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    • 5. 发明专利
    • ELECTROPLATING METHOD
    • JPH06272078A
    • 1994-09-27
    • JP5901693
    • 1993-03-18
    • RIKEN KK
    • SHINADA MANABU
    • C25D5/12C25D5/44C25D7/04C25F1/00F02F5/00F16J9/26
    • PURPOSE:To provide the electroplating method capable of suppressing the generation of deformation and residual strains in a metallic material to be plated and forming a plating layer having a good adhesion property through an easy pretreatment. CONSTITUTION:This electroplating method includes a stage for degreasing a metallic surface made of aluminum or aluminum alloy by electrolytic washing, a stage for acidically activating the metallic surface rotating in the state of making friction contact with an anode body by electrolytic washing after the degreasing, a stage for forming an under coating layer by applying nickel plating to the metallic surface rotating in the state of making friction contact with the anode body after the acidic activation and a stage for forming a wear resistant outer layer on the under coating layer of the metallic surface. The metallic surface is clegreased and acidically activated and thereafter, the nickel plating liquid is electrodeposited thereon in the state of bringing the anode body into friction contact with the metallic surface under rotation and, therefore, the activation of the electrodeposited surface is accelerated and the oxide layer of the metallic surface is sufficiently removed. In addition, the nickel is strongly electrodeposited on the metallic surface and the under coating layer having high adhesive force is formed thereon.