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    • 4. 发明专利
    • METHOD AND DEVICE FOR GROWING CRYSTAL, AND GROUP III NITRIDE CRYSTAL
    • JP2001064097A
    • 2001-03-13
    • JP23720099
    • 1999-08-24
    • RICOH KK
    • SARAYAMA SHOJI
    • C30B29/38
    • PROBLEM TO BE SOLVED: To produce a group III nitride crystal, without using an expensive reactor and without making the crystal size small and whose crystal size is sufficiently large to be practically used in the production of a device such as a high performance light emitting diode or a LD. SOLUTION: The nitrogen pressure (pressure of a nitrogen raw material) in a first cylinder 110, which is provided in a first gas supplying apparatus 120 and in which gaseous nitrogen is filled, is controlled to be not less than the pressure (pressure of the nitrogen raw material) in a reactor 101, thereby making it possible to set the pressure of the nitrogen raw material in the reactor 101 to a desired value through pressure control mechanisms 107, 108 for gaseous nitrogen. Thus, when the pressure of the gaseous nitrogen being the nitrogen raw material is controlled under such a state that sufficient amounts of a group III metal and a flux (e.g. Na) are present, it becomes possible to continuously grow the group III nitride crystal (GaN crystal) and to grow the group III nitride crystal (GaN crystal) having a desired crystal size.
    • 5. 发明专利
    • SYSTEM AND METHOD FOR CRYSTAL GROWTH
    • JP2000012469A
    • 2000-01-14
    • JP18696398
    • 1998-06-17
    • RICOH KK
    • SARAYAMA SHOJI
    • C30B25/14C30B29/40H01L21/205H01L33/32H01S5/00H01S5/30H01S5/323
    • PROBLEM TO BE SOLVED: To provide a system and a method for crystal growth of good quality GaN semiconductor crystalline film with low-cost and moreover with simple constitution and a small number of nitrogen holes. SOLUTION: A crystal growth system 20 has a substrate 27 between a support 28a of a susceptor holder 28 and a susceptor 25. While power is supplied to a coil 33 for induction heating to generate eddy current in the susceptor 25 and the substrate 27 is heated to a predetermined high temperature, a material gas is supplied from a gas supply tube 29, that is attached to a flange 22 at the bottom side of a reaction chamber 21 and has an ejection port located under the exact center of the substrate 27. A compound film 32 containing nitrogen is attached to the peripheral surface of the susceptor holder 28, the outer surface of the support 28a, and the end portion of a gas feeding tube 31 conically opened under the substrate 27. This compound film 32 is also heated to a temperature higher than the decomposition temperature. The compound film 32 containing nitrogen is decomposed, and the partial pressure of nitrogen near the substrate 27 is increased. Therefore, good quality GaN semiconductor crystalline film can be deposited on the surface of the substrate 27, even though the portion of nitrogen material in the material gas is small.
    • 10. 发明专利
    • SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
    • JPH11340222A
    • 1999-12-10
    • JP14267298
    • 1998-05-25
    • RICOH KK
    • SARAYAMA SHOJIYAMAGUCHI KIYOSHI
    • H01L21/316H01L33/08H01L33/44H01L33/00
    • PROBLEM TO BE SOLVED: To disassemble a semiconductor device without causing cracks nor film peeling in semiconductor elements by performing plasma treatment on a substrate in a vacuum vessel maintained in an atmosphere composed mainly of a reducing gas before a film in contact with the surface of the substrate is formed. SOLUTION: In a method for manufacturing semiconductor device, after edge-emission type light-emitting diode arrays 2-6 are formed on a substrate 1 as semiconductor elements, the substrate 1 carrying the semiconductor elements 2-6 is divided into a plurality of chip-shaped semiconductor devices. In this method, plasma treatment is performed on the substrate 1 in a vacuum vessel maintained in an atmosphere composed mainly of a reducing gas before the forming process of an insulating film 8 which is formed as the outermost film of the films which are in contact with the surface of the substrate 1. Therefore, good wafer cutting can be made without causing the cracking and peeling of the insulating film 8. In addition, the number of chips obtained from the same area can be increased, because the interval between each chip can be reduced.