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    • 2. 发明申请
    • MODULAR SOLID-STATE MILLIMETER WAVE (MMW) RF POWER SOURCE
    • 模块化固态毫米波(MMW)射频电源
    • WO2010019355A1
    • 2010-02-18
    • PCT/US2009/051292
    • 2009-07-21
    • RAYTHEON COMPANYLOWELL, Reid, F.BROWN, KennethGRITTERS, Darin, M.BROWN, Andrew, K.SOTELO, Michael, J.DOLASH, William, E.FEENSTRA, Travis, B.
    • LOWELL, Reid, F.BROWN, KennethGRITTERS, Darin, M.BROWN, Andrew, K.SOTELO, Michael, J.DOLASH, William, E.FEENSTRA, Travis, B.
    • H01Q3/46H01P5/12
    • H01Q3/46H01P5/12H01Q21/0025H01Q21/0075H01Q21/064H03F3/602H03F2200/321
    • A modular solid-state MMW power source based on a topology of the lens array amplifier provides both the flexibility to scale output power and effective thermal management. The modular power source includes a single submodule that uses one or more power dividers and one or more solid-state amplification stages to divide and amplify an RF input signal into R amplified RF signals. The submodule is mounted (suitably in the X-Y plane) on the surface of a heat sink, suitably coupled to a cold backplane, to remove heat. R 1 :N low loss power dividers route the amplified RF signals to R*N radiating elements. Each of the 1 :N power dividers suitably reside in the X-Z plane and are stacked in the Y direction to provide a planar output of the R*N radiating elements in the Y-Z plane. Placement of the amplifier chips on the single submodule decouples the number of amplifier chips, hence output power, from the number of radiating elements. Placement of the amplifier chips away from the radiating face provides a short path with large thermal cross-section through the heat sink to the backplane to remove heat. The topology can produce high output power combined with a high antenna gain to produce large power-aperture products previously only achievable with a Gyrotron. As amplifier chips become more powerful, the topology can be adapted to use fewer chips.
    • 基于透镜阵列放大器的拓扑结构的模块化固态MMW电源提供了扩展输出功率和有效热管理的灵活性。 模块化电源包括单个子模块,其使用一个或多个功率分配器和一个或多个固态放大级来将RF输入信号分频和放大为R个放大的RF信号。 子模块安装在散热器的表面上(适当地在X-Y平面中),适当地耦合到冷底板以去除热量。 R 1:N低损耗功率分配器将放大的RF信号路由到R * N个辐射元件。 1:N功率分配器中的每一个适当地驻留在X-Z平面中并且在Y方向上堆叠以提供Y-Z平面中的R * N个辐射元件的平面输出。 放大器芯片在单个子模块上的放置将放大器芯片的数量(因此输出功率)与辐射元件的数量进行去耦。 放大器芯片远离辐射面的放置提供了一个短路径,通过散热器到背板具有大的热横截面以去除热量。 拓扑结构可以产生高输出功率和高天线增益,从而产生以前只能用Gyrotron实现的大功率孔径产品。 随着放大器芯片变得越来越强大,拓扑可以适应于使用较少的芯片。
    • 4. 发明申请
    • MILLIMETER-WAVE AREA-PROTECTION SYSTEM AND METHOD
    • 毫米波防区系统及方法
    • WO2005088573A1
    • 2005-09-22
    • PCT/US2005/001466
    • 2005-01-14
    • RAYTHEON COMPANY
    • GALLIVAN, James, R.BROWN, Kenneth, W.STARBUCK, Philip, D.BROWN, Andrew, K.
    • G08B15/00
    • G08B15/00F41H13/0068
    • An area-protection system (102) uses an active-array antenna (320) to generate a high-power millimeter-wave wavefront (104) to deter an intruder within a protected area (106). One or more reflectors (110) may be positioned within the protected area to help retain energy of the wavefront (104) within the area. The area-protection system (102) may include an intrusion-detection subsystem (208) to detect presence of the intruder within the protected area and to generate a detection signal (216). The active-array antenna (320) may generate the high-power millimeter-wave wavefront (304) in response to the detection signal. In some embodiments, the intrusion-detection subsystem may detect the presence of a tag (220) worn by the intruder, and may instruct the array antenna to refrain from generating the wavefront when tag is authenticated. In some embodiments, an illuminator may be used detect intruder movement based on return signals. In some embodiments, the array antenna includes semiconductor wafers (406) arranged together on a substantially flat surface.
    • 区域保护系统(102)使用有源阵列天线(320)来产生高功率毫米波波前(104)以阻止保护区域(106)内的入侵者。 一个或多个反射器(110)可以被定位在保护区域内,以帮助保持该区域内的波前(104)的能量。 区域保护系统(102)可以包括入侵检测子系统(208),用于检测入侵者在受保护区域内的存在并产生检测信号(216)。 有源阵列天线(320)可以响应于检测信号而产生高功率毫米波波前(304)。 在一些实施例中,入侵检测子系统可以检测由入侵者佩戴的标签(220)的存在,并且可以在标签被认证时指示阵列天线避免生成波阵面。 在一些实施例中,可以使用照明器基于返回信号检测入侵者移动。 在一些实施例中,阵列天线包括一起布置在基本平坦的表面上的半导体晶片(406)。