专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2021030425A1 SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH 审中-公开
公开(公告)号：WO2021030425A1
公开(公告)日：2021-02-18
申请号：PCT/US2020/045908
申请日：2020-08-12
申请人： RAYTHEON COMPANY
发明人： PEVZNER, Mikhail , BENEDICT, James E. , SOUTHWORTH, Andrew R. , SIKINA, Thomas V. , WILDER, Kevin , SOUZA, Matthew , TORBERG, Aaron Michael
IPC分类号： H05K3/40 , B21F11/00 , B26D3/00
摘要： An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (RGB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the RGB, solder an end of the segment of copper wire to a signal trace of the RGB, and flush cut an opposite end of the segment of the copper wire to a surface of the RGB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

2. 发明申请

WO2021091824A1 METHOD FOR FORMING CHANNELS IN PRINTED CIRCUIT BOARDS BY STACKING SLOTTED LAYERS 审中-公开
公开(公告)号：WO2021091824A1
公开(公告)日：2021-05-14
申请号：PCT/US2020/058538
申请日：2020-11-02
申请人： RAYTHEON COMPANY
发明人： PEVZNER, Mikhail , BENINATI, Gregory G. , BENEDICT, James E. , SOUTHWORTH, Andrew R.
IPC分类号： H05K1/02 , H05K3/46
摘要： A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.

3. 发明申请

WO2020236324A1 THICK FILM RESISTORS HAVING CUSTOMIZABLE RESISTANCES AND METHODS OF MANUFACTURE 审中-公开
公开(公告)号：WO2020236324A1
公开(公告)日：2020-11-26
申请号：PCT/US2020/026714
申请日：2020-04-03
申请人： RAYTHEON COMPANY , UNIVERSITY OF MASSACHUSETTS
发明人： KLEK, Erika C. , HERNDON, Mary K. , SIKINA, Thomas V. , BENEDICT, James E. , SOUTHWORTH, Andrew R. , WILDER, Kevin M. , RANASINGHA, Oshadha K. , AKYURTLU, Alkim
IPC分类号： H01C17/065 , H01C17/30 , H01C17/24 , H01C7/00
摘要： A method includes blending (302) a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink (210). The method also includes printing (304) the modified carbon-based ink onto a structure (104, 106, 108). The method further includes curing (306) the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250 C. In addition, the method includes processing (308) the cured printed modified carbon-based ink to form a thick film resistor (102). An amount of the dielectric material blended with the carbon-based ink does not exceed about 15% by weight of the modified carbon-based ink. The modified carbon-based ink has a resistivity that is at least double a resistivity of the carbon-based ink. The thick film resistor may be configured to handle up to about 200 mA of current without fusing and/or handle up to about 1.0 W of power without fusing.

4. 发明申请

WO2019094373A3 SPIRAL ANTENNA AND RELATED FABRICATION TECHNIQUES 审中-公开
公开(公告)号：WO2019094373A3
公开(公告)日：2019-05-16
申请号：PCT/US2018/059410
申请日：2018-11-06
申请人： RAYTHEON COMPANY
发明人： ADAMS, Peter J. , SIKINA, Thomas V. , HAVEN, John P. , BENEDICT, James E.
IPC分类号： H05K3/40 , H05K3/42 , H01P5/02 , H01P1/04 , H01Q9/27 , H05K1/02
摘要： The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.

5. 发明申请

WO2019204463A1 THERMALLY-ENHANCED AND DEPLOYABLE STRUCTURES 审中-公开
公开(公告)号：WO2019204463A1
公开(公告)日：2019-10-24
申请号：PCT/US2019/027899
申请日：2019-04-17
申请人： RAYTHEON COMPANY , THERMAVANT TECHNOLOGIES, LLC
发明人： DUONG, Tuan L. , LEEDS, Adam D. , BENEDICT, James E. , BOSWELL, Joseph A. , POUNDS, Daniel A.
IPC分类号： B64G1/50
摘要： An apparatus includes a structure (100) configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes a lid (104) and a body (102). The structure also includes (i) multiple inline and interconnected thermomechanical regions (106-112) and (ii) one or more oscillating heat pipes (114a-114b) embedded in at least some of the thermomechanical regions. Different portions of at least one of the lid and the body form the thermomechanical regions. The one or more oscillating heat pipes are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. Each of the one or more oscillating heat pipes includes at least one channel in the structure.

6. 发明申请

WO2019204322A1 THERMALLY-ENHANCED AND DEPLOYABLE STRUCTURES 审中-公开
公开(公告)号：WO2019204322A1
公开(公告)日：2019-10-24
申请号：PCT/US2019/027700
申请日：2019-04-16
申请人： RAYTHEON COMPANY
发明人： DUONG, Tuan L. , LEEDS, Adam D. , BENEDICT, James E.
IPC分类号： B64G1/50
摘要： A system includes a flight vehicle (502, 602, 700) and one or more deployable radiators (504, 604, 702). Each deployable radiator includes a structure (100, 300) configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes (i) multiple inline and interconnected thermomechanical regions (102-108, 306-312) and (ii) one or more thermal energy transfer devices (202, 314a-314b) embedded in at least some of the thermomechanical regions. The one or more thermal energy transfer devices are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. The thermomechanical regions may include one or more heat input regions (102, 306) configured to receive the thermal energy, one or more heat rejection regions (108, 312) configured to reject the thermal energy into the external environment, and one or more morphable regions (104, 308) including the one or more shape-memory materials and configured to change shape.

7. 发明申请

WO2019168992A1 SNAP-RF INTERCONNECTIONS 审中-公开
公开(公告)号：WO2019168992A1
公开(公告)日：2019-09-06
申请号：PCT/US2019/019847
申请日：2019-02-27
申请人： RAYTHEON COMPANY
发明人： SIKINA, Thomas V. , BENEDICT, James E. , HAVEN, John P. , SOUTHWORTH, Andrew R. , AZADZOI, Semira M.
IPC分类号： H05K1/02 , H05K3/40 , H01R13/62 , H01P11/00 , H05K1/14
摘要： A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.

8. 发明申请

WO2023044410A1 PHASE CHANGE MATERIAL (PCM)-BASED CONDUCTIVE THERMAL ACTUATOR SWITCH 审中-公开
公开(公告)号：WO2023044410A1
公开(公告)日：2023-03-23
申请号：PCT/US2022/076532
申请日：2022-09-16
申请人： RAYTHEON COMPANY
发明人： PITTS, Andrew J. , BENEDICT, James E.
IPC分类号： F28F13/00
摘要： An apparatus includes multiple thermal actuator switches (100, 500, 700, 902-904, 1002-1004) configured to control a transfer of thermal energy. The thermal actuator switches are arranged in a stacked configuration. Each switch includes first and second plates (102-104, 502-504, 702-704) and a piston (108-110, 508-510, 708-710) movable between the plates. Each switch also includes a phase change material (112, 512, 712) configured to (i) expand to move a surface of the piston into a first position and (ii) contract to allow the surface of the piston to move into a second position. The surface of the piston thermally contacts the first plate and increases thermal energy transfer between the plates when in one of the first and second positions. The surface of the piston is spaced apart from the first plate and decreases thermal energy transfer between the plates when in another of the first and second positions. Different ones of the switches include different phase change materials that expand or contract at different temperatures.

9. 发明申请

WO2021201969A1 PROCESS FOR REMOVING BOND FILM FROM CAVITIES IN PRINTED CIRCUIT BOARDS 审中-公开
公开(公告)号：WO2021201969A1
公开(公告)日：2021-10-07
申请号：PCT/US2021/016294
申请日：2021-02-03
申请人： RAYTHEON COMPANY
发明人： BENEDICT, James E. , DANELLO, Paul A. , PEVZNER, Mikhail , SIKINA, Thomas V. , SOUTHWORTH, Andrew R.
IPC分类号： H05K3/40 , H01L2224/11602 , H01L2224/45147 , H01L2224/73207 , H01L24/11 , H01L24/45 , H01L24/73 , H05K2201/10287 , H05K2203/0257 , H05K2203/166 , H05K3/26 , H05K3/4007 , H05K3/4046 , H05K3/465 , H05K3/4679
摘要： A process of fabricating an electromagnetic circuit includes providing a first sheet of dielectric material including a top surface having at least one conductive trace and depositing a solder bump on the at least one conductive trace. The process further includes applying a second sheet of dielectric material to the first sheet of dielectric material with bond film sandwiched in between, the second sheet of dielectric material having a through-hole providing access to the solder bump. The process further includes bonding the first and second dielectric materials to one another and removing bond film resin from the solder bump. The process further includes machining the solder bump by the drilling or milling process to achieve a desired amount of solder in the solder bump.

10. 发明申请

WO2019094373A2 SPIRAL ANTENNA AND RELATED FABRICATION TECHNIQUES 审中-公开
公开(公告)号：WO2019094373A2
公开(公告)日：2019-05-16
申请号：PCT/US2018/059410
申请日：2018-11-06
申请人： RAYTHEON COMPANY
发明人： ADAMS, Peter J. , SIKINA, Thomas V. , HAVEN, John P. , BENEDICT, James E.
IPC分类号： H05K3/40 , H05K3/42 , H01P5/02 , H01P1/04 , H01Q9/27 , H05K1/02
摘要： The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式