined, desired and/or selected mechanical damping of the mechanical structure.
摘要翻译：这里描述和说明了许多发明。一方面，本发明涉及薄膜封装的MEMS，以及制造或制造薄膜封装的MEMS的技术，其包括集成的吸气剂区域和/或增加的室容积，其总体尺寸几乎不增加）从机械结构和室的角度。集成的吸气剂区域设置在室内，并且能够（i）“捕获”从周围材料中排出的杂质，原子和/或分子和/或（ii）减少和/或最小化这样的不利影响杂质，原子和/或分子（例如，降低将谐振器增加质量的可能性，从而改变谐振器的频率）。以这种方式，本发明的薄膜晶片级封装MEMS包括室内相对稳定的受控压力环境，以提供例如机械结构的更稳定的预定，期望和/或选择的机械阻尼。

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